Quectel FC21 Hardware Design page 5

Electrical, Reliability and Radio Characteristics ......................................................................... 34
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4.1. General Description .............................................................................................................. 34
4.2. Electrical Characteristics ....................................................................................................... 34
4.3. I/O Interface Characteristics .................................................................................................. 35
4.4. Current Consumption ............................................................................................................ 35
4.4.1. Wi-Fi Current Consumption ........................................................................................ 35
4.4.2. BLE Current Consumption .......................................................................................... 37
4.5. RF Performance ................................................................................................................... 37
4.5.1. Wi-Fi Performance ..................................................................................................... 37
4.5.2. BLE Performance ....................................................................................................... 39
4.6. Electrostatic Discharge ......................................................................................................... 40
5 Mechanical Dimensions ................................................................................................................ 41
5.1. Mechanical Dimensions of the Module .................................................................................. 41
5.2. Recommended Footprint and Stencil Design......................................................................... 43
5.3. Top and Bottom Views of the Module .................................................................................... 45
6 Storage, Manufacturing and Packaging ....................................................................................... 46
6.1. Storage ................................................................................................................................. 46
6.2. Manufacturing and Soldering ................................................................................................ 47
6.3. Packaging ............................................................................................................................. 49
7 Appendix A References ................................................................................................................ 50
FC21_Hardware_Design
Wi-Fi&BT Module Series
FC21 Hardware Design
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