Murata LLA219C70G475ME01 Series Reference Sheet page 14

4-1.Reflow Soldering
1. When sudden heat is applied to the components, the
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage to the components, preheating is
required for both the components and the PCB board.
Preheating conditions are shown in table 1. It is required to
keep the temperature differential between the solder and
the components surface (ΔT) as small as possible.
2. Solderability of Tin plating termination chips might be
deteriorated when a low temperature soldering profile where
the peak solder temperature is below the melting point of
Tin is used. Please confirm the Solderability of Tin plated
termination chips before use.
3. When components are immersed in solvent after mounting,
be sure to maintain the temperature difference (ΔT)
between the component and the solvent within the range
shown in the table 1.
Table 1
Part Number
LLA18/21/31
Recommended Conditions
Pb-Sn Solder
Infrared Reflow
Peak Temperature 230～250℃
Atmosphere Air
Pb-Sn Solder: Sn-37Pb
4. Optimum Solder Amount for Reflow Soldering
4-1. Overly thick application of solder paste results in
a excessive solder fillet height.
This makes the chip more susceptible to mechanical
and thermal stress on the board and may cause
the chips to crack.
4-2. Too little solder paste results in a lack of adhesive
strength on the outer electrode, which may result in
chips breaking loose from the PCB.
4-3. Make sure the solder has been applied smoothly to the end surface to a height of 0.2mm* min.
Inverting the PCB
JEMCAC-00640B
Temperature Differential
ΔT≦130℃
Lead Free Solder
Vapor Reflow
230～240℃ 240～260℃
Air Air or N2
Lead Free Solder: Sn-3.0Ag-0.5Cu
Make sure not to impose any abnormal mechanical shocks to the PCB.
[Standard Conditions for Reflow Soldering]
Temperature(℃)
Peak Temperature
200℃
170℃
150℃
130℃
Temperature(℃)
Peak Temperature
170℃
150℃
130℃
[Allowable Soldering Temperature and Time]
280
270
260
250
240
230
220
In case of repeated soldering, the accumulated
soldering time must be within the range shown above.
* GRM02/03: 1/3 of Chip Thickness min.
14
Caution
!
Infrared Reflow
Soldering
Preheating
30-60 seconds
60-120 seconds
Vapor Reflow
Soldering
Preheating
60-120 seconds
20 seconds
0 30 90
60
Soldering Time(sec.)
0.2mm* min.
in section
Gradual
Cooling
Time
Gradual
Cooling
Time
120