Table Of Contents - Sony HBD-E385 Service Manual

Blu-ray disc/dvd receiver
Table of Contents

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HBD-E385/E390/T39
1.
2.
2-1. Disassembly Flow ........................................................... 12
2-2. How To Bend FFC .......................................................... 13
2-3. Left Panel, Right Panel ................................................... 14
2-4. Loading Panel ................................................................. 14
2-5. Top Panel, Front Panel Assy ........................................... 15
2-7. BD Drive (BPX-7) .......................................................... 17
2-8. MB148 Board ................................................................. 17
2-9. Switching Regulator (SWR1) ......................................... 18
2-10. AMP Board ..................................................................... 18
Wire (Flat Type) .............................................................. 19
3.
............................................................ 20
4.
5.
5-1. Block Diagram - SERVO Section - ................................ 29
5-3. Block Diagram - MAIN Section - ................................... 31
5-4. Block Diagram - AMP Section - ..................................... 32
5-19. Schematic Diagram - AMP Board (1/3) - ....................... 48
5-20. Schematic Diagram - AMP Board (2/3) - ....................... 49
5-21. Schematic Diagram - AMP Board (3/3) - ....................... 50
5-23. Schematic Diagram - PANEL Section - .......................... 52
This appliance is classified as a
CLASS 3R LASER product.
Visible and invisible laser radiation
is emitted when the laser protective
housing is opened, so be sure to
avoid direct eye exposure.
This marking is located on the laser
protective housing inside the
enclosure.
4

TABLE OF CONTENTS

.............................................
......................................... 28
This appliance is classified as a
CLASS 1 LASER product. This
marking is located on the rear
exterior.
6.
5
6-1. Panel Section ................................................................... 79
6-2. Front Panel Section ......................................................... 80
6-3. Chassis Bottom Section .................................................. 81
6-4. Chassis Section ............................................................... 82
6-5. BD Drive Section (BPX-7) ............................................. 83
7.
NOTES ON CHIP COMPONENT REPLACEMENT
Never reuse a disconnected chip component.
Notice that the minus side of a tantalum capacitor may be
damaged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
Keep the temperature of soldering iron around 270 °C during
repairing.
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
Be careful not to apply force on the conductor when soldering
or unsoldering.
.............................. 84

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Hbd-e390Hbd-t39Hbd-t390

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