Telit Wireless Solutions SE868SY-D Design Manual
  1. Manuals
  2. Brands
  3. Telit Wireless Solutions Manuals
  4. Wireless modules
  5. SE868SY-D
  6. Design manual

Telit Wireless Solutions SE868SY-D Design Manual

Hide thumbs Also See for SE868SY-D:
Table of Contents

Advertisement

Quick Links

Download this manual
SE868SY-D
HW Design Guide
1VV0301705 Rev. – 2021-10-01
Telit Technical Documentation

Advertisement

Table of Contents
loading
Need help?

Need help?

Do you have a question about the SE868SY-D and is the answer not in the manual?

Questions and answers

Subscribe to Our Youtube Channel

Related Manuals for Telit Wireless Solutions SE868SY-D

Summary of Contents for Telit Wireless Solutions SE868SY-D

  • Page 1 SE868SY-D HW Design Guide 1VV0301705 Rev. – 2021-10-01 Telit Technical Documentation...

  • Page 2: Applicability Table

    SE868SY-D Hardware Design Guide APPLICABILITY TABLE PRODUCTS SE868SY-D 1VV0301705 Rev. Page 2 of 46 2021-06-10 Not Subject to NDA...

  • Page 3: Table Of Contents

    SE868SY-D Hardware Design Guide CONTENTS APPLICABILITY TABLE CONTENTS INTRODUCTION Scope Audience Contact Information, Support Symbol Conventions Related Documents GENERAL PRODUCT DESCRIPTION Overview Product Variants and Supported Satellite Systems Target Market Block Diagram Main features Mechanical Specifications 2.6.1. Dimensions 2.6.2. Weight...
  • Page 4 SE868SY-D Hardware Design Guide Logic Levels Communication Ports 5.2.1. Communication Interfaces to the Host MCU (HIF) 5.2.2. Host Interface Selection Digital I/O 5.3.1. nRESET 5.3.2. LNA Enable 5.3.3. 1PPS 5.3.4. SYSTEM ON PRODUCT PERFORMANCE Horizontal Position Accuracy Time to First Fix...
  • Page 5 SE868SY-D Hardware Design Guide PACKAGING Reel Tray CONFORMITY ASSESSMENT ISSUES EU RED Declaration of Conformity PRODUCT AND SAFETY INFORMATION Copyrights and Other Notices 12.1.1. Copyrights 12.1.2. Computer Software Copyrights Usage and Disclosure Restrictions 12.2.1. License Agreements 12.2.2. Copyrighted Materials 12.2.3.

  • Page 6: Introduction

    SE868SY-D Hardware Design Guide 1. INTRODUCTION Scope This document introduces the SE868SY-D module and presents possible and recommended hardware solutions for the development of a product based on this module. All the features and solutions described in this document are applicable to all the variants listed in the applicability table.

  • Page 7: Symbol Conventions

    SE868SY-D Hardware Design Guide Symbol Conventions Danger: This information MUST be followed or catastrophic equipment failure or personal injury may occur. Warning: Alerts the user on important steps about the module integration. Note/Tip: Provides advice and suggestions that may be useful when integrating the module.

  • Page 8: General Product Description

    The SE868SY-D module is a multi-frequency and multi constellation GNSS receiver, the latest addition to the xE868 family. The SE868SY-D product, exploiting the two GNSS bands L1 and L5, achieves sub-meter accuracy and reduces the multipath effects typical of urban canyons.

  • Page 9: Block Diagram

    SE868SY-D Hardware Design Guide • Asset/personal tracking • Sport equipment • E-mobility • Drones Block Diagram Figure 1: SE868SY-D Block Diagram Main features Function Features GNSS Multi-constellation and Multi-bands Low power consumption High-Dynamics (25Hz update rate – in progress) Geofence (in progress)

  • Page 10: Mechanical Specifications

    Table 4: Temperature Range Magnetic field immunity Since the SE868SY-D has an embedded MRAM as a NVM (Non-Volatile Memory) for its program code and data storage, the customer should care about environment magnetic field strength for good retention performance as indicated in Table 5.

  • Page 11: Pins Allocation

    SE868SY-D Hardware Design Guide 3. PINS ALLOCATION Pin-out Signal Function Type Notes Host Interface (HIF) UART function: UART-TX (HIF) UART_TX function: I2C-SDA (HIF) DIGITAL 1.8V function: SPI-MOSI (HIF) function: UART-RX (HIF) UART_RX function: I2C-SCL (HIF) DIGITAL 1.8V function: SPI-SCLK (HIF)
  • Page 12 SE868SY-D Hardware Design Guide Signal Function Type Notes RF_IN L1-L5 band RF signal input ANALOG RF Power Supply VDD18 Power supply Power 1.8V Power 1.8V (Standard P/N) VDD18 Power supply Power 0.8 V (Low Power P/N) VDD18 Power supply Power 1.8V...

  • Page 13: Lga Pads Layout

    SE868SY-D Hardware Design Guide LGA Pads Layout TOP VIEW Figure 2: LGA Pads Layout 1VV0301705 Rev. Page 13 of 46 2021-06-10 Not Subject to NDA...

  • Page 14: Power Supply

    SE868SY-D Hardware Design Guide 4. POWER SUPPLY The power supply circuitry and board layout are a very important part in the full product design, and they strongly reflect on the product overall performances. Please carefully read the requirements and the guidelines that will follow for a proper design.

  • Page 15: General Design Rules

    SE868SY-D Hardware Design Guide Low Power P/N GPS L1 only G3BQ L1 only GPS L1+L5 G3BQ L1+L5 L1+L5 Acquisition (avg) 38 mW 35 mW 43 mW 40 mW 36 mW Acquisition (max) 41 mW 44 mW 45 mW 49 mW...

  • Page 16: Power Supply Pcb Layout Guidelines

    SE868SY-D Hardware Design Guide depicted in Figure 5, in low power P/N, the DC-DC enable PIN (CE) must be connected to the SYS_ON signal, exported on pin 5 of SE868SY-D, to ensure the module entering in deep sleep state. Figure 4: An example of a Suitable 1.8 V DC-DC converter Figure 5: An example of a Suitable 0.8 V DC-DC converter...
  • Page 17 • The low ESR bypass capacitor must be placed close to the Telit SE868SY-D power input pads; in case the power supply is a switching type, it can be placed close to the switching inductor to cut the ripple.

  • Page 18: Digital Section

    Communication Ports 5.2.1. Communication Interfaces to the Host MCU (HIF) The SE868SY-D features three different Host Interfaces (HIF) for communicating with the host MCU that can be alternatively selected by means of Host Interface Selection pin (See Section 5.2.2): •...

  • Page 19: Host Interface Selection

    5.2.2. Host Interface Selection In the SE868SY-D the different Host Interface (HIF) options described in the previous section can be selected by means of two pins, namely HIF_SEL_0 and HIF_SEL_1, whose value is checked at the power ON. HIF_SEL_0 and HIF_SEL_1 are internally pulled down: this implies that the HIF is set to UART by default.

  • Page 20: Digital I/O

    LNA_EN is an output signal, mapped on pin 26, which can be used as an enable for external LNA. The SE868SY-D embeds an internal LNA with a 17 dB gain for both the L1 and L5 band. If higher gain is required, an external LNA can be added to the RF path. We recommend a maximum external gain of 8 dB for better EMI performances, however a gain up to 33 dB can be accepted as indicated in the table below.

  • Page 21: Product Performance

    GPS, GLO, GAL, QZSS, BDS L1+L5 Cold Test Conditions: Static scenario, -130 dBm, Full Power mode Table 18: SE868SY-D - Time to First Fix Additional values for other supported bands/constellations will be provided in the next document revisions. 1VV0301705 Rev.

  • Page 22: Sensitivity

    Navigation L1+L5 -163 Tracking (preliminary) Test conditions: Static scenario, Full Power mode Table 19: SE868SY-D - Sensitivity Additional values for other supported bands/constellations will be provided in the next document revisions. 1VV0301705 Rev. Page 22 of 46 2021-06-10 Not Subject to NDA...

  • Page 23: Rf Section

    GNSS RF Signal Pin-out RF Front End Design The SE868SY-D Module embeds an internal LNA but, at the same time, the dynamics of the device allow for higher external gain (Section 5.3.2). Therefore, both passive and active antenna (antenna with a built-in low noise amplifier) can be used. In the latter case, the active antenna must be supplied with proper bias-tee circuit.

  • Page 24: Reference Design For Active Antenna

    Guidelines of PCB Line for GNSS Antenna When using the SE868SY-D, since there's no antenna connector on the module, the antenna must be connected to the SE868SY-D antenna pad by means of a transmission line implemented on the PCB. •...

  • Page 25: Gnss Antenna Requirements

    SE868SY-D Hardware Design Guide • Surround (on both the sides, above and below) the antenna line on PCB with Ground, avoid having other signal tracks directly facing the antenna line of track. • The ground around the antenna line on PCB must be strictly connected to the Ground Plane by placing vias once per 2mm at least.

  • Page 26: Powering The External Lna (Active Antenna)

    Powering the External LNA (Active Antenna) The LNA of active antenna needs a source of power as the DC voltage needed by the active antenna is not supplied by the SE868SY-D module but can be easily included by the host design.

  • Page 27: Mechanical Design

    SE868SY-D Hardware Design Guide 8. MECHANICAL DESIGN Drawing Figure 8: Mechanical Design Drawing Note: Dimensions in mm. The tolerance is not cumulative. 1VV0301705 Rev. Page 27 of 46 2021-06-10 Not Subject to NDA...

  • Page 28: Application Pcb Design

    Recommended Footprint for the Application Figure 9: COPPER PATTERN (top view) In order to easily rework the SE868SY-D it is suggested to consider on the application a 2mm placement inhibit area around the module. It is also suggested, as a common rule for a SMT component, to avoid having any mechanical part of the application in direct contact with the module.

  • Page 29: Pcb Pad Design

    SE868SY-D Hardware Design Guide PCB Pad Design Non solder mask defined (NSMD) type is recommended for the solder pads on the PCB. Copper Pad Solder Mask NSMD (Non Solder Mask Defined) (Solder Mask Defined) Figure 10: PCB Solder Pad Recommendations...
  • Page 30 SE868SY-D Hardware Design Guide It is not recommended to place vias or micro-vias not covered by solder resist in an area of 0.3 mm around the pads unless they carry the same signal as the pad itself. Holes in pad are allowed only for blind holes and not for through holes.

  • Page 31: Stencil

    SE868SY-D Hardware Design Guide Stencil Stencil’s apertures layout can be the same as the recommended footprint (1:1), we suggest a thickness of stencil foil ≥ 120 µm. Solder Paste Item Lead Free Solder Paste Sn/Ag/Cu Table 24: Solder Paste We recommend using a “no-Clean” process to avoid the cleaning of the modules after assembly.
  • Page 32 8 minutes max. Table 25: Solder reflow profile specifications Note: All temperatures refer to topside of the package, measured on the package body surface Warning: THE SE868SY-D MODULE WITHSTANDS ONE REFLOW PROCESS ONLY. 1VV0301705 Rev. Page 32 of 46 2021-06-10...

  • Page 33: Packaging

    SE868SY-D Hardware Design Guide 10. PACKAGING Reel Figure 13: Modules shipped in Reel form 1VV0301705 Rev. Page 33 of 46 2021-06-10 Not Subject to NDA...

  • Page 34: Tray

    SE868SY-D Hardware Design Guide Tray Figure 14: Modules Shipped in Tray Form 1VV0301705 Rev. Page 34 of 46 2021-06-10 Not Subject to NDA...
  • Page 35 SE868SY-D Hardware Design Guide Figure 15: Packaging Detail 1VV0301705 Rev. Page 35 of 46 2021-06-10 Not Subject to NDA...

  • Page 36: Conformity Assessment Issues

    SE868SY-D Hardware Design Guide 11. CONFORMITY ASSESSMENT ISSUES EU RED Declaration of Conformity This section will be available in a next document revisions. 1VV0301705 Rev. Page 36 of 46 2021-06-10 Not Subject to NDA...

  • Page 37: Product And Safety Information

    SE868SY-D Hardware Design Guide PRODUCT AND SAFETY INFORMATION Copyrights and Other Notices SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE Although reasonable efforts have been made to ensure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from the use of the information contained herein.

  • Page 38: Usage And Disclosure Restrictions

    SE868SY-D Hardware Design Guide computer programs, including – but not limited to - the exclusive right to copy or reproduce in any form the copyrighted products. Accordingly, any copyrighted computer programs contained in Telit’s products described in this instruction manual shall not be copied (reverse engineered) or reproduced in any manner without the express written permission of the copyright owner, being Telit or the Third Party software supplier.

  • Page 39: Trademarks

    SE868SY-D Hardware Design Guide 12.2.4. Trademarks TELIT and the Stylized T-Logo are registered in the Trademark Office. All other product or service names are property of their respective owners. 12.2.5. Third Party Rights The software may include Third Party’s software Rights. In this case the user agrees to comply with all terms and conditions imposed in respect of such separate software rights.

  • Page 40: Safety Recommendations

    SE868SY-D Hardware Design Guide Safety Recommendations Make sure the use of this product is allowed in your country and in the environment required. The use of this product may be dangerous and has to be avoided in areas where: • it can interfere with other electronic devices, particularly in environments such as hospitals, airports, aircrafts, etc.

  • Page 41: Glossary

    SE868SY-D Hardware Design Guide 13. GLOSSARY AGPS Assisted (or Aided) GPS AGPS provides ephemeris data to the receiver to allow faster cold start times than would be possible using only broadcast data. This extended ephemeris data can be either server-generated or locally-generated.
  • Page 42 SE868SY-D Hardware Design Guide Large, momentary, unwanted electrical currents that can cause damage to electronic equipment. GAGAN The Indian SBAS system. Galileo The European GNSS currently being built by the European Union (EU) and European Space Agency (ESA). GDOP Geometric Dilution of Precision A factor used to describe the effect of satellite geometry on the accuracy of the time and position solution of a GNSS receiver.
  • Page 43 SE868SY-D Hardware Design Guide Local Ephemeris Extended Ephemeris (that is predicted) data, calculated by the prediction data receiver from broadcast data received from satellites, which is stored in memory. It is usually useful for up to three days. See AGPS.
  • Page 44 SE868SY-D Hardware Design Guide Surface Acoustic Wave filter Electromechanical device used radio frequency applications. SAW filters are useful at frequencies up to 3 GHz. SBAS Satellite Based Augmentation System A system that uses a network of ground stations and geostationary satellites to provide differential corrections to GNSS receivers.

  • Page 45: Document History

    SE868SY-D Hardware Design Guide 14. DOCUMENT HISTORY Revision Date Changes 2021-10-01 Minor changes on the language and the layout Updated the following sections: 2.4; 3.1; 3.2; 4.1; 4.2; 4.3; 5.2; 5.3; 6.1; 6.2; 6.3; 14 2021-06-10 Minor changes on the language and the layout Legal Notices updated Updated the following sections: 2.5;...

Table of Contents