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PG-TO252 DPAK
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Infineon PG-TO252 DPAK Manual
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Contents
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Table of Contents
Table of Contents
Acronyms and Abbreviations
1 Package Description
TO SMD Package Type
TO THD Package Type
HSOG Package Type
Package Features and General Handling Guidelines
2 Printed Circuit Board
Routing
Pad Design
Via-In-Pad Design
3 Mounting of Surface-Mount Devices
Solder Paste Stencil
Solder Paste
Component Placement of SMD
Reflow Soldering
Wave Soldering of SMD
4 Mounting of Through-Hole Devices
Pre-Mounting Processes and Mounting Materials
Component Placement of THD
Heat Sink Mounting
Soldering of THD
Alternative Mounting Methods
5 Cleaning
6 Inspection
Optical Solder Joint Inspection
X-Ray Solder Joint Inspection
7 Rework
8 References
Revision History
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Quick Links
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To Smd Package Type
2
Solder Paste Stencil
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Recommendations for board assembly of
Infineon transistor outline type packages
Additional information
Please read the Important Notice and Warnings at the end of this document
Revision 4.0
www.infineon.com
page 1 of 31
2021-10-11
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This manual is also suitable for:
Pg-to263 d2pak
Pg-to220
Pg-to220 fullpak
Pg-to247
Pg-to247 long lead
Pg-to247 plus
...
Show all
Pg-to251 ipak
Pg-to262 i2pak
Pg-to273 super 220
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