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XBSC/UBDC/UBSC/BBSC/ULSC 100 µm & 400 µm - Assembly
by soldering
General description
This document describes the attachment techniques recommended by Murata* for their pre-bumped and un-bumped
silicon capacitors on the customer substrates. This document is non-exhaustive. Customers with specific attachment
requirements or attachment scenarios that are not covered by this document should contact Murata.
Handling precautions and storage
Silicon die must always be handled in a clean room environment (usually class 1000 (ISO 6)) but the assembled
devices don't need to be handled in such an environment as the product is already well packed. The remaining
quantities have to be repacked immediately after any process step, in the same conditions as before the opening
(ESD bag + N2).
Store the capacitors in the manufacturer's package in the following conditions without a rapid thermal change in an
indoor room:
• Temperature: -10 to 40 degree C
• Humidity: 30 to 70%RH
Avoid storing the capacitors in the following conditions:
(a) Ambient air containing corrosive gas. (Chlorine, Hydrogen sulfide, Ammonia,
Sulfuric acid, Nitric oxide, etc.)
(b) Ambient air containing volatile or combustible gas
(c) In environments with a high concentration of airborne particles
(d) In liquid (water, oil, chemical solution, organic solvents, etc.)
(e) In direct sunlight
(f) In freezing environment
To avoid contamination and damage like scratches and cracks, our recommendations are:
•
Die must never be handled with bare hands
•
Avoid touching the active face
•
Do not store and transport die outside protective bags, tubes, boxes, sawn tape
•
Work only in ESD environments
•
Plastic tweezers or a soft vacuum tool are recommended to remove the silicon die from
the packing.
Standard packing is tape & reel for die size larger than 0201 but silicon capacitors can be provided within waffle pack,
gelpak or sawing frame. Please contact the Murata sales contact for drawing and references (mis@murata.com).
*Murata Integrated Passive Solutions
Assembly Note – Ref : ASNUBSC1.6
FBC-0003-01
Rev. 1.6
1
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Summary of Contents for Murata XBSC Series
- Page 1 Standard packing is tape & reel for die size larger than 0201 but silicon capacitors can be provided within waffle pack, gelpak or sawing frame. Please contact the Murata sales contact for drawing and references (mis@murata.com). *Murata Integrated Passive Solutions Assembly Note –...
- Page 2 Rev. 1.6 Pad opening The top surface of the Murata silicon capacitors are protected with a mineral passivation. The finishing of the contact pads are in nickel gold (generally 5µm nickel and 0.2µm gold) conforming with the soldering process. Murata recommends having an opening on the board which matches the pad of the capacitor (size, position and spacing) –...
- Page 3 Rev 1.2 Assembly by soldering Rev. 1.6 Metal track width recommendations: For best broadband performances (impedance matching), Murata recommends having a specific width between the PCB signal track and capacitor (see figures 1.1 to 1.6) Minimum metal Minimum metal track width (b) track width (a) Figure 1.1: unbumped capacitor...
- Page 4 XBSC/UBDC/UBSC/BBSC/ULSC 100 µm & 400 µm - Rev 1.2 Assembly by soldering Rev. 1.6 Figure 1.7: design of the substrate Die pad Metal track width Capacitor size Silicon Capacitor size (µm) Type (µm) (µm) Max (a) Min (b) Optimum (c) 0201M 600 x 600 150 x 100...
- Page 5 XBSC/UBDC/UBSC/BBSC/ULSC 100 µm & 400 µm - Rev 1.2 Assembly by soldering Rev. 1.6 Solder mask design: On the customer substrate, Murata recommends SMD (Solder Mask Defined) to control the solder flowing on the tracks. Solder Mask Defined (SMD): Assembly Note – Ref : ASNUBSC1.6 FBC-0003-01...
- Page 6 Assembly by soldering Rev. 1.6 None Solder Mask Defined (NSMD) is also possible: Note: No varnish between two landing pads can be done. Landing pad for the substrate and die pad dimensions for the Murata silicon die: Capacitor size Silicon Capacitor Type (µm)
- Page 7 XBSC/UBDC/UBSC/BBSC/ULSC 100 µm & 400 µm - Rev 1.2 Assembly by soldering Rev. 1.6 Fluxing by stamping: Fluxing by spraying: Fluxing by serigraphy: With unbumped capacitor: We recommend placing the solder paste by serigraphy directly on the substrate landing pads: Assembly Note –...
- Page 8 Such a contact would have a negative effect and would probably create a high leakage or a short circuit. Limited solder joint thickness will also avoid an excessive tilting of the capacitor. For example, design of stencils done by Murata (SAC305 type 6 with 50% of flux): Stencil opening size...
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Page 9: Reflow Soldering
A minimum pressure of 50 grams and a maximum of 150 grams is recommended for the die placement on the solder paste. Reflow soldering Murata recommends convection reflow but vapor phase reflow and infrared reflow could be also used. The reflow must be carried out in accordance with the JEDEC standard. Assembly Note – Ref : ASNUBSC1.6... - Page 10 XBSC/UBDC/UBSC/BBSC/ULSC 100 µm & 400 µm - Rev 1.2 Assembly by soldering Rev. 1.6 Figure 3: Generic reflow profile according to JEDEC J-STD-020-C PROFILE FEATURE SnPb 63/37 SAC305 (Lead-Free Assembly) Preheat/soak Temperature min (Ts min) 100°C 150°C Temperature max (Ts max) 150°C 200°C Time (ts) from (Ts min to Ts...
- Page 11 Rev 1.2 Assembly by soldering Rev. 1.6 Murata Integrated Passive Solutions S.A. makes no representation that the use of its products in the circuits described herein, or the use of other technical information contained herein, will not infringe www.murata.com upon existing or future patent rights. The descriptions contained herein do not imply the granting of licenses to make, use, or sell equipment constructed in accordance therewith.
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