Teach In Mode Procedure; External Sensor With Control Function "Control Mode; Lock Mode; Switching Temperature Conversion - Weller WHA3000PN Operating Instructions Manual

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3.2 Teach In Mode procedure

During the sequence of an automatic temperature-time profile, it is possible to continue switching
the process stages 1-3 manually by pressing the Control Key "TIME" / "PREHEAT" (5). If the
external sensor is suitably positioned on the assembly or component, its temperature can be
monitored during the entire process sequence and can be continued to be switched when the
desired specified temperatures (stage 1-3) have been reached. The times determined in this manner
are shown after the soldering or desoldering process in the display (1) and can be saved.

3.3 External sensor with control function "CONTROL MODE"

The temperature of the external sensor is controlled in this operating mode. The external sensor
records the actual value (control variable) for the temperature control. The setting for the setpoint
value at the unit must therefore be adapted to the measured temperature (actual value) of the
external sensor. The actual value of the external sensor is shown in the display (1).
External sensor active in "CONTROL MODE"
TEMP
AIR
PREHEAT
250 °C
25 l
OFF
A basic prerequisite for faultless application is direct contact of the sensor on the assembly or
component.

4. Lock Mode

The device can be locked by inserting and removing a coded plug in socket (20). The current
soldering parameters cannot be further changed. The WHA 3000P can only be operated using the
START/STOP (10) and VAC (11) Control Keys.

5. Switching Temperature Conversion

By pressing the Control Key "Temp" (7) when switching on the unit (4), you can toggle between the
operating modes "°C" and "°F". The following appears briefly in the display (1):
°C
°F
or

6. RS232 interface

Using additional software, the device can be operated completely via the RS232 interface (21).

7. Work instructions

The hot air nozzle is designed such that the vacuum plate lies flat on the component. The vacuum
plate is also used for the transfer of heat. When the vacuum is enabled, the component can be lifted
after the solder has reflowed. Here it is important to pre-heat the vacuum plate to operating
temperature prior to de-soldering. As an option, it is possible to use a vacuum cup in place of the
vacuum plate.
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