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Chip Monolithic Ceramic Capacitor for General
GRM0225C1E6R9CDAE_ (01005, C0G, 6.9pF, DC25V)
_: packaging code
1.Scope
This product specification is applied to Chip Monolithic Ceramic Capacitor used for General Electronic equipment.
2.MURATA Part NO. System
(Ex.)
GRM
02
(1)L/W
Dimensions
3. Type & Dimensions
(1)-1 L
(1)-2 W
0.4±0.02
0.2±0.02
4.Rated value
(3) Temperature Characteristics
(Public STD Code):C0G(EIA)
Temp. coeff
or Cap. Change
0±30 ppm/°C
5.Package
mark
(8) Packaging
f180mm Reel
L
EMBOSSED W4P1
Product specifications in this catalog are as of Apr.12,2015,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
GRM0225C1E6R9CDAE-01
2
5C
(2)T
(3)Temperature
Dimensions
Characteristics
(2) T
e
0.2±0.02
0.07 to 0.14
(4)
Rated
Temp. Range
Voltage
(Ref.Temp.)
25 to 125 °C
DC 25 V
(25 °C)
Packaging Unit
40000 pcs./Reel
1E
6R9
(6)Capacitance
(4)Rated
(5)Nominal
Tolerance
Voltage
Capacitance
(Unit:mm)
g
0.13 min.
Specifications and Test
(6)
(5) Nominal
Capacitance
Capacitance
Tolerance
6.9 pF
±0.25 pF
1
Reference Sheet
C
DAE
L
(7)Murata's
(8)Packaging
Control Code
Code
Methods
(Operating
Temp. Range)
-55 to 125 °C
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Related Manuals for Murata GRM0225C1E6R9CDAE
Summary of Contents for Murata GRM0225C1E6R9CDAE
- Page 1 Chip Monolithic Ceramic Capacitor for General GRM0225C1E6R9CDAE_ (01005, C0G, 6.9pF, DC25V) _: packaging code Reference Sheet 1.Scope This product specification is applied to Chip Monolithic Ceramic Capacitor used for General Electronic equipment. 2.MURATA Part NO. System (Ex.) (7)Murata’s (6)Capacitance (1)L/W (2)T (3)Temperature...
- Page 2 ■SPECIFICATIONS AND TEST METHODS Specification Item Test Method Temperature High Dielectric Compensating Type Constant Type －55℃ to 125℃ R6 : －55℃ to 85℃ 1 Operating Reference Temperature : 25℃ R7 : －55℃ to 125℃ Temperature Range C8 : －55℃ to 105℃ E4 : 10℃...
- Page 3 ■SPECIFICATIONS AND TEST METHODS Specification Item Test Method Temperature High Dielectric Compensating Type Constant Type 11 Vibration Appearance No defects or abnormalities. Solder the capacitor on the test jig(glass epoxy board) shown in Fig.3 Resistance using a eutectic solder. Capacitance Within the specified tolerance.
- Page 4 ■SPECIFICATIONS AND TEST METHODS Specification Item Test Method Temperature High Dielectric Compensating Type Constant Type 16 Humidity The measured and observed characteristics should satisfy Solder the capacitor on the test jig(glass epoxy board) shown in Fig.3 (Steady the specifications in the following table. using an eutectic solder.
- Page 5 ■SPECIFICATIONS AND TEST METHODS Recommended derating conditions on voltage and temperature These Part Numvers are designed for use in the circuits where continuous applied voltage to the capacitor is derated than rated voltage, and guarantee Durability Test with 100% × rated voltage as testing voltage at the maximum operating temperature.
- Page 6 Package GRM/F Type 1.Tape Carrier Packaging(Packaging Code:D/E/W/F/L/J/K) 1.1 Minimum Quantity(pcs./reel) φ180mm reel φ330mm reel Type Paper Tape Plastic Tape Paper Tape Plastic Tape Code:D/E Code:W Code:L Code:J/ F Code:K GR□01 50000 (W4P1) GR□02 40000 (W4P1) GR□03 15000(W8P2) 30000(W8P1) 50000(W8P2) 20000(W8P2) 50000(W8P2) 10000(W8P2) 50000(W8P2)
- Page 7 Package GRM/F Type (in:mm) (2)GR□03/15(W8P2 CODE:D/E/J/F) *1,2：2.0±0.05 4.0±0.1 *1,2： +0.1 φ1.5 Ａ Ａ 0.05 max. LW Dimensions Type A *3 B *3 Tolerance(Chip) ±0.03 0.37 0.67 GR□03 0.5 max. ±0.05 0.39 0.69 ±0.05 0.65 1.15 ±0.1 0.70 1.20 GR□15 0.8 max. ±0.15 0.72 1.25...
- Page 8 Package GRM/F Type (4)GR□18/21/31/32 (in:mm) 4.0±0.1 4.0±0.1 2.0±0.1 <Paper Tape> +0.1 φ1.5 Ａ 4.0±0.1 4.0±0.1 <Plastic Tape> 0.25±0.1(T≦2.0mm) 2.0±0.1 0.3±0.1(T：2.5mm) +0.1 φ1.5 Ａ LW Dimensions T Dimensions Dimensions Type Tolerance(Chip) (Chip) of Tape ±0.1 max. 0.5+0/-0.1 1.05±0.10 1.85±0.10 0.8 max. 0.5±0.05 ±0.2 1.10±0.10...
- Page 9 Package GRM/F Type (in:mm) (5)GR□43/55 8.0±0.1 4.0±0.1 0.3±0.1 +0.1 φ1.5 *：2.0±0.1 Ａ +0.2 φ1.5 2.5 max.(T≦1.8mm) 3.7 max.(T=2.0/2.5mm) 4.7 max.(2.8≦T≦3.2mm) A *2 B *2 Type GR□43 3.60 4.90 GR□55 5.20 6.10 *2 Nominal value JEMCGP-01796C...
- Page 10 め状態 ( 単位： mm) Package GRM/F Type Fig.1 Package Chips (in:mm) Chip Fig.2 Dimensions of Reel 2.0±0.5 φ21±0.8 ｗ Fig.3 Taping Diagram GR□01/02 8.0 max. 5±1.5 GR□32 max. 16.5 max. 10±1.5 20.5 max. GR□43/55 14±1.5 Top Tape : Thickness 0.06 Feeding Hole :As specified in 1.2.
- Page 11 Package ﾁｯﾌﾟ詰め状態 ( 単位： mm) GRM/F Type 1.3 Tapes for capacitors are wound clockwise shown in Fig.3. (The sprocket holes are to the right as the tape is pulled toward the user.) 1.4 Part of the leader and part of the vacant section are attached as follows. Tail vacant Section Chip-mounting Unit Leader vacant Section...
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Page 12: Limitation Of Applications
Caution ■Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. ①Aircraft equipment ②Aerospace equipment ③Undersea equipment ④Power plant control equipment... - Page 13 Caution 2.Measurement of Capacitance 1. Measure capacitance with the voltage and frequency specified in the product specifications. 1-1. The output voltage of the measuring equipment may decrease occasionally when capacitance is high. Please confirm whether a prescribed measured voltage is impressed to the capacitor. 1-2.
- Page 14 Caution 5. DC Voltage and AC Voltage Characteristic 1. The capacitance value of a high dielectric constant type [Example of DC Voltage Characteristics] capacitor changes depending on the DC voltage applied. Sample: R7 Characteristics 0.1μF, Rated Voltage 50VDC Please consider the DC voltage characteristics when a capacitor is selected for use in a DC circuit.
- Page 15 Caution ■Soldering and Mounting 1.Mounting Position 1. Confirm the best mounting position and direction that minimizes the stress imposed on the capacitor during flexing or bending the printed circuit board. 1-1.Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board. ...
- Page 16 Caution 3.Maintenance of the Mounting (pick and place) Machine 1. Make sure that the following excessive forces are not applied to the capacitors. 1-1. In mounting the capacitors on the printed circuit board, any bending force against them shall be kept to prevent them from any bending damage or cracking.
- Page 17 Caution 4-1.Reflow Soldering 1. When sudden heat is applied to the components, the [Standard Conditions for Reflow Soldering] mechanical strength of the components will decrease because a sudden temperature change causes deformation inside the components. In order to prevent Temperature(℃) mechanical damage to the components, preheating is Soldering Peak Temperature...
- Page 18 Caution 4-2.Flow Soldering [Standard Conditions for Flow Soldering] 1. Do not apply flow soldering to chips not listed in Table 2. Table 2 Temperature(℃) Soldering Soldering Part Number Temperature Differential Peak Gradual Temperature ΔT Cooling ΔT≦150℃ GRM18/21/31 Preheating Peak Temperature Preheating 2.
- Page 19 Caution 4-3.Correction of Soldered Portion When sudden heat is applied to the capacitor, distortion caused by the large temperature difference occurs internally, and can be the cause of cracks. Capacitors also tend to be affected by mechanical and thermal stress depending on the board preheating temperature or the soldering fillet shape, and can be the cause of cracks.
- Page 20 Caution 5.Washing Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips or broken solder joints. Take note not to vibrate PCBs. 6.Electrical Test on Printed Circuit Board 1. Confirm position of the backup pin or specific jig, when inspecting the electrical performance of a capacitor after mounting on the printed circuit board.
- Page 21 Caution (1) Example of a suitable jig [In the case of Single-side Mounting] An outline of the board separation jig is shown as follows. Recommended example: Stress on the component mounting position can be minimized by holding the portion close to the jig, and bend in the direction towards the side where the capacitors are mounted. Not recommended example: The risk of cracks occurring in the capacitors increases due to large stress being applied to the component mounting position, if the portion away from the jig is held and bent in the direction opposite the side where the capacitors are mounted.
- Page 22 Caution (3) Example of Router Type Separator [ Outline Drawing ] Router The router type separator performs cutting by a router rotating at a high speed. Since the board does not bend in the cutting process, stress on the board can be suppressed during board separation.
- Page 23 Caution ■ Others 1. Under Operation of Equipment 1-1. Do not touch a capacitor directly with bare hands during operation in order to avoid the danger of an electric shock. 1-2. Do not allow the terminals of a capacitor to come in contact with any conductive objects (short-circuit). Do not expose a capacitor to a conductive liquid, inducing any acid or alkali solutions.
- Page 24 Notice ■ Rating 1.Operating Temperature 1. The operating temperature limit depends on the capacitor. 1-1. Do not apply temperatures exceeding the upper operating temperature. It is necessary to select a capacitor with a suitable rated temperature that will cover the operating temperature range. It is also necessary to consider the temperature distribution in equipment and the seasonal temperature variable factor.
- Page 25 Notice ■Soldering and Mounting 1.PCB Design 1. Notice for Pattern Forms 1-1. Unlike leaded components, chip components are susceptible to flexing stresses since they are mounted directly on the substrate. They are also more sensitive to mechanical and thermal stresses than leaded components. Excess solder fillet height can multiply these stresses and cause chip cracking.
- Page 26 Notice 2. Land Dimensions Chip Capacitor 2-1. Chip capacitors can be cracked due to the stress Land of PCB bending , etc. if the land area is larger than needed and has an excess amount of solder. Please refer to the land dimensions in table 1 for flow soldering, table 2 for reflow soldering.
- Page 27 Notice 3. Board Design When designing the board, keep in mind that the amount of strain which occurs will increase depending on the size and material of the board. Relationship with amount of strain to the board thickness, length, width, etc.] ε= Relationship between load and strain 2Ewh...
- Page 28 Notice 5.Flow Soldering ［As a Single Chip］ Set temperature and time to ensure that leaching of the outer electrode does not exceed 25% of the chip end area as a single chip (full length of the edge A-B-C-D shown at right) and 25% of the length A-B shown as Outer Electrode mounted on substrate.
- Page 29 NOTE 1.Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. 2.Your are requested not to use our product deviating from this product specification. 3.We consider it not appropriate to include any terms and conditions with regard to the business transaction in the product specifications, drawings or other technical documents.
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