Electronics Housing; Registered Trademarks; Patents - Endress+Hauser Levelflex FMP50 Operating Instructions Manual

Levelflex FMP50
Endress+Hauser
3.1.2

Electronics housing

2
1
Design of the electronics housing
å 2
1 Electronics compartment cover
2 Display module
3 Main electronics module
4 Cable glands (1 or 2, depending on instrument version)
5 Nameplate
6 I/O electronics module
7 Terminals (pluggable spring terminals)
8 Connection compartment cover
9 Grounding terminal
3.2

Registered trademarks

TM
FOUNDATION Fieldbus
Registered trademark of the Fieldbus Foundation, Austin, Texas, USA
Ò Ò
KALREZ , VITON
Registered trademark of DuPont Performance Elastomers L.L.C., Wilmington, USA
Ò
TEFLON
Registered trademark of E.I. DuPont de Nemours & Co., Wilmington, USA
Ò
TRI CLAMP
Registered trademark of Alfa Laval Inc., Kenosha, USA
3.3

Patents

This product may be protected by at least one of the following patents.
Further patents are pending.
US Patents
5.827.985
5.884.231
5.973.637
6.087.978
6.140.940
4
3
Product description
5
9
6
7
8
EP Patents
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955 527
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A0012422
13