Quectel FC21 Hardware Design page 45

The recommended stencil design for FC21 is shown below. To ensure the module soldering quality, the
thickness of stencil for the module is recommended to be 0.18mm.
NOTE
For easy maintenance of the module, please keep about 3mm between the module and other
components on host PCB.
FC21_Hardware_Design
Figure 23: Recommended Stencil Design
Wi-Fi&BT Module Series
FC21 Hardware Design
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