Pcb Pad Design; Solder Mask; Requirements On Pcb Layout - Huawei MC509 Series Hardware Manual

Cdma lga module

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HUAWEI MC509 Series CDMA LGA Module

Hardware Guide

6.8.2 PCB Pad Design

To achieve assembly yields and solder joints of high reliability, it is recommended that

the PCB pad size be designed as follows:

Figure 6-5 Design of the solder pads on customers' PCBs (Unit: mm)

NSMD is recommended. In addition, the solder mask of the NSMD pad design is

larger than the pad so the reliability of the solder joint can be improved.

The solder mask must be 100 µm–150 µm larger than the pad, that is, the single side

of the solder mask must be 50 µm–75 µm larger than the pad. The specific size

depends on the processing capability of the PCB manufacturer.

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Issue 02 (2013-05-06)

To reduce deformation, a thickness of at least 1.0 mm is recommended.

Other devices must be located more than 3 mm (5 mm recommended) away

from the LGA module. The minimum distance between the LGA module and the

PCB edge is 0.5 mm.

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Mechanical Specifications

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