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1.Scope
This product specification is applied to Low ESL Chip Monolithic Ceramic Capacitor used for General Electronic equipment.
2.MURATA Part NO. System
(Ex.)
LLA
21
(1)L/W
Dimensions
3. Type & Dimensions
L
(1)-1 L
(1)-2 W
2.0±0.1
1.25±0.1
4.Rated value
(3) Temperature Characteristics
(Public STD Code):F(EIA)
Temp. coeff
or Cap. Change
-22 to 22 %
5.Package
mark
(8) Packaging
f180mm Reel
L
EMBOSSED
f330mm Reel
K
EMBOSSED
B
Bulk Bag
Product specifications in this catalog are as of Feb.22,2012,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
LLA219C70G475ME01-01
CHIP MONOLITHIC CERAMIC CAPACITOR
LLA219C70G475ME01_ (0805, X7S, 4.7uF, 4Vdc)
_: packaging code
9
C7
(2)T
(3)Temperature
Dimensions
Characteristics
P
T
W
(Unit:mm)
(2) T
0.85±0.1
0.5±0.05
(4)
DC Rated
Temp. Range
Voltage
(Ref.Temp.)
-55 to 125 °C
4 Vdc
(25 °C)
Packaging Unit
3000 pcs./Reel
10000 pcs./Reel
1000 pcs./Bag
0G
475
(4)DC Rated
(5)Nominal
Voltage
Capacitance
p
(6)
(5) Nominal
Capacitance
Capacitance
Tolerance
4.7 uF
±20 %
1
Reference Sheet
M
E01
(7)Murata's
(6)Capacitance
Tolerance
Control Code
Specifications and Test
Methods
(Operationg
Temp. Range)
-55 to 125 °C
L
(8)Packaging
Code
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Related Manuals for Murata LLA219C70G475ME01 Series
Summary of Contents for Murata LLA219C70G475ME01 Series
- Page 1 CHIP MONOLITHIC CERAMIC CAPACITOR LLA219C70G475ME01_ (0805, X7S, 4.7uF, 4Vdc) _: packaging code Reference Sheet 1.Scope This product specification is applied to Low ESL Chip Monolithic Ceramic Capacitor used for General Electronic equipment. 2.MURATA Part NO. System (Ex.) (7)Murata’s (6)Capacitance (8)Packaging (1)L/W (2)T...
- Page 2 ■SPECIFICATIONS AND TEST METHODS Specification Item Test Method R7 / C7：－55℃ to ＋125℃ 1 Operating Temperature Range 2 Rated Voltage See the previous pages. The rated voltage is defined as the maximum voltage which may be applied continuously to the capacitor. When AC voltage is superimposed on DC voltage, V or V whichever is larger, should be maintained within the rated...
- Page 3 ■SPECIFICATIONS AND TEST METHODS Specification Item Test Method 13 Temperature Appearance No marking defects. Fix the capacitor to the supporting jig in the same manner and under Sudden the same conditions as (10). Perform the five cycles according to the Change Capacitance Within ±12.5%...
- Page 4 Package LLA Type There are two type of packaging for chip monolithic ceramic capacitor. Please specify the packaging code. 1.Bulk Packaging(Packaging Code=B):In a bag. Minimum Quantity : 1000(pcs./bag) 2.Tape Carrier Packaging(Packaging Code:L/K) 2.1 Minimum Quantity(pcs./reel) f180mm reel f 330mm reel Type Plastic Tape Plastic Tape...
- Page 5 Package LLA Type Fig 1 Package Chip (in mm) Chip Fig.2 Dimension of Reel 2.0±0.5 φ 21±0.8 10±1.5 16.5 max. Fig3 Taping Diagram Top Tape : Thickness 0.06 (*LLA18 /LLA215/LLA315 type: Thickness 0.05) Feeding Hole : As specified in 2.2 Hole for Chip : As specified in 2.2 Base Tape : As specified in 2.2 JEMCAP-00644A...
- Page 6 Package ﾁｯﾌﾟ詰め状態 ( 単位： mm) LLA Type 2.3 Tapes for capacitors are wound clockwise shown in Fig.3. (The sprocket holes are to the right as the tape is pulled toward the user.) 2.4 Part of the leader and part of the vacant section are attached as follows. (in mm) Tail vacant Section Chip-mounting Unit...
- Page 7 Caution ■ Limitation of use Please contact our sales representatives or product engineers before using our products for the applications listed below which require of our products for other applications than specified in this product. ①Aircraft equipment ②Aerospace equipment ③Undersea equipment ④Power plant control equipment ⑤Medical equipment ⑥Transportation equipment(vehicles,trains,ships,etc.) ⑦Traffic signal equipment ⑧Disaster prevention / crime prevention equipment...
- Page 8 Caution ■Rating 1.Temperature Dependent Characteristics 1. The electrical characteristics of the capacitor can change with temperature. 1-1. For capacitors having larger temperature dependency, the capacitance may change with temperature changes. The following actions are recommended in order to insure suitable capacitance values. (1) Select a suitable capacitance for the operating temperature range.
- Page 9 Caution 3.Applied Voltage 1. Do not apply a voltage to the capacitor that exceeds the rated voltage as called-out in the specifications. 1-1. Applied voltage between the terminals of a capacitor shall be less than or equal to the rated voltage. (1) When AC voltage is superimposed on DC voltage, the zero-to-peak voltage shall not exceed the rated DC voltage.
- Page 10 Caution 5. DC Voltage and AC Voltage Characteristic 1. The capacitance value of a high dielectric constant type capacitor changes depending on the DC voltage applied. Please consider the DC voltage characteristics when a capacitor is selected for use in a DC circuit. 1-1.
-
Page 11: Vibration And Shock
Caution 7.Vibration and Shock 1. The capacitors mechanical actress (vibration and shock) shall be specified for the use environment. Please confirm the kind of vibration and/or shock, its condition, and any generation of resonance. Please mount the capacitor so as not to generate resonance, and do not allow any impact on the terminals. 2. -
Page 12: Mounting Position
Caution ■ Soldering and Mounting 1.Mounting Position 1. Confirm the best mounting position and direction that minimizes the stress imposed on the capacitor during flexing or bending the printed circuit board. 1-1.Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board. - Page 13 Caution 3.Maintenance of the Mounting (pick and place) Machine 1. Make sure that the following excessive forces are not applied to the capacitors. 1-1. In mounting the capacitors on the printed circuit board, any bending force against them shall be kept to a minimum to prevent them from any bending damage or cracking.
- Page 14 Caution 4-1.Reflow Soldering 1. When sudden heat is applied to the components, the [Standard Conditions for Reflow Soldering] mechanical strength of the components will decrease because a sudden temperature change causes Infrared Reflow deformation inside the components. In order to prevent Temperature(℃) mechanical damage to the components, preheating is Soldering...
-
Page 15: Not Recommended
Caution 5.Washing Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips or broken solder joints. Take note not to vibrate PCBs. 6.Electrical Test on Printed Circuit Board 1. Confirm position of the support pin or specific jig, when inspecting the electrical performance of a capacitor after mounting on the printed circuit board. - Page 16 Caution 7.Printed Circuit Board Cropping 1. After mounting a capacitor on a printed circuit board, do not apply any stress to the capacitor that is caused by bending or twisting the board. 1-1. In cropping the board, the stress as shown right may cause the capacitor to crack. Try not to apply this type of stress to a capacitor.
- Page 17 Caution ■ Others 1. Under Operation of Equipment 1-1. Do not touch a capacitor directly with bare hands during operation in order to avoid the danger of a electric shock. 1-2. Do not allow the terminals of a capacitor to come in contact with any conductive objects (short-circuit). Do not expose a capacitor to a conductive liquid, inducing any acid or alkali solutions.
- Page 18 Notice ■ Rating 1.Operating Temperature 1. The operating temperature limit depends on the capacitor. 1-1.Do not apply temperatures exceeding the upper operating temperature. It is necessary to select a capacitor with a suitable rated temperature which will cover the operating temperature range.
-
Page 19: Pcb Design
Notice ■ Soldering and Mounting 1.PCB Design 1. Notice for Pattern Forms 1-1. Unlike leaded components, chip components are susceptible to flexing stresses since they are mounted directly on the substrate. They are also more sensitive to mechanical and thermal stresses than leaded components. Excess solder fillet height can multiply these stresses and cause chip cracking. - Page 20 Notice 2. Land Dimensions 2-1. Chip capacitor can be cracked due to the stress of PCB bending / etc if the land area is larger than needed and has an excess Chip Capacitor amount of solder. Please refer to the land dimensions in table 1 for flow soldering, table 2 for reflow soldering.
- Page 21 Notice 6.Washing 1. Please evaluate a capacitor by actual cleaning equipment and condition surely for confirming the quality and select the applicable solvent. 2. Unsuitable cleaning solvent may leave residual flux, other foreign substances, causing deterioration of electrical characteristics and the reliability of the capacitors. 3.
- Page 22 Notice ■ Others 1.Transportation 1. The performance of a capacitor may be affected by the conditions during transportation. 1-1. The capacitors shall be protected against excessive temperature, humidity and mechanical force during transportation. (1) Climatic condition － low air temperature：－40℃ －...
- Page 23 NOTE 1.Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. 2.Your are requested not to use our product deviating from this product specification. 3.We consider it not appropriate to include any terms and conditions with regard to the business transaction in the product specifications, drawings or other technical documents.
- Page 24 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Murata LLA219C70G475ME01L LLA219C70G475ME01K...
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