SCC1xx0_1640-21648-0004-E-0519 1 (17) ASSEMBLY INSTRUCTIONS FOR SCC1000 SERIES Technical Note 82 Murata Electronics Oy Assembly Instructions for Murata's SCC1000 series TN82 www.murata.com Rev. 2.0...
This document provides general guidelines for Printed Circuit Board (PCB) design and assembly of Murata's SCC1000 series components. It should be emphasized that this document serves only as a design guideline to help develop the optimal assembly conditions. It is essential that users also use their own manufacturing practices and experience to be able to fulfill the needs of varying end- use applications.
The outline and dimensions for the DIL-32 package are presented in Figure 2. Figure 2. Outline and dimensions for DIL-32 package. Dimensions are in millimeters [mm]. All tolerances are according to ISO 2768-f unless otherwise specified. Murata Electronics Oy Assembly Instructions for Murata's SCC1000 series TN82 www.murata.com Rev. 2.0...
Figure 3. Packing tape dimensions for the DIL-32 Package. Dimensions are in millimeters [mm]. Direction of unreeling PIN 1 IDENTIFIER Figure 4. Package orientation on the tape and unreeling direction on tape. Murata Electronics Oy Assembly Instructions for Murata's SCC1000 series TN82 www.murata.com Rev. 2.0...
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The reel dimensions are presented in Figure 5 and Table 1 below. Dimensions are in millimeters [mm]. Figure 5. Reel dimensions. All dimensions are in millimeters [mm]. Table 1. Packing reel dimensions [mm]. 2max 13 (-0.2/+0.5) 1001 32.4 (-0/+2.0) 38.4 Murata Electronics Oy Assembly Instructions for Murata's SCC1000 series TN82 www.murata.com Rev. 2.0...
Figure 6. PCB pad lay-out for the DIL-32. Murata's DIL packages can be soldered on commonly used substrates, e.g. FR-4, ceramic etc. The pad metallization should be solder wettable in order to assure good quality solder joints. For fine pitch assembly, the quality of plating is important.
Pin #1 is indexed by a dot mark on the component lid as illustrated in Figure 4. In the case of double sided SMT assembly, it should be noted that Murata's components are relatively heavy and they should be glued on the PCB if they are located on the bottom side of the PCB during the second solder reflow process.
If washing process is done after the soldering process, it must be noted that ultrasonic agitation wash after reflow is not allowed for Murata's DIL packaged MEMS components. As mentioned before (section 5.2) a no-clean paste is recommended.
Cross- sectioning is a destructive inspection method. An example of a DIL solder joint cross-section is presented in Figure 8. Murata Electronics Oy Assembly Instructions for Murata's SCC1000 series TN82 www.murata.com Rev. 2.0...
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SCC1xx0_1640-21648-0004-E-0519 11 (17) Figure 8. Cross-section of the DIL package lead's solder joint (with eutectic SnPb solder). Murata Electronics Oy Assembly Instructions for Murata's SCC1000 series TN82 www.murata.com Rev. 2.0...
As a general guideline, lower the viscosity or higher the modulus of coating, higher the probability of adverse effects on sensor component. Murata Electronics Oy Assembly Instructions for Murata's SCC1000 series TN82 www.murata.com Rev. 2.0...
PCB pad and through that the heat should be conducted to the tin wire and component lead. Murata has used 315ºC setting temperature for component soldering. The temperature on the tip of the tool is 270...275ºC.
Rework Guidelines If it becomes necessary to rework a SCC1000 series component, the preferred way to remove the component is by hot air. Use of a hot air rework station with a vacuum chuck, is the preferred method.
Same temperature is used both for Pb-free and SnPb-solder joints, even though SnPb solders melt already below 200ºC. Some temperature adjustment might be needed. Especially if tool head is old and 'dirty' temperature needs to be increased. Murata Electronics Oy Assembly Instructions for Murata's SCC1000 series TN82 www.murata.com Rev. 2.0...
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Figure 14. Soldering iron and solder braid used for solder removal. Note that the performance and the reliability of the reworked component may have decreased due to the rework operation! Murata does not recommend rework. Murata Electronics Oy Assembly Instructions for Murata's SCC1000 series TN82 www.murata.com...
SCC1xx0_1640-21648-0004-E-0519 17 (17) Environmental Aspects Murata Electronics Oy respects environmental values and thus, its DIL packages are lead-free and RoHS compatible. Murata Electronics’ sensors should be soldered with lead-free solders in order to guarantee full RoHS compatibility. References JEDEC / Electronic Industries Alliance, Inc. Moisture/Reflow Sensitivity Classification for Non- Hermetic Solid State Surface Mount Devices (J-STD-020D).
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