Hardware Design - Ebyte EA01-S User Manual

Chengdu Ebyte Electronic Technology Co., Ltd
AT command
ATD*98\r\n
+++
(1) The module works in AT command mode by default. In AT command mode, sending ATD*98\r\n or ATD*99\r\n will
switch to transparent transmission mode.
(2) <+++>: In transparent transmission mode, the last three bytes of user data are "+++", or three bytes "+++" are sent
after user data transmission is completed, the transparent transmission mode will end.
Finally, if you need to enter deep sleep mode after data transmission, use "+++" to exit the transmission mode and enter
the AT command mode, and use AT+WORKLOCK=0 to enter deep sleep. Next time you need to send data, use the AT
command to wake the module from deep sleep. After the power-on process is completed, use the AT+SOCKONOFF
command to open the TCP/UDP socket0 to enter the transmission mode for data transmission. If you do not need to
enter deep sleep, no other operations will be performed, and it will always work in transmission mode for real-time data
sending and receiving.

6 Hardware design

It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as

possible and the module needs to be reliably grounded;
Please pay attention to the correct connection of the positive and negative poles of the power supply,

reverse connection may cause permanent damage to the module;
Please check the power supply to ensure that between the recommended supply voltage, if exceeding the

maximum, the module will be permanently damaged;
Please check the stability of the power supply. Voltage can not fluctuate greatly and frequently;

When designing the power supply circuit for the module, it is often recommended to reserve more than

30% of the margin, so the whole machine is beneficial for long-term stable operation;
The module should be as far away as possible from the power supply, transformers, high-frequency wiring

and other parts with large electromagnetic interference;
Bottom Layer High-frequency digital routing, high-frequency analog routing, and power routing must be

avoided under the module. If it is necessary to pass through the module, assume that the module is
soldered to the Top Layer, and the copper is spread on the Top Layer of the module contact part(well
grounded), it must be close to the digital part of the module and routed in the Bottom Layer;
Assuming the module is soldered or placed over the Top Layer, it is wrong to randomly route over the

Bottom Layer or other layers, which will affect the module's spurs and receiving sensitivity to varying
degrees;
It is assumed that there are devices with large electromagnetic interference around the module that will

greatly affect the performance. It is recommended to keep them away from the module according to the
strength of the interference. If necessary, appropriate isolation and shielding can be done;
Assume that there are traces with large electromagnetic interference (high-frequency digital,

high-frequency analog, power traces) around the module that will greatly affect the performance of the
module. It is recommended to stay away from the module according to the strength of the interference. If
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EA01-S User Manual
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