Quectel FC21 Hardware Design page 49

Table 31: Recommended Thermal Profile Parameters
Factor
Soak Zone
Max slope
Soak time (between A and B: 150 °C and 200 °C)
Reflow Zone
Max slope
Reflow time (D: over 220°C)
Max temperature
Cooling down slope
Reflow Cycle
Max reflow cycle
NOTE
During manufacturing and soldering, or any other processes that may contact the module directly,
NEVER wipe the module label with organic solvents, such as acetone, ethyl alcohol, isopropyl alcohol,
trichloroethylene, etc. Otherwise, the label information may become unclear.
FC21_Hardware_Design
Wi-Fi&BT Module Series
FC21 Hardware Design
Recommendation
1–3 °C/s
70–120 s
2–3 °C/s
45–70 s
238 °C to 246 °C
-1.5 to -3 °C/s
1
48 / 52