Sony NV-U74 Service Manual page 19

THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
For Printed Wiring Boards.
Note:
• X : Parts extracted from the component side.
• Y : parts extracted from the conductor side.
• : internal component.
f
• : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from
(Conductor Side) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Component Side) the parts face are indicated.
Caution:
Pattern face side: Parts on the pattern face side seen from
(SIDE B) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(SIDE A) the parts face are indicated.
• MAIN board is multi-layer printed board.
However, the patterns of intermediate-layer have not
been included in diagram.
* Replacing of IC3504 on the MAIN board used in this
set requires a special tools
• Indication of transistor.
C
Q
These are omitted.
B E
• Lead layouts
Lead layout of conventional IC CSP (Chip Size Package)
Note: When the MAIN board is exchanged, it is necessary to
do some works. Confi rm the servicing notes "NOTE OF
REPLACING THE MAIN BOARD" (page 3).
NV-U74
For Schematic Diagrams.
Note:
• All capacitors are in µF unless otherwise noted. (p: pF) 50
WV or less are not indicated except for electrolytics and
tantalums.
• All resistors are in Ω and 1/4 W or less unless otherwise
specifi ed.
• f : internal component.
• C : panel designation.
• A : B+ Line.
• Power voltage is dc 3.7V and fed with regulated dc power
supply from battery connector (CN3001).
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark: TEST MODE (COLOR BAR)
• Voltages are taken with a VOM (Input impedance 10
MW).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F : AUDIO
E : VIDEO
j
: NAVI
N : USB
P : MEMORY STICK
* Replacing of IC3504 on the MAIN board used in this
set requires a special tools
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
surface
from that of conventional IC.
Note: When the MAIN board is exchanged, it is necessary to
do some works. Confi rm the servicing notes "NOTE OF
REPLACING THE MAIN BOARD" (page 3).
• Waveforms
– MAIN Board –
X1001
1.1 Vp-p
76.9 ns
500 mV/DIV, 20 ns/DIV
X1002
1 Vp-p
30.5 µs
500 mV/DIV, 10 µs/DIV
X0102
0.5 Vp-p
30.5 µs
200 mV/DIV, 10 µs/DIV
X0101
0.7 Vp-p
61.1 ns
200 mV/DIV, 20 ns/DIV
IC2501 (XO)
3.4 Vp-p
83.3 ns
2 V/DIV, 20 ns/DIV
IC3501 (XTLOUT)
1.8 Vp-p
40.7 ns
1 V/DIV, 20 ns/DIV
19 19
IC3501 (BITCLK)
4.1 Vp-p
81 ns
2 V/DIV, 20 ns/DIV
NV-U74