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Related Manuals for Infineon PG-TO252 DPAK
Summary of Contents for Infineon PG-TO252 DPAK
- Page 1 Recommendations for board assembly of Infineon transistor outline type packages Additional information Please read the Important Notice and Warnings at the end of this document Revision 4.0 www.infineon.com page 1 of 31 2021-10-11...
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Page 2: Table Of Contents
Recommendations for board assembly of Infineon transistor outline type packages Table of contents Table of contents Table of contents ..........................2 Acronyms and abbreviations ......................3 Package description ....................... 4 TO SMD package type..........................4 TO THD package type ..........................5 HSOG package type .......................... -
Page 3: Acronyms And Abbreviations
Recommendations for board assembly of Infineon transistor outline type packages Acronyms and abbreviations Acronyms and abbreviations ………………………………………… automated optical inspection ………………………………………… automated X-ray inspection CSAM ………………………………………… c-scanning acoustic microscopy ………………………………………… dual small outline package ………………………………………… electrostatic discharge HDSOP ………………………………………… heatspreader dual small outline package HSOG …………………………………………... -
Page 4: Package Description
TO SMD package type Infineon TO SMD packages are available as DPAK and D2PAK with with a mold body size of approx. 6 to 9 mm. Infineon designations are following the standardized names TO-252 and TO-263 as given by JEDEC. -
Page 5: To Thd Package Type
(“Plus” version). Some packages feature leads with extended or reduced length (“Long lead” and “Short lead” versions). Infineon designations are following the standardized names from TO-220 to TO-262 as given by JEDEC. -
Page 6: Hsog Package Type
For further information about component handling, please refer to the General Recommendations for Board Assembly of Infineon Packages document that is available on the Infineon web page [1]. Please also feel free to contact your local sales, application, or quality engineer. - Page 7 Recommendations for board assembly of Infineon transistor outline type packages Package description Figure 4 Schematic showing the inner setup of a TO SMD package. Figure 5 Schematic showing the inner setup of a TO THT package. Thermal performance The overall thermal performance of a package with a heat sink is characterized by a junction-to-ambient thermal resistance R .
- Page 8 For further information about thermal performance, please refer to the Thermal performance of surface mount semiconductor packages document that is available on the Infineon web page [2]. Please also feel free to contact your local sales, application, or quality engineer.
- Page 9 Termination plating Infineon TO SMD and HSOG packages with gullwing leads feature a matte tin (Sn) surface finish that is applied to the base metal by a post-mold process. The solder connection is then made to the underlaying copper or nickel.
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Page 10: Printed Circuit Board
Recommendations for board assembly of Infineon transistor outline type packages Printed circuit board Printed circuit board This section addresses specifically the surface-mount TO SMD and HSOG packages. Routing Printed circuit board design and construction are key factors for achieving solder joints with high reliability. -
Page 11: Via-In-Pad Design
For further information about PCB pad design, please refer to the General Recommendations for Board Assembly of Infineon Packages document that is available on the Infineon web page [1]. Please also feel free to contact your local sales, application, or quality engineer. - Page 12 For further information about vias in pad, please refer to the General Recommendations for Board Assembly of Infineon Packages document that is available on the Infineon web page [1]. Please also feel free to contact your local sales, application, or quality engineer.
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Page 13: Mounting Of Surface-Mount Devices
For further information about solder stencil design, please refer to the General Recommendations for Board Assembly of Infineon Packages document that is available on the Infineon web page [1]. Please also feel free to contact your local sales, application, or quality engineer. -
Page 14: Component Placement Of Smd
For further information about component placement, please refer to the General Recommendations for Board Assembly of Infineon Packages document that is available on the Infineon web page [1]. Please also feel free to contact your local sales, application, or quality engineer. -
Page 15: Wave Soldering Of Smd
For further information about reflow soldering, please refer to the General Recommendations for Board Assembly of Infineon Packages document that is available on the Infineon web page [1]. Please also feel free to contact your local sales, application, or quality engineer. -
Page 16: Mounting Of Through-Hole Devices
Recommendations for board assembly of Infineon transistor outline type packages Mounting of through-hole devices Mounting of through-hole devices The following factors have to be taken into account to achieve the best quality assembly for a given application: Insulating material (e.g. washers, spacers) ... - Page 17 Recommendations for board assembly of Infineon transistor outline type packages Mounting of through-hole devices Figure 9 Lead bending for mounting hole offset compensation (left) and heatsink to lead arrangement for compensation of relative movement (right). When bending the leads it is very important to comply with the following guidelines:...
- Page 18 Recommendations for board assembly of Infineon transistor outline type packages Mounting of through-hole devices Figure 10 Lead clamping, forming, and cutting tool (left) and examples of correct and incorrect lead clamping and bending of THD packages (right). Figure 11 Parameters for recommended minimum clamping distance and radius for lead bending.
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Page 19: Component Placement Of Thd
Recommendations for board assembly of Infineon transistor outline type packages Mounting of through-hole devices Component placement of THD THDs are inserted either with special automatic equipment or manually. During this insertion, special care has to be taken that excessive deformation or violent bending is avoided. The diameter of the drill holes in the PCB has to be appropriate for the tolerances of component leads, drill hole position placement accuracy, and properties of the solder alloy used. - Page 20 Recommendations for board assembly of Infineon transistor outline type packages Mounting of through-hole devices Heat sink screw mounting Screw mounting is a traditional assembly method using a screw, nut and washer, following these guidelines: Self-tapping screws should not be used.
- Page 21 Recommendations for board assembly of Infineon transistor outline type packages Mounting of through-hole devices resistance. Hence, an appropriate range of mounting torque values must be used to ensure minimal thermal resistance. This prevents package destruction or changes in thermal and electrical device characteristics.
- Page 22 Recommendations for board assembly of Infineon transistor outline type packages Mounting of through-hole devices Figure 16 Effect of torque on the R value between package and heat sink. Double sided heat sink mounting Double-sided heat sink mounting is not recommended. In case of unsuitable mechanical heat sink properties,...
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Page 23: Soldering Of Thd
Recommendations for board assembly of Infineon transistor outline type packages Mounting of through-hole devices Figure 18 Schematic drawing of TO247 package with clip mounting. Soldering of THD THDs are designed for wave soldering and not for reflow soldering. As the number of THDs on each board has been decreasing in some applications wave soldering, however, becomes less cost effective. -
Page 24: Alternative Mounting Methods
Recommendations for board assembly of Infineon transistor outline type packages Mounting of through-hole devices and deflectors for the PCB or/and by creating a small wave shape in the machine by using special wave-guiding tubes or covers. Alternative mounting methods Further techniques beside the previously described wave and reflow soldering methods might be used in special applications. -
Page 25: Cleaning
Recommendations for board assembly of Infineon transistor outline type packages Cleaning Cleaning After the soldering process, some flux residues may remain on the board, especially near the solder joints. Generally, cleaning beneath a SMD component is difficult due to the small gap between the component body and the PCB. -
Page 26: Inspection
Recommendations for board assembly of Infineon transistor outline type packages Inspection Inspection Optical solder joint inspection Irrespective of the specific geometry of a TO SMD gullwing lead, the solder joint is generally considered to be of good quality when the heel region is wetted up to a certain height and additionally the sidewall is sufficiently covered by solder. -
Page 27: X-Ray Solder Joint Inspection
Recommendations for board assembly of Infineon transistor outline type packages Inspection X-ray solder joint inspection Automated X-ray inspection (AXI) systems are appropriate for efficient inline control of component parts that cannot be inspected properly by optical systems (such as exposed pads). AXI systems are available as 2D and 3D solutions. -
Page 28: Rework
Infineon. The component shall be returned in a proper condition according to the original package outlines. In some special cases such as solder joint inspection Infineon may request that the PCB or part of the PCB with the component still attached should be sent to Infineon. -
Page 29: References
References References Infineon: Packages. https://www.infineon.com/packages. Infineon: Thermal performance of surface mount semiconductor packages. AN_201708_PL52_023, V 1.0, 2018-03-07. https://www.infineon.com. International Electrotechnical Commission: IEC 60068-2-58. Environmental testing – Part 2-58: Tests – Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD). -
Page 30: Revision History
Recommendations for board assembly of Infineon transistor outline type packages Revision history Revision history Page or reference Major changes since the last revision Entire document Transfer to new template including update of document structure. Additional information 30 of 31 Revision 4.0... - Page 31 Do you have a question about this Except as otherwise explicitly approved by Infineon information given in this application note. Technologies in a written document signed by...