Label - Huawei MC509 Series Hardware Manual

HUAWEI MC509 Series CDMA LGA Module
Hardware Guide

6.7 Label

The label is made from deformation-resistant, fade-resistant, and high-temperature-
resistant material and is able to endure the high temperature of 260º C.
Issue 02 (2013-05-06)
A secondary SMT assembly will be conducted on the LGA modules. To keep LGA modules

dry and ensure a quality secondary SMT assembly, use vacuum packing for the LGA
modules in accordance with the packing standards for Moisture Sensitivity Level (MSL) 3
components.
 Include desiccant and humidity indicators in the packages. Attach the packages with labels
indicating that the LGA modules contained in the packages are MSL 3 components.
 Packages must be made of ESD materials. Packages or containers must be attached with
ESD labels.
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Mechanical Specifications
Orient LGA modules in the specified
direction.
Module quantity per tray: 5 x 9 = 45
pcs/tray
6 trays in each vacuum package. Do
not place any modules on the tray at
the top of each package.
Total quantity per package: 5 x 45 =
225pcs/vacuum package.
Use vacuum packages; one package
per carton; module quantity per carton:
5 x 45 = 225pcs/carton.
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