Telit Wireless Solutions SE868SY-D Hw Design Manual
  1. Manuals
  2. Brands
  3. Telit Wireless Solutions Manuals
  4. Control Unit
  5. SE868SY-D
  6. Hw design manual

Telit Wireless Solutions SE868SY-D Hw Design Manual

Hide thumbs Also See for SE868SY-D:
Table of Contents

Advertisement

Quick Links

Download this manual
SE868SY-D
HW Design Guide
1VV0301705 Rev.5 – 2021-12-15
Telit Technical Documentation

Advertisement

Table of Contents
loading
Need help?

Need help?

Do you have a question about the SE868SY-D and is the answer not in the manual?

Questions and answers

Related Manuals for Telit Wireless Solutions SE868SY-D

Summary of Contents for Telit Wireless Solutions SE868SY-D

  • Page 1 SE868SY-D HW Design Guide 1VV0301705 Rev.5 – 2021-12-15 Telit Technical Documentation...

  • Page 2: Applicability Table

    SE868SY-D Hardware Design Guide APPLICABILITY TABLE PRODUCTS SE868SY-D 1VV0301705 Rev. 5 Page 2 of 44 2021-12-15 Not Subject to NDA...

  • Page 3: Table Of Contents

    SE868SY-D Hardware Design Guide CONTENTS APPLICABILITY TABLE CONTENTS INTRODUCTION Scope Audience Contact Information, Support Symbol Conventions GENERAL PRODUCT DESCRIPTION Overview Product Variants and Supported Satellite Systems Target Market Block Diagram Main Features Mechanical Specifications 2.6.1. Dimensions 2.6.2. Weight Temperature Range...
  • Page 4 SE868SY-D Hardware Design Guide Logic Levels Communication Ports 5.2.1. Communication Interfaces to the Host MCU (HIF) 5.2.2. Host Interface Selection Digital I/O 5.3.1. nRESET 5.3.2. LNA Enable 5.3.3. 1PPS 5.3.4. System ON PRODUCT PERFORMANCE Horizontal Position Accuracy Time to First Fix...
  • Page 5 SE868SY-D Hardware Design Guide PACKAGING Reel Tray CONFORMITY ASSESSMENT ISSUES EU RED Declaration of Conformity UKCA Declaration of Conformity PRODUCT AND SAFETY INFORMATION Copyrights and Other Notices 12.1.1. Copyrights 12.1.2. Computer Software Copyrights Usage and Disclosure Restrictions 12.2.1. License Agreements 12.2.2.

  • Page 6: Introduction

    SE868SY-D Hardware Design Guide 1. INTRODUCTION Scope This document introduces the SE868SY-D module and presents possible and recommended hardware solutions for the development of a product based on this module. All the features and solutions described in this document are applicable to all the variants listed in the applicability table.

  • Page 7: Symbol Conventions

    SE868SY-D Hardware Design Guide Symbol Conventions Danger: This information MUST be followed, or catastrophic equipment failure or personal injury may occur. Warning: Alerts the user on important steps about the module integration. Note/Tip: Provides advice and suggestions that may be useful when integrating the module.

  • Page 8: General Product Description

    SE868SY-D Hardware Design Guide 2. GENERAL PRODUCT DESCRIPTION Overview The SE868SY-D module, the latest addition to the xE868 family, is a multi-frequency and multi-constellation GNSS receiver. The SE868SY-D product uses the two GNSS bands L1 and L5 to achieve sub-meter accuracy and reduce the multipath effects that are common in urban canyons.

  • Page 9: Block Diagram

    SE868SY-D Hardware Design Guide • E-mobility • Drones Block Diagram Figure 1: SE868SY-D Block Diagram Main Features Function Features GNSS Multi-constellation and Multi-bands Low power consumption Geofence (in progress) Real Time Clock Interfaces Main UART / I2C 1PPS signal LNA_EN...

  • Page 10: Mechanical Specifications

    Table 4: Temperature Range Magnetic Field Immunity Since the SE868SY-D uses an embedded MRAM as an NVM (Non-Volatile Memory) for its program code and data storage, the customer should consider the environment magnetic field strength for good retention performance as shown in Table 5.

  • Page 11: Pins Allocation

    SE868SY-D Hardware Design Guide 3. PINS ALLOCATION Pin-Out Signal Function Type Notes Host Interface (HIF) UART function: UART-TX (HIF) UART_TX function: I2C-SDA (HIF) DIGITAL 1.8V function: SPI-MOSI (HIF) function: UART-RX (HIF) UART_RX function: I2C-SCL (HIF) DIGITAL 1.8V function: SPI-SCLK (HIF)
  • Page 12 SE868SY-D Hardware Design Guide Signal Function Type Notes Power Supply VDD18 Power supply Power 1.8V Power 1.8V (Standard P/N) VDD18 Power supply Power 0.8 V (Low-Power P/N) VDD18 Power supply Power 1.8V Ground Ground Ground Ground Ground Ground RESERVED FOR FUTURE USE (RFU)

  • Page 13: Lga Pads Layout

    SE868SY-D Hardware Design Guide Warning: Reserved pins must not be connected. LGA Pads Layout TOP VIEW Figure 2: LGA Pads Layout 1VV0301705 Rev. 5 Page 13 of 44 2021-12-15 Not Subject to NDA...

  • Page 14: Absolute Maximum Ratings

    SE868SY-D Hardware Design Guide Absolute Maximum Ratings Parameter Pins Absolute Maximum Rating Units RF Input Voltage Pin 8 RF Input Power Pin 8 ESD Voltage CDM JESD22- All Pins ±150 C101F ESD Voltage HDM JEDEC JS- All pins ±1500 V...

  • Page 15: Power Supply

    SE868SY-D Hardware Design Guide 4. POWER SUPPLY The power supply circuitry and board layout are critical components of the overall product design, and they strongly reflect the product's overall performance. For a proper design, please read the requirements and guidelines carefully.

  • Page 16: General Design Rules

    SE868SY-D Hardware Design Guide Low Power P/N GPS, GLO, GAL, QZSS, GPS L1 only GPS L1+L5 L1+L5 Acquisition (avg) 38 mW 43 mW 40 mW Acquisition (max) 41 mW 45 mW 49 mW Tracking (avg) 20 mW 28 mW 34 mW...

  • Page 17: Power Supply Pcb Layout Guidelines

    P/N, the DC-DC enable PIN (CE) must be connected to the SYS_ON signal, exported on pin 5 of SE868SY-D, to ensure the module enters a deep sleep state. Figure 4: Example of a Suitable 1.8 V DC-DC Converter Figure 5: Example of a Suitable 0.8 V DC-DC Converter...
  • Page 18 • The low ESR bypass capacitor must be placed close to the Telit SE868SY-D power input pads; in case the power supply is a switching type, it can be placed close to the switching inductor to reduce ripple.

  • Page 19: Digital Section

    Communication Ports 5.2.1. Communication Interfaces to the Host MCU (HIF) The SE868SY-D features three different Host Interfaces (HIF) for communicating with the host MCU, which can be selected using the Host Interface Selection pin (See section 5.2.2 Host Interface Selection): •...

  • Page 20: Host Interface Selection

    Host Interface Selection The different Host Interface (HIF) options described in the previous section can be selected in the SE868SY-D via two pins, HIF_SEL_0 and HIF_SEL_1, whose values are checked when the power is turned ON. HIF_SEL_0 and HIF_SEL_1 are internally pulled down with a 47 kΩ...

  • Page 21: Digital I/O

    LNA_EN is an output signal, mapped on pin 26 and can be used to enable external LNA. The SE868SY-D embeds an internal LNA with a 17 dB gain for both the L1 and L5 bands. If higher gain is required, an external LNA can be added to the RF path. For improved EMI performance, a maximum external gain of 8 dB is recommended;...

  • Page 22: Product Performance

    AVG TTFF (s) Cold L1+L5 Cold GPS, GLO, GAL, QZSS, BDS L1+L5 Cold Test Conditions: Static scenario, -130 dBm, Full Power mode Table 19: SE868SY-D - Time to First Fix Sensitivity Minimum Signal Constellation(s) Bands State Level (dBm) Acquisition -147...
  • Page 23 Bands State Level (dBm) -146 Acquisition -162 GPS, GLO, GAL, QZSS, BDS Navigation L1+L5 -164 Tracking Test conditions: Static scenario, Full Power mode Table 20: SE868SY-D - Sensitivity 1VV0301705 Rev. 5 Page 23 of 44 2021-12-15 Not Subject to NDA...

  • Page 24: Rf Section

    Table 21: GNSS RF Signal Pin-Out RF Front End Design The SE868SY-D Module embeds an internal LNA but, at the same time, the dynamics of the device allow for higher external gain (See section 5.3.2 LNA Enable). Therefore, both passive and active antenna (antenna with a built-in low noise amplifier) can be used. In the latter case, the active antenna must be supplied with proper bias-tee circuit.

  • Page 25: Reference Design For Active Antenna

    7.2.3. Guidelines of PCB Line for GNSS Antenna When using the SE868SY-D, since there is no antenna connector on the module, the antenna must be connected to the SE868SY-D antenna pad by means of a transmission line implemented on the PCB.

  • Page 26: Gnss Antenna Requirements

    SE868SY-D Hardware Design Guide • Surround (on both the sides, above and below) the antenna line on PCB with Ground, avoid having other signal tracks directly facing the antenna line of track. • The ground around the antenna line on PCB must be strictly connected to the Ground Plane using vias at least once every 2mm.

  • Page 27: Powering The External Lna (Active Antenna)

    Powering the External LNA (Active Antenna) The LNA of active antenna needs a power source as the DC voltage needed by the active antenna is not supplied by the SE868SY-D module but can be easily included by the host design.

  • Page 28: Mechanical Design

    SE868SY-D Hardware Design Guide 8. MECHANICAL DESIGN Drawing Figure 8: Mechanical Design Drawing Note: Dimensions in mm. The tolerance is not cumulative. 1VV0301705 Rev. 5 Page 28 of 44 2021-12-15 Not Subject to NDA...

  • Page 29: Application Pcb Design

    0,45 Figure 9: Copper Pattern (top view) To make it easier to rework the SE868SY-D,it is recommended to consider a 2mm placement inhibit area around the module on the application. As a general rule for an SMT component, avoid having any mechanical part of the application in direct contact with the module.

  • Page 30: Pcb Pad Design

    SE868SY-D Hardware Design Guide PCB Pad Design Non-solder mask defined (NSMD) type is recommended for the solder pads on the PCB. Figure 10: PCB Solder Pad Recommendations Pad design shall comply with the following specification Figure 11: Pad Design Specifications Note: Dimensions in mm.
  • Page 31 SE868SY-D Hardware Design Guide Finish Layer Thickness (um) Properties Good solderability protection, high shear Electro-less Ni / Immersion Au 3 –7 / 0.03 – 0.15 force values Table 24: Recommendations for PCB Pad Surfaces The PCB must be able to resist the higher temperatures that occur during the lead-free process.

  • Page 32: Stencil

    SE868SY-D Hardware Design Guide Stencil The stencil’s apertures layout can be the same as the recommended footprint (1:1), a thickness of stencil foil ≥ 120 µm is recommended. Solder Paste Item Lead Free Solder Paste Sn/Ag/Cu Table 25: Solder Paste It is recommended to use a “no-Clean”...
  • Page 33 8 minutes max. Table 26: Solder Reflow Profile Specifications Note: All temperatures refer to topside of the package, as measured on the package body surface. Warning: The SE868SY-D module withstands one reflow process only. 1VV0301705 Rev. 5 Page 33 of 44...

  • Page 34: Packaging

    SE868SY-D Hardware Design Guide 10. PACKAGING Reel Figure 13: Modules Shipped in Reel Form 1VV0301705 Rev. 5 Page 34 of 44 2021-12-15 Not Subject to NDA...

  • Page 35: Tray

    SE868SY-D Hardware Design Guide Tray Figure 14: Modules Shipped in Tray Form 1VV0301705 Rev. 5 Page 35 of 44 2021-12-15 Not Subject to NDA...
  • Page 36 SE868SY-D Hardware Design Guide Figure 15: Packaging Detail 1VV0301705 Rev. 5 Page 36 of 44 2021-12-15 Not Subject to NDA...

  • Page 37: Conformity Assessment Issues

    SE868SY-D Hardware Design Guide 11. CONFORMITY ASSESSMENT ISSUES EU RED Declaration of Conformity Hereby, Telit Communications S.p.A declares that the SE868SY-D Module is in compliance with Directive 2014/53/EU. The full text of the EU declaration of conformity is available at the following internet address: http://www.telit.com\red...

  • Page 38: Product And Safety Information

    SE868SY-D Hardware Design Guide PRODUCT AND SAFETY INFORMATION Copyrights and Other Notices SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE Although reasonable efforts have been made to ensure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from the use of the information contained herein.

  • Page 39: Usage And Disclosure Restrictions

    SE868SY-D Hardware Design Guide computer programs, including – but not limited to - the exclusive right to copy or reproduce in any form the copyrighted products. Accordingly, any copyrighted computer programs contained in Telit’s products described in this instruction manual shall not be copied (reverse engineered) or reproduced in any manner without the express written permission of the copyright owner, being Telit or the Third-Party software supplier.

  • Page 40: Trademarks

    SE868SY-D Hardware Design Guide 12.2.4. Trademarks TELIT and the Stylized T-Logo are registered in the Trademark Office. All other product or service names are property of their respective owners. 12.2.5. Third Party Rights The software may include Third Party’s software Rights. In this case the user agrees to comply with all terms and conditions imposed in respect of such separate software rights.

  • Page 41: Safety Recommendations

    SE868SY-D Hardware Design Guide Safety Recommendations Make sure the use of this product is allowed in your country and in the environment required. The use of this product may be dangerous and must be avoided in areas where: • it can interfere with other electronic devices, particularly in environments such as hospitals, airports, aircrafts, etc.

  • Page 42: Glossary

    SE868SY-D Hardware Design Guide GLOSSARY BEIDOU Chinese regional navigation satellite system Clock CMOS Complementary Metal – Oxide Semiconductor Equivalent Series Resistance GALILEO European global navigation satellite system GLONASS Russian global navigation satellite system GNSS Global Navigation Satellite System GPIO General Purpose Input Output...

  • Page 43: Document History

    SE868SY-D Hardware Design Guide 14. DOCUMENT HISTORY Revision Date Changes 2021-12-15 Updated the following sections: • 3.1 Pin-Out • 4.2 Power Consumption • 5.2.2 Host Interface Selection • 9.1Recommended Footprint for the Application • 11.1 EU RED Declaration of Conformity Updated chapter 13.

Table of Contents