Huawei MC509 Series Hardware Manual page 6

HUAWEI MC509 Series CDMA LGA Module
Hardware Guide
3.12 Reserved Interface ....................................................................................................................... 44
3.13 NC Interface ................................................................................................................................. 44
4 RF Specifications ......................................................................................................................... 45
4.1 About This Chapter ......................................................................................................................... 45
4.2 Antenna Installation Guidelines ...................................................................................................... 45
4.3 Operating Frequencies ................................................................................................................... 45
4.4 Conducted RF Measurement ......................................................................................................... 46
4.4.1 Test Environment ................................................................................................................... 46
4.4.2 Test Standards ....................................................................................................................... 46
4.5 Conducted Rx Sensitivity and Tx Power ........................................................................................ 46
4.5.1 Conducted Receive Sensitivity .............................................................................................. 46
4.5.2 Conducted Transmit Power ................................................................................................... 47
4.6 Antenna Design Requirements ...................................................................................................... 47
4.6.1 Antenna Design Indicators..................................................................................................... 47
4.6.2 Interference ........................................................................................................................... 50
4.6.3 CDMA Antenna Requirements .............................................................................................. 50
4.6.4 Radio Test Environment ........................................................................................................ 51
5 Electrical and Reliability Features ........................................................................................... 52
5.1 About This Chapter ......................................................................................................................... 52
5.2 Extreme Working Conditions .......................................................................................................... 52
5.3 Operating and Storage Temperatures and Humidity ...................................................................... 53
5.4 Electrical Features of Application Interfaces .................................................................................. 53
5.5 Power Supply Features .................................................................................................................. 54
5.5.1 Input Power Supply ............................................................................................................... 54
5.5.2 Power Consumption .............................................................................................................. 54
5.6 Reliability Features ......................................................................................................................... 55
5.7 EMC and ESD Features ................................................................................................................. 56
6 Mechanical Specifications ......................................................................................................... 58
6.1 About This Chapter ......................................................................................................................... 58
6.2 Storage Requirement ..................................................................................................................... 58
6.3 Moisture Sensitivity ........................................................................................................................ 58
6.4 Dimensions and interfaces ............................................................................................................. 59
6.5 PCB Pad Design ............................................................................................................................ 61
6.6 Packaging ....................................................................................................................................... 61
6.7 Label ............................................................................................................................................... 63
6.8 Customer PCB Design ................................................................................................................... 64
6.8.1 PCB Surface Finish ............................................................................................................... 64
6.8.2 PCB Pad Design .................................................................................................................... 65
6.8.3 Solder Mask ........................................................................................................................... 65
6.8.4 Requirements on PCB Layout ............................................................................................... 65
6.9 Assembly Processes ...................................................................................................................... 66
Issue 02 (2013-05-06)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
Content
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