jbc NAU Instruction Manual page 9

Nano control unit
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3
4
Manual Solder Paste
Dispenser*
Ref. DPM-B
Pad Cleaning
Clean the pads with the desoldering tool
DS360*.
For this operation JBCs desoldering station* is
needed.
Solder Paste Dispensing
Apply the solder paste amount needed to
solder the new chip component.
The use of JBC´s DPM Manual Solder Paste
Dispenser* is recommended.
* not included, sold separately
9

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