Huawei ME909 Series Hardware Manual
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Huawei ME909 Series Hardware Manual

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HUAWEI ME909 Series LTE LGA Module
Hardware Guide
Issue
V0.3
Date
2013-05-21

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  • Page 1 HUAWEI ME909 Series LTE LGA Module Hardware Guide Issue V0.3 Date 2013-05-21...
  • Page 2 E-mail: mobile@huawei.com Please refer color and shape to product. Huawei reserves the right to make changes or improvements to any of the products without prior notice. Copyright © Huawei Technologies Co., Ltd. 2013. All rights Reserved. No part of this document may be reproduced or transmitted in any form or by any means without prior written consent of Huawei Technologies Co., Ltd.
  • Page 3 HUAWEI ME909 Series LTE LGA Module Hardware Guide About This Document About This Document Revision History Document Date Chapter Descriptions Version V0.1 2013-01-21 Draft brief version V0.2 2013-02-07 Draft brief version Reserve some interfaces Explain UART2 for debugging Fix a mistake: Pin 27 should be reserved V0.3...

  • Page 4: Table Of Contents

    HUAWEI ME909 Series LTE LGA Module Hardware Guide Contents Contents 1 Introduction............................ 7 2 Overall Description ........................8 2.1 About This Chapter ........................... 8 2.2 Function Overview..........................8 2.3 Circuit Block Diagram ........................10 2.4 Application Block Diagram ......................11 3 Description of the Application Interfaces ................
  • Page 5 HUAWEI ME909 Series LTE LGA Module Hardware Guide Contents 3.12 Reserved Interface ........................39 3.13 NC Interface ..........................39 3.14 Tunable Antenna Control ......................39 4 RF Specifications ......................... 40 4.1 About This Chapter ......................... 40 4.2 Operating Frequencies ........................40 4.3 Conducted RF Measurement ......................
  • Page 6 HUAWEI ME909 Series LTE LGA Module Hardware Guide Contents 6.8.1 General Description of Assembly Processes ................ 68 6.8.2 Stencil Design ........................68 6.8.3 Reflow Profile ........................69 6.9 Specification of Rework ........................71 6.9.1 Process of Rework ........................ 71 6.9.2 Preparations of Rework ......................71 6.9.3 Removing of the Module......................

  • Page 7: Introduction

    Introduction Introduction This document describes the hardware application interfaces and air interfaces provided by HUAWEI ME909 Series LTE LGA module (ME909u-521, ME909u-121 and ME909u-721). This document helps hardware engineer to understand the interface specifications, electrical features and related product information of the ME909 module.

  • Page 8: Overall Description

    HUAWEI ME909 Series LTE LGA Module Hardware Guide Overall Description Overall Description 2.1 About This Chapter This chapter gives a general description of the ME909 module and provides:  Function Overview  Circuit Block Diagram  Application Block Diagram 2.2 Function Overview...
  • Page 9 HUAWEI ME909 Series LTE LGA Module Hardware Guide Overall Description Feature Description Application One standard USIM (Universal Subscriber Identity Module) card Interface (Class B and Class C) (145-pin LGA Audio interface: PCM interface interface) USB 2.0 (High Speed) Two 4-wire UARTs...

  • Page 10: Circuit Block Diagram

    HUAWEI ME909 Series LTE LGA Module Hardware Guide Overall Description [1]: When the temperature is outside of the range –20° C to +70° C, the module might slightly deviate from 3GPP TS 45.005 and 3GPP TS 34.121-1 specifications. [2]: Currently firmware supports one 2-wire UART only.

  • Page 11: Application Block Diagram

    HUAWEI ME909 Series LTE LGA Module Hardware Guide Overall Description 2.4 Application Block Diagram Figure 2-2 Application block diagram of the ME909 module The module supports 3 UART interfaces. Two are 4-wire UART Interface: UARTs, and the last one is 2-wire UART, which is only for debugging.

  • Page 12: Description Of The Application Interfaces

    HUAWEI ME909 Series LTE LGA Module Hardware Guide Description of the Application Interfaces Description of the Application Interfaces 3.1 About This Chapter This chapter mainly describes the external application interfaces of the ME909 module, including:  LGA Interface  Power Interface ...
  • Page 13 GPIO pads JTAG pads Reserved pads Tunable Antenna Figure 3-2 shows the appearance of ME909 series module. One is top view, and the other is bottom view. Huawei Proprietary and Confidential Issue V0.3 (2013-05-21) Copyright © Huawei Technologies Co., Ltd.
  • Page 14 HUAWEI ME909 Series LTE LGA Module Hardware Guide Description of the Application Interfaces Figure 3-2 Appearance of ME909 series module (without label) Table 3-1 shows the definitions of pins on the 145-pin signal interface of the ME909 module. Table 3-1 Definitions of pins on the LGA interface...
  • Page 15 HUAWEI ME909 Series LTE LGA Module Hardware Guide Description of the Application Interfaces Pin Name Description DC Characteristics (V) Normal Min. Typ. Max. –0.3 PS_HOLD Power supply hold signal to PMU, used for JTAG –0.3 SLEEP_STATUS Indicates sleep status of...
  • Page 16 HUAWEI ME909 Series LTE LGA Module Hardware Guide Description of the Application Interfaces Pin Name Description DC Characteristics (V) Normal Min. Typ. Max. Not connected, please keep this pin open SIM_VCC Output power supply for 1.8/2.85 USIM card Reserved Reserved, must keep this pin open –0.3...
  • Page 17 HUAWEI ME909 Series LTE LGA Module Hardware Guide Description of the Application Interfaces Pin Name Description DC Characteristics (V) Normal Min. Typ. Max. Ground –0.3 GPIO General I/O pins. The function of these pins has not been defined Ground Ground...
  • Page 18 HUAWEI ME909 Series LTE LGA Module Hardware Guide Description of the Application Interfaces Pin Name Description DC Characteristics (V) Normal Min. Typ. Max. –0.3 UART0_RTS UART0 Ready for receive Reserved Reserved, must keep this pin open –0.3 UART0_TX UART0 transmit output...
  • Page 19 HUAWEI ME909 Series LTE LGA Module Hardware Guide Description of the Application Interfaces Pin Name Description DC Characteristics (V) Normal Min. Typ. Max. Not connected, please keep this pin open Not connected, please keep this pin open Not connected, please...
  • Page 20 HUAWEI ME909 Series LTE LGA Module Hardware Guide Description of the Application Interfaces Pin Name Description DC Characteristics (V) Normal Min. Typ. Max. –0.3 GPIO General I/O pins. The function of these pins has not been defined Ground AUX_ANT RF aux antenna pad...
  • Page 21 HUAWEI ME909 Series LTE LGA Module Hardware Guide Description of the Application Interfaces Pin Name Description DC Characteristics (V) Normal Min. Typ. Max. Thermal Ground Pad, this pad need thermal Thermal Ground Pad, this pad need thermal Thermal Ground Pad,...

  • Page 22: Power Interface

    HUAWEI ME909 Series LTE LGA Module Hardware Guide Description of the Application Interfaces Pin Name Description DC Characteristics (V) Normal Min. Typ. Max. Thermal Ground Pad, this pad need thermal Thermal Ground Pad, this pad need thermal Thermal Ground Pad,...

  • Page 23: Power Supply Vbat Interface

    HUAWEI ME909 Series LTE LGA Module Hardware Guide Description of the Application Interfaces Pin No. Signal Description DC Characteristics (V) Name Min. Typ. Max. 48–50, 52–54, 56–59, 106, 108, 110, 112, 114, 116 Pin for external VCC_EXT1 1.75 1.85 power output...

  • Page 24: Output Power Supply Interface

    HUAWEI ME909 Series LTE LGA Module Hardware Guide Description of the Application Interfaces Figure 3-3 Recommended power circuit of ME909 module Module (DCE) VBAT VBAT 10 μF 220 μF 220 μF 220 μF 220 μF 220 μF 100 nF When the system power restarts, a discharge circuit is recommended to make sure the power voltage drops below 1.8 V and stays for 100 ms at least.

  • Page 25: Power-On/Off (Power_On_Off) Pin

    HUAWEI ME909 Series LTE LGA Module Hardware Guide Description of the Application Interfaces Table 3-3 Definitions of the pins on the signal control interface DC Characteristics (V) Pin Name Description Min. Typ. Max. Pin for controlling power-on and Pulled up...

  • Page 26: Resin_N Pins

    HUAWEI ME909 Series LTE LGA Module Hardware Guide Description of the Application Interfaces Figure 3-4 Connections of the POWER_ON_OFF pin 3.4.3 RESIN_N Pins The RESIN_N pin is used to reset the module’s system. When the software stops responding, the RESIN_N pin can be pulled down to reset the hardware.
  • Page 27 HUAWEI ME909 Series LTE LGA Module Hardware Guide Description of the Application Interfaces Power-On Time Sequence After VBAT has been applied and is stable, the POWER_ON_OFF signal is pulled down, and then the module will boot up. During power on timing, please make sure the VBAT is stable.

  • Page 28: Wakeup_In Signal

    HUAWEI ME909 Series LTE LGA Module Hardware Guide Description of the Application Interfaces Parameter Comments Time (Nominal values) Units POWER_ON_OFF Valid to USB D+ low RESIN_N The ME909 module supports hardware reset function. If the software of the ME909 module stops responding, you can reset the hardware through the RESIN_N signal as shown in Figure 3-8 .When a low-level pulse is supplied through the RESIN_N pin, the...

  • Page 29: Wakeup_Out Signal

    HUAWEI ME909 Series LTE LGA Module Hardware Guide Description of the Application Interfaces Figure 3-9 Connections of the WAKEUP_IN pin The pull up resistor should not be greater than 22 kΩ. 3.4.5 WAKEUP_OUT Signal The WAKEUP_OUT signal is used to wake up the external devices. Its drive current is no more than 2 mA.

  • Page 30: Sleep_Status Signal

    HUAWEI ME909 Series LTE LGA Module Hardware Guide Description of the Application Interfaces 3.4.6 SLEEP_STATUS Signal SLEEP_STATUS signal is used to indicate the sleep status of ME909. The external devices can get to know whether the module is in sleep mode by reading SLEEP_STATUS pin.

  • Page 31: Uart Interface

    HUAWEI ME909 Series LTE LGA Module Hardware Guide Description of the Application Interfaces Figure 3-12 Driving circuit 3.5 UART Interface 3.5.1 Overview The ME909 module is projected to provide two UART interfaces for asynchronous communication channels. They are UART0 (4-wire UART) and UART1 (4-wire UART).

  • Page 32: Circuit Recommended For The Uart Interface

    HUAWEI ME909 Series LTE LGA Module Hardware Guide Description of the Application Interfaces Pin Name Description DC Characteristics (V) Min. Typ. Max. –0.3 UART1_RX UART1 receive data input –0.3 UART2_TX UART2 transmit output –0.3 UART2_RX UART2 receive data input 3.5.2 Circuit Recommended for the UART Interface...

  • Page 33: Usb Interface

    HUAWEI ME909 Series LTE LGA Module Hardware Guide Description of the Application Interfaces 3.6 USB Interface The ME909 is compliant with USB 2.0 High speed protocol. The USB interface is powered directly from the VBAT supply. The USB signal lines are compatible with the USB 2.0 signal specifications.

  • Page 34: Usim Card Interface

    HUAWEI ME909 Series LTE LGA Module Hardware Guide Description of the Application Interfaces 3.7 USIM Card Interface 3.7.1 Overview The ME909 module provides a USIM card interface complying with the ISO 7816-3 standard and supports both Class B and Class C USIM cards.

  • Page 35: Audio Interface

    HUAWEI ME909 Series LTE LGA Module Hardware Guide Description of the Application Interfaces  To meet the requirements of 3GPP TS 51.010-1 protocols and electromagnetic compatibility (EMC) authentication, the USIM socket should be placed near the LGA interface (it is recommended that the PCB circuit connects the LGA interface and the USIM socket does not exceed 100 mm), because a long circuit may lead to wave distortion, thus affecting signal quality.

  • Page 36: General Purpose I/O Interface

    HUAWEI ME909 Series LTE LGA Module Hardware Guide Description of the Application Interfaces Figure 3-16 Circuit diagram of the interface of the PCM (ME909 is used as PCM master)  PCM_SYNC: Output when PCM is in master mode; PCM_CLK: Output when PCM is in master mode;...

  • Page 37: Jtag Interface

    HUAWEI ME909 Series LTE LGA Module Hardware Guide Description of the Application Interfaces 3.10 JTAG Interface The ME909 module provides Joint Test Action Group (JTAG) interface. Table 3-12 shows the signals on the JTAG interface. It is recommended that route out the 9 pins as test points on the DTE for tracing and debugging.

  • Page 38: Rf Antenna Interface

    HUAWEI ME909 Series LTE LGA Module Hardware Guide Description of the Application Interfaces  JTAG reset pin of ME909 is different from that of MU509, MC509 and MU609.  JTAG_SRST_N must be dealt with ESD protection as follow. The 1 kΩ resistor and 4.7 nFcapacitor must be placed as close as possible to ME909.

  • Page 39: Reserved Interface

    HUAWEI ME909 Series LTE LGA Module Hardware Guide Description of the Application Interfaces 3.12 Reserved Interface The ME909 module provides 24 reserved pins. All reserved pins cannot be used by the customer. All of them must be leave unconnected. Table 3-14 Reserved pin Pin No.

  • Page 40: Rf Specifications

    HUAWEI ME909 Series LTE LGA Module Hardware Guide RF Specifications RF Specifications 4.1 About This Chapter This chapter describes the RF specifications of the ME909 module, including:  Operating Frequencies  Conducted RF Measurement  Conducted Rx Sensitivity and Tx Power ...

  • Page 41: Conducted Rf Measurement

    The instrument compensation needs to be set according to the actual cable conditions.  4.3.2 Test Standards Huawei modules meet 3GPP TS 51.010-1, 3GPP TS 34.121-1 and 3GPP TS 36.521-1 test standards. Each module passes strict tests at the factory and thus the quality of the modules is guaranteed.
  • Page 42 HUAWEI ME909 Series LTE LGA Module Hardware Guide RF Specifications Table 4-2 ME909u-521 conducted Rx sensitivity (Unit: dBm) 3GPP Item ME909u-521 Test Value (dBm) Protocol Min. Typ. Max. Claim (dBm) < –102 GSM850 GMSK (BER<2.43%) < –98 8PSK (MCS5, BLER<10%) <...

  • Page 43: Conducted Transmit Power

    HUAWEI ME909 Series LTE LGA Module Hardware Guide RF Specifications Table 4-3 ME909u-521 GPS main characteristics Item Type Value Receive Sensitivity(Cold start) Receive Sensitivity(Hot start) Receive Sensitivity(Tracking mode) TTFF@-130dBm(Cold start) TTFF@-130dBm(Hot start) The test values are the average of some test samples.

  • Page 44: Antenna Design Requirements

    HUAWEI ME909 Series LTE LGA Module Hardware Guide RF Specifications Item 3GPP Protocol ME909u-521 Test Value (dBm) Claim (dBm) Min. Typ. Max. WCDMA Band VIII 21 to 25 LTE Band I 21 to 25 LTE Band II 21 to 25...
  • Page 45 HUAWEI ME909 Series LTE LGA Module Hardware Guide RF Specifications The following antenna efficiency (free space) is recommended for ME909 to ensure high radio performance of the module: Efficiency of the primary antenna: ≥ 40% (below 960 MHz); ≥ 50% (over 1420 ...
  • Page 46 HUAWEI ME909 Series LTE LGA Module Hardware Guide RF Specifications Polarization The polarization of an antenna is the orientation of the electric field vector that rotates with time in the direction of maximum radiation. The linear polarization is recommended for the antenna of ME909.

  • Page 47: Interference

    RF transmission cable into account when measuring any of the preceding antenna indicators.  Huawei cooperates with various famous antenna suppliers who are able to make suggestions on antenna design, for example, Amphenol, Skycross, etc. 4.5.2 Interference Besides the antenna performance, the interference on the user board also affects the radio performance (especially the TIS) of the module.

  • Page 48: Radio Test Environment

    (TIS) Huawei has a complete set of OTA test environments (SATIMO microwave testing chambers and ETS microwave testing chambers). The testing chambers are certified by professional organizations and are applicable to testing at frequencies ranging from 380 MHz to 6 GHz.
  • Page 49 HUAWEI ME909 Series LTE LGA Module Hardware Guide RF Specifications Figure 4-1 SATIMO microwave testing chamber Huawei Proprietary and Confidential Issue V0.3 (2013-05-21) Copyright © Huawei Technologies Co., Ltd.

  • Page 50: Electrical And Reliability Features

    HUAWEI ME909 Series LTE LGA Module Hardware Guide Electrical and Reliability Features Electrical and Reliability Features 5.1 About This Chapter This chapter describes the electrical and reliability features of the interfaces in the ME909 module, including:  Absolute Ratings ...

  • Page 51: Operating And Storage Temperatures And Humidity

    HUAWEI ME909 Series LTE LGA Module Hardware Guide Electrical and Reliability Features 5.3 Operating and Storage Temperatures and Humidity Table 5-2 lists the operating and storage temperatures and humidity for the ME909 module. Table 5-2 operating and storage temperatures and humidity for the ME909 module Specification Min.

  • Page 52: Electrical Features Of Application Interfaces

    HUAWEI ME909 Series LTE LGA Module Hardware Guide Electrical and Reliability Features 5.5 Electrical Features of Application Interfaces Table 5-4 lists electrical features (typical values). Table 5-4 Electrical features of application interfaces Parameter Description Minimum Value Maximum Value Unit Logic high-level 0.65 x V...

  • Page 53: Power Consumption

    HUAWEI ME909 Series LTE LGA Module Hardware Guide Electrical and Reliability Features Table 5-6 Requirements for input current of the ME909 module Power Peak (Maximum) Normal (Maximum) Max Avg@100uS Max Avg@1S VBAT 2500 mA 1100 mA 5.6.2 Power Consumption The power consumptions of ME909 in different scenarios are respectively listed in Table 5-7 , Table 5-8 , Table 5-9 , Table 5-10 and Table 5-11 .
  • Page 54 HUAWEI ME909 Series LTE LGA Module Hardware Guide Electrical and Reliability Features Description Bands Test Value Units Notes/Configuration Module is powered up and bands idle (Idle) DRX cycle=8 (2.56 s) Module is registered on the 4G network, and PDP is activated, No data transmission.
  • Page 55 HUAWEI ME909 Series LTE LGA Module Hardware Guide Electrical and Reliability Features Description Band Test Value Units Power (dBm) (850 MHz) 10 dBm Tx Power 23.5 dBm Tx Power Band VIII 1 dBm Tx Power (900 MHz) 10 dBm Tx Power 23.5 dBm Tx Power...
  • Page 56 HUAWEI ME909 Series LTE LGA Module Hardware Guide Electrical and Reliability Features Description Band Test Value Units Power (dBm) LTE Band VIII 1 dBm Tx Power 10 dBm Tx Power 23 dBm Tx Power LTE Band VII 1 dBm Tx Power...
  • Page 57 HUAWEI ME909 Series LTE LGA Module Hardware Guide Electrical and Reliability Features Description Test Value Units Configuration 4 Up/1 Down GPRS1900 1 Up/1 Down 2 Up/1 Down 4 Up/1 Down 1 Up/1 Down 2 Up/1 Down 4 Up/1 Down EDGE850...

  • Page 58: Reliability Features

    HUAWEI ME909 Series LTE LGA Module Hardware Guide Electrical and Reliability Features Table 5-11 DC power consumption (GPS) Description Max Test Value Units Configuration GPS location request  The above values are the average of some test samples. LTE test condition: 10 MHz bandwidth, QPSK, 1RB when testing max Tx power and full RB ...

  • Page 59: Emc And Esd Features

    HUAWEI ME909 Series LTE LGA Module Hardware Guide Electrical and Reliability Features Item Test Condition Standard Salty fog test Temperature: 35° C IEC60068 Density of the NaCl solution: 5%± 1% Spraying interval: 8 h Duration of exposing the module to the temperature of 35°...
  • Page 60  A metallic or plastic case with conductive paint is recommended, except for the area around the antenna. The HUAWEI ME909 Module does not include any protection against over voltage. Huawei Proprietary and Confidential Issue V0.3 (2013-05-21) Copyright © Huawei Technologies Co., Ltd.

  • Page 61: Mechanical Specifications

    HUAWEI ME909 Series LTE LGA Module Hardware Guide Mechanical Specifications Mechanical Specifications 6.1 About This Chapter This chapter describes the process design and mechanical specifications:  Storage Requirement  Moisture Sensitivity  Dimensions and interfaces  Packaging  Label ...

  • Page 62: Dimensions And Interfaces

    HUAWEI ME909 Series LTE LGA Module Hardware Guide Mechanical Specifications Moving, storing, and processing the product must comply with IPC/JEDEC J-STD-033. 6.4 Dimensions and interfaces Figure 6-1 shows the dimensions in details. Huawei Proprietary and Confidential Issue V0.3 (2013-05-21) Copyright © Huawei Technologies Co., Ltd.
  • Page 63 HUAWEI ME909 Series LTE LGA Module Hardware Guide Mechanical Specifications Figure 6-1 Dimensions (unit: mm) Huawei Proprietary and Confidential Issue V0.3 (2013-05-21) Copyright © Huawei Technologies Co., Ltd.

  • Page 64: Packaging

    HUAWEI ME909 Series LTE LGA Module Hardware Guide Mechanical Specifications 6.5 Packaging HUAWEI LGA module uses five layers ESD pallet, anti-vibration foam and vacuum packing into cartons.  All materials used must meet eco-friendly requirements.  According to the requirements and test methods specified in EIA 541, the surface resistance Ω...

  • Page 65: Label

    HUAWEI ME909 Series LTE LGA Module Hardware Guide Mechanical Specifications Orient LGA modules in the specified direction. Module quantity per tray: 5 x 9 = 45 pcs/tray 6 trays in each vacuum package. Do not place any modules on the tray at the top of each package.

  • Page 66: Customer Pcb Design

    HUAWEI ME909 Series LTE LGA Module Hardware Guide Mechanical Specifications Figure 6-2 ME909 label (ME909u-521 for example) R=1mm 28mm 8X8mm 8X8mm 1.1*1.1mm 28mm The picture mentioned above is only for reference.   The silk-screen should be clear, without burrs, and dimension should be accurate.
  • Page 67 HUAWEI ME909 Series LTE LGA Module Hardware Guide Mechanical Specifications Figure 6-3 Footprint design of customer’s PCB (unit: mm) Figure 6-4 Thermal Pads design of customer’s PCB (unit: mm) Huawei Proprietary and Confidential Issue V0.3 (2013-05-21) Copyright © Huawei Technologies Co., Ltd.

  • Page 68: Solder Mask

    HUAWEI ME909 Series LTE LGA Module Hardware Guide Mechanical Specifications 6.7.3 Solder Mask NSMD is recommended. In addition, the solder mask of the NSMD pad design is larger than the pad so the reliability of the solder joint can be improved.

  • Page 69: Reflow Profile

    Mechanical Specifications Figure 6-5 Recommended stencil design of LGA module (unit: mm) The stencil design has been qualified for HUAWEI motherboard assembly, customers can adjust the parameters by their motherboard design and process situation to assure LGA soldering quality and no defect.
  • Page 70 HUAWEI ME909 Series LTE LGA Module Hardware Guide Mechanical Specifications Figure 6-6 Reflow profile Table 6-2 Reflow parameters Temperature Zone Time Key Parameter Preheat zone 60s–120s Heating rate: 0.5° C/s–2° C/s (40° C–150° C) Soak zone (t1–t2): 60s–120s Heating rate: < 1.0° C/s (150°...

  • Page 71: Specification Of Rework

    HUAWEI ME909 Series LTE LGA Module Hardware Guide Mechanical Specifications 6.9 Specification of Rework 6.9.1 Process of Rework 6.9.2 Preparations of Rework Remove barrier or devices that can’t stand high temperature before rework.   If the device to be reworked is beyond the storage period, bake the device according to Table 6-1 .

  • Page 72: Welding Area Treatment

    HUAWEI ME909 Series LTE LGA Module Hardware Guide Mechanical Specifications Figure 6-7 Equipment used for rework 6.9.4 Welding Area Treatment Step 1 Remove the old solder by using a soldering iron and solder braid that can wet the solder. Step 2 Clean the pad and remove the flux residuals.

  • Page 73: Specifications Of Rework

    HUAWEI ME909 Series LTE LGA Module Hardware Guide Mechanical Specifications 6.9.6 Specifications of Rework Temperature parameter of rework: for either the removing or welding of the module, the heating rate during the rework must be equal to or smaller than 3° C/s, and the peak temperature between 240°...

  • Page 74: Certifications

    HUAWEI ME909 Series LTE LGA Module Hardware Guide Certifications Certifications 7.1 About This Chapter This chapter gives a general description of certifications of ME909. 7.2 Certifications The certification of ME909 is testing now. Table 7-1 shows certifications the ME909 will be implemented.

  • Page 75: Safety Information

    HUAWEI ME909 Series LTE LGA Module Hardware Guide Safety Information Safety Information Read the safety information carefully to ensure the correct and safe use of your wireless device. Applicable safety information must be observed. 8.1 Interference Power off your wireless device if using the device is prohibited. Do not use the wireless device when it causes danger or interference with electric devices.

  • Page 76: Traffic Security

    HUAWEI ME909 Series LTE LGA Module Hardware Guide Safety Information Area indicated with the “Power off bi-direction wireless equipment” sign   Area where you are generally suggested to stop the engine of a vehicle 8.4 Traffic Security  Observe local laws and regulations while using the wireless device. To prevent accidents, do not use your wireless device while driving.

  • Page 77: Laws And Regulations Observance

    HUAWEI ME909 Series LTE LGA Module Hardware Guide Safety Information 8.10 Laws and Regulations Observance Observe laws and regulations when using your wireless device. Respect the privacy and legal rights of the others. 8.11 Care and Maintenance It is normal that your wireless device gets hot when you use or charge it. Before you clean or maintain the wireless device, stop all applications and power off the wireless device.

  • Page 78: Fcc Statement

    Warning: Changes or modifications made to this equipment not expressly approved by HUAWEI may void the FCC authorization to operate this equipment. Huawei Proprietary and Confidential Issue V0.3 (2013-05-21)

  • Page 79: Appendix A Circuit Of Typical Interface

    HUAWEI ME909 Series LTE LGA Module Hardware Guide Appendix A Circuit of Typical Interface Appendix A Circuit of Typical Interface Huawei Proprietary and Confidential Issue V0.3 (2013-05-21) Copyright © Huawei Technologies Co., Ltd.

  • Page 80: Appendix B Acronyms And Abbreviations

    HUAWEI ME909 Series LTE LGA Module Appendix B Acronyms and Hardware Guide Abbreviations Appendix B Acronyms and Abbreviations Acronym or Abbreviation Expansion 3GPP Third Generation Partnership Project 8PSK 8 Phase Shift Keying Auxiliary Bit Error Rate BLER Block Error Rate...
  • Page 81 HUAWEI ME909 Series LTE LGA Module Appendix B Acronyms and Hardware Guide Abbreviations Acronym or Abbreviation Expansion Electronic Industries Association Electromagnetic Compatibility Electrostatic Discharge European Union Federal Communications Commission GMSK Gaussian Minimum Shift Keying GPIO General-purpose I/O GPRS General Packet Radio Service...
  • Page 82 HUAWEI ME909 Series LTE LGA Module Appendix B Acronyms and Hardware Guide Abbreviations Acronym or Abbreviation Expansion Protocol Data Unit Product Identity Power Management Unit Radio Frequency Restriction of the Use of Certain Hazardous RoHS Substances Short Message Service To Be Determined...

This manual is also suitable for:

Me909u-521Me909u-121Me909u-721

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