3 PCB Layout Design
3.6 Flash and PSRAM
Place the zero-ohm series resistors on the SPI lines closer to the chip. Route the SPI traces on the inner layer
(e.g., the third layer) whenever possible. Add ground copper and ground vias around the clock and data traces of
SPI separately. Octal SPI traces should have matching lengths.
Figure 21: ESP32S3 Flash Layout
3.7 UART
The series resistor on the U0TXD trace needs to be placed close to the chip and away from the crystal. The
U0TXD and U0RXD traces on the top layer should be as short as possible, surrounded by ground copper and
ground vias.
3.8 USB
Place the RC circuit on the USB traces closer to the chip. Please use differential pairs and route them in parallel
at equal lengths. Make sure there is a complete reference ground plane and surround the USB traces with
ground copper.
3.9 Touch Sensor
ESP32-S3 offers up to 14 capacitive IOs that detect changes in capacitance on touch sensors due to finger
contact or proximity. The chip's internal capacitance detection circuit features low noise and high sensitivity. It
allows to use touch pads with smaller area to implement the touch detection function. You can also use the
touch panel array to detect a larger area or more test points.
Figure
22
depicts a typical touch sensor application.
Espressif Systems
24
ESP32-S3 Series Hardware Design Guidelines v1.0
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