Murata LLA219C70G475ME01 Series Reference Sheet page 20

2. Land Dimensions
2-1. Chip capacitor can be cracked due to the stress of PCB
bending / etc if the land area is larger than needed and has an excess
amount of solder.
Please refer to the land dimensions in table 1 for flow
soldering, table 2 for reflow soldering.
Please confirm the suitable land dimension by evaluating of the actual SET / PCB.
Table 2 Reflow Soldering Method
Dimensions
Part Number
LLA18
LLA21
LLA31
JEMCAC-00640B
a
Chip（L×W）
1.6×0.8 0.3～0.4
2.0×1.25 0.5～0.7
3.2×1.6 0.7～0.9
b
0.25～0.35 0.15～0.25
0.35～0.6
0.4～0.7
20
Chip Capacitor
Land
c p
0.4
0.2～0.3 0.5
0.3～0.4 0.8
(in mm)
Notice