Sony HT-NT5 Service Manual page 8

HT-NT5
BOND FIXED POSITION OF ELECTRICAL PARTS
When the parts that fi xed on the board by the bond have been removed, fi x the parts by using the bond in the mounting to the board.
(Refer to the fi gure below)
– POWER Board
(Component Side) –
C935 or C938
C941
C967
C970 C977 C976
– AMP Board (Side A) –
MALFUNCTION PREVENTION OF THE BUTTON (TOUCH
PANEL SWITCH)
When the button portion on the top side of the main unit are
touched with something such as the fl oor surface, there is a pos-
sibility of occurring the malfunction.
When performing the operation check in the state that the top side
on this unit is under, set the stand etc. to the position that avoids the
button portion as shown in the fi gure below, perform in the state
that the button portion does not touch anything.
button portion
stand
8
C902 or C989
F931 C969
C6183
bottom side
stand
C903 or C990
VDR901
TH901
C907 or C988
C914 or C915
R914
C6153 C6082 C6057
SPREADING OF COMPOUND
When the IC6004 and IC6007 on the AMP board or the AMP board
is replaced, spread the compound to the touching portion between
the IC6004, IC6007 and the heat sink.
– AMP Board (Side A) –
compound
IC6004
C905
LF901
compound
IC6007