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Introduction
1
Bill of Materials
Trademarks
BoosterPack, LaunchPad are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
1
Introduction
The SPI to CAN FD SBC + LIN BoosterPack features the TCAN4550-Q1 CAN FD controller with
integrated transceiver providing microcontrollers without an integrated CAN FD controller, or those
needing additional channels, access to CAN FD applications through a SPI interface. LIN applications can
also be developed using the TLIN2029-Q1 fault protected LIN transceiver and the MCU UART port
making this BoosterPack an ideal starting point for any CAN FD or LIN system.
This user's guide describes features of the SPI to CAN FD SBC + LIN BoosterPack, explaining the board
hardware details, functions and locations of jumpers and connectors.
1.1
Features
•
Operates from a batter voltage input V
– Polarity protected and EMC filtered to create V
•
TCAN4550-Q1 CAN FD controller with integrated transceiver
– Supports Classical and CAN FD applications
– SPI interface
– Crystal oscillator (40 MHz)
– Reset from push-button switch, MCU GPIO pin, or linked to LaunchPad™ global reset
– Sleep (low power) mode
– WAKE from push-button switch or CAN bus Wake Up Pattern (WUP)
– V
5-V LDO output
CCOUT
•
TLIN2029-Q1 Fault protected LIN transceiver
– Supports Master or Slave mode configurations
– MCU UART Interface
•
TPS7B7702-Q1 Automotive dual-channel LDO
– 3.3-V and 5-V supply rails
– Can supply both the BoosterPack and LaunchPad
– Enable linked to TCAN4550 Inhibit (INH) pin or pulled high
•
Common DB9 connector for Supply Voltage, CAN FD, and LIN bus signals
– Additional header for easy monitoring of bus signals
•
Wire terminal for LIN bus signals
•
CAN bus termination with disconnect headers
•
Common-mode choke (bypassed with 0-Ω resistors by default)
•
Status LEDs
2
SPI to CAN FD SBC + LIN Transceiver BoosterPack User's Guide
.............................................................................................................
(6 V to 24 V)
BAT
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SLLU216 – July 2019
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