Telit Wireless Solutions SE868SY-D Hardware Design Manual
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Telit Wireless Solutions SE868SY-D Hardware Design Manual

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SE868SY-D
Hardware Design Guide
#Preliminary#
1VV0301705 Rev. 1 – 2021-02-17
Mod. 0805 2017-01 Rev.6

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Summary of Contents for Telit Wireless Solutions SE868SY-D

  • Page 1 SE868SY-D Hardware Design Guide #Preliminary# 1VV0301705 Rev. 1 – 2021-02-17 Mod. 0805 2017-01 Rev.6...

  • Page 2: Notice

    SE868SY-D HW User Guide #Preliminary# SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE NOTICE While reasonable efforts have been made to assure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from use of the information obtained herein.

  • Page 3: Usage And Disclosure Restrictions

    SE868SY-D HW User Guide #Preliminary# USAGE AND DISCLOSURE RESTRICTIONS License Agreements The software described in this document is the property of Telit and its licensors. It is furnished by express license agreement only and may be used only in accordance with the terms of such an agreement.

  • Page 4: Applicability Table

    SE868SY-D HW User Guide #Preliminary# APPLICABILITY TABLE PRODUCTS SE868SY-D 1VV0301705 Rev. 1 Page 4 of 47 2021-02-17...

  • Page 5: Table Of Contents

    SE868SY-D HW User Guide #Preliminary# Contents NOTICE COPYRIGHTS ....................2 COMPUTER SOFTWARE COPYRIGHTS ............2 USAGE AND DISCLOSURE RESTRICTIONS ..........3 License Agreements ..............3 Copyrighted Materials ..............3 III. High Risk Materials ............... 3 Trademarks .................. 3 Third Party Rights ................. 3 APPLICABILITY TABLE ................
  • Page 6 SE868SY-D HW User Guide #Preliminary# Power Consumption ..............17 General Design Rules ..............18 4.3.1. Electrical Design Guidelines ............18 4.3.2. Power Supply PCB layout Guidelines ......... 19 DIGITAL SECTION ..............20 Logic Levels ................20 Communication ports ..............21 5.2.1.
  • Page 7 SE868SY-D HW User Guide #Preliminary# PACKAGING ................37 Modules shipped in Reel form ............. 37 Modules shipped in Tray form ............. 38 CONFORMITY ASSESSMENT ISSUES ........40 EU RED Declaration of Conformity ..........40 SAFETY RECOMMENDATIONS..........41 READ CAREFULLY ..............41 ACRONYMS ................

  • Page 8: Introduction

    1. INTRODUCTION Scope This document introduces the SE868SY-D module and presents possible and recommended hardware solutions for developing a product based on this module. All the features and solutions detailed in this document are applicable to all the variants listed in the applicability table.

  • Page 9: Text Conventions

    SE868SY-D HW User Guide #Preliminary# Text Conventions Danger – This information MUST be followed or catastrophic equipment failure or bodily injury may occur. Caution or Warning – Alerts the user to important points about integrating the module, if these points are not followed, the module and end user equipment may fail or malfunction.

  • Page 10: General Product Description

    The SE868SY-D module is a multi-frequency and multi constellation GNSS receiver, latest addition to the xE868 family. The SE868SY-D product, exploiting the two GNSS bands L1 and L5, achieves sub-meter accuracy and reduces multipath effects typical of urban canyons. The SE868SY-D operates in the 1.8 V voltage domain, minimizing power consumption even below L1-only products and making it ideally suited for battery powered and wearable device applications.
  • Page 11 SE868SY-D HW User Guide #Preliminary# • Interfaces Main UART • SPI / I2C (in progress) • 1PPS signal • Single Antenna pin • External Flash support (in progress) 1VV0301705 Rev. 1 Page 11 of 47 2021-02-17...

  • Page 12: Mechanical Specifications

    SE868SY-D HW User Guide #Preliminary# Mechanical Specifications 2.5.1. Dimensions The overall dimensions of SE868SY-D are: • Length: 11 mm • Width: 11 mm • Thickness: 2.6 mm 2.5.2. Weight The nominal weight of the module is TBD grams. Temperature Range...

  • Page 13: Pins Allocation

    SE868SY-D HW User Guide #Preliminary# 3. PINS ALLOCATION Pin-out Signal Function Type Comment Host Interface (HIF) UART function: UART-TX (HIF) UART_TX function: I2C-SDA (HIF) DIGITAL 1.8V function: SPI-MOSI (HIF) function: UART-RX (HIF) UART_RX function: I2C-SCL (HIF) DIGITAL 1.8V function: SPI-SCLK (HIF)
  • Page 14 SE868SY-D HW User Guide #Preliminary# function: GPIO RF Section RF_IN L1-L5 band RF signal input ANALOG RF Power Supply VDD18 Power supply Power 1.8V Power 1.8V VDD18 Power supply (*)Alternative voltage level at 0V8 to support low power configurations will...
  • Page 15 SE868SY-D HW User Guide #Preliminary# NOT CONNECTED NOT CONNECTED NOT CONNECTED WARNING: Reserved pins must not be connected. 1VV0301705 Rev. 1 Page 15 of 47 2021-02-17...

  • Page 16: Lga Pads Layout

    SE868SY-D HW User Guide #Preliminary# LGA Pads Layout TOP VIEW 1VV0301705 Rev. 1 Page 16 of 47 2021-02-17...

  • Page 17: Power Supply

    SE868SY-D HW User Guide #Preliminary# 4. POWER SUPPLY The power supply circuitry and board layout are a very important part in the full product design, and they strongly reflect on the product overall performances. Please read carefully the requirements and the guidelines that will follow for a proper design.

  • Page 18: General Design Rules

    SE868SY-D HW User Guide #Preliminary# NOTE: It is recommended to reach the Sleep state only from Idle. Setting the device in Sleep mode directly from the Active mode could lead to higher-than-normal power consumption. General Design Rules The principal guidelines for the Power Supply Design embrace three different design steps: •...

  • Page 19: Power Supply Pcb Layout Guidelines

    • The low ESR bypass capacitor must be placed close to the Telit SE868SY-D power input pads; in case the power supply is a switching type, the capacitor can be placed close to the switching inductor to cut the ripple.

  • Page 20: Digital Section

    SE868SY-D HW User Guide #Preliminary# 5. DIGITAL SECTION Logic Levels Parameter ABSOLUTE MAXIMUM RATINGS – NOT FUNCTIONAL Input level on any digital pin (CMOS 1.8) with respect to -0.3V 2.2 V ground Operating Range - Interface levels (1.8V CMOS) Input high level 0.7*VDD...

  • Page 21: Communication Ports

    Communication ports 5.2.1. Communication interfaces to the Host MCU (HIF) The SE868SY-D features three different Host Interfaces (HIF) for communicating with the host MCU that can be alternatively selected by means of Host Interface Selection pin (See Section 5.2.2): HIF_UART: serial interface, supporting speeds up to 10Mbps. Hardware flow control is mandatory for speeds above 115.2kbps.

  • Page 22: Host Interface Selection

    LNA_EN is an output signal, mapped on pin 26, that can be used as enable for external LNA. The SE868SY-D embeds an internal LNA with a 17 dB gain both for L1 and L5 band. If more gain is needed, an external LNA can be added to the RF path. We recommend a maximum external gain of 8 dB for better EMI performances, nevertheless a gain up to 33 dB can be accepted as indicated in the following table.

  • Page 23: Pps

    SE868SY-D HW User Guide #Preliminary# 5.3.3. 1 Pulse Per second signal is generated by the GNSS receiver for synchronization purposes. It is mapped on PIN 28 on SE868SY-D. 1VV0301705 Rev. 1 Page 23 of 47 2021-02-17...

  • Page 24: Product Performance

    Test Conditions: Static scenario, -130 dBm, Full Power mode (*) Measured value on fist Marketing Samples (**) Target value on fist Mass Production Samples Table 6-2 SE868SY-D - Time to First Fix 1VV0301705 Rev. 1 Page 24 of 47 2021-02-17...

  • Page 25: Sensitivity

    SE868SY-D HW User Guide #Preliminary# Additional values for all the other supported bands/constellations will be provided in the next document revisions. Sensitivity Minimum Signal Constellation(s) Bands State Level (dBm) -147 (*) Acquisition -148 (**) -161(*) Navigation -163(**) -161(*) Tracking -167(**)
  • Page 26 SE868SY-D HW User Guide #Preliminary# 1VV0301705 Rev. 1 Page 26 of 47 2021-02-17...

  • Page 27: Rf Section

    Analog RF RF Front End Design The SE868SY-D Module embeds an internal LNA but, at the same time, the device dynamic allows for higher external gain (Section 5.3.2). Therefore both passive and active antenna (antenna with a built-in low noise amplifier) can be used. In the latter case, the active antenna must be supplied with proper bias-tee circuit.

  • Page 28: Reference Design For Active Antenna

    Guidelines of PCB line for GNSS Antenna When using the SE868SY-D, since there's no antenna connector on the module, the antenna must be connected to the SE868SY-D antenna pad by means of a transmission line implemented on the PCB. •...

  • Page 29: Gnss Antenna Requirements

    Powering the External LNA (active antenna) The LNA of active antenna needs a source of power because the DC voltage needed by active antenna is not supplied by the SE868SY-D module, but can be easily included by the host design.

  • Page 30: Co-Existance

    SE868SY-D HW User Guide #Preliminary# Example of external antenna bias circuitry can be seen in the active antenna reference design in section 7.2.2. Be aware of max bias current in case of unwanted short on antenna cable, decoupling inductor may be demaged.

  • Page 31: Mechanical Design

    SE868SY-D HW User Guide #Preliminary# 8. MECHANICAL DESIGN Drawing NOTE: Dimensions in mm. The tolerance is not cumulative. 1VV0301705 Rev. 1 Page 31 of 47 2021-02-17...

  • Page 32: Application Pcb Design

    Footprint COPPER PATTERN (top view) In order to easily rework the SE868SY-D is suggested to consider on the application a 2 mm placement inhibit area around the module. It is also suggested, as common rule for an SMT component, to avoid having a mechanical part of the application in direct contact with the module.

  • Page 33: Pcb Pad Design

    SE868SY-D HW User Guide #Preliminary# PCB pad design Non solder mask defined (NSMD) type is recommended for the solder pads on the PCB. Copper Solder Mask NSMD (Solder Mask Defined) (Non Solder Mask Defined) The recommendation for the PCB pads dimensions are 1:1 with module pads.

  • Page 34: Stencil

    SE868SY-D HW User Guide #Preliminary# Stencil Stencil’s apertures layout can be the same of the recommended footprint (1:1), we suggest a thickness of stencil foil ≥ 120 µm. Solder paste Item Lead Free Solder Paste Sn/Ag/Cu We recommend using only “no clean” solder paste in order to avoid the cleaning of the modules after assembly.
  • Page 35 SE868SY-D HW User Guide #Preliminary# WARNING: The above solder reflow profile represents the typical SAC reflow limits and does not guarantee adequate adherence of the module to the customer application throughout the temperature range. Customer must optimize the reflow profile depending on the overall system taking into account such factors as thermal mass and warpage.
  • Page 36 SE868SY-D HW User Guide #Preliminary# NOTE: All temperatures refer to topside of the package, measured on the package body surface WARNING: THE SE868SY-D MODULE WITHSTANDS ONE REFLOW PROCESS ONLY. 1VV0301705 Rev. 1 Page 36 of 47 2021-02-17...

  • Page 37: Packaging

    SE868SY-D HW User Guide #Preliminary# PACKAGING Modules shipped in Reel form 1VV0301705 Rev. 1 Page 37 of 47 2021-02-17...

  • Page 38: Modules Shipped In Tray Form

    SE868SY-D HW User Guide #Preliminary# Modules shipped in Tray form 1VV0301705 Rev. 1 Page 38 of 47 2021-02-17...
  • Page 39 SE868SY-D HW User Guide #Preliminary# 1VV0301705 Rev. 1 Page 39 of 47 2021-02-17...

  • Page 40: Conformity Assessment Issues

    SE868SY-D HW User Guide #Preliminary# CONFORMITY ASSESSMENT ISSUES EU RED Declaration of Conformity This section will be available in next document revisions. 1VV0301705 Rev. 1 Page 40 of 47 2021-02-17...

  • Page 41: Safety Recommendations

    SE868SY-D HW User Guide #Preliminary# SAFETY RECOMMENDATIONS READ CAREFULLY Be sure the use of this product is allowed in the country and in the environment required. The use of this product may be dangerous and has to be avoided in the following areas: •...

  • Page 42: Acronyms

    SE868SY-D HW User Guide #Preliminary# ACRONYMS Assisted (or Aided) GPS AGPS AGPS provides ephemeris data to the receiver to allow faster cold start times than would be possible using only broadcast data. This extended ephemeris data could be either server- generated or locally-generated.
  • Page 43 SE868SY-D HW User Guide #Preliminary# Geometric Dilution of Precision GDOP A factor used to describe the effect of satellite geometry on the accuracy of the time and position solution of a GNSS receiver. A lower value of GDOP indicates a smaller error in the solution.
  • Page 44 SE868SY-D HW User Guide #Preliminary# The lowest signal level at which a GNSS receiver is able to Navigation Sensitivity reliably maintain navigation after the satellite signals have been acquired. National Marine Electronics Association NMEA Quasi-Zenith Satellite System QZSS The Japanese Regional Navigation Satellite System.
  • Page 45 SE868SY-D HW User Guide #Preliminary# The lowest signal level at which a GNSS receiver is able to Tracking Sensitivity maintain tracking of a satellite signal after acquisition is complete. Time to First Fix TTFF The elapsed time required by a receiver to achieve a valid position solution from a specified starting condition.

  • Page 46: Document History

    SE868SY-D HW User Guide #Preliminary# DOCUMENT HISTORY Revision Date Changes 2021-01-20 First issue 2021-02-17 Updated Section 4.1 1VV0301705 Rev. 1 Page 46 of 47 2021-02-17...
  • Page 47 Mod. 0805 2017-01 Rev.6...

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