Toshiba MCY-MHP0305HT-C Service Manual page 156

card spacer
Push this in the direction of the
arrow to unlock and remove the
P.C.board assembly
Screw (M4×8)
Used to secure the lead wire
Screw tightening torque: 1.2 ±0.1 N m
Single-touch spacer
screws M3×20
P.C.board
First remove the
Screws , and then
remove the P.C.
board assembly.
Screw (M4×8)
Used to secure the earth lead wire
Screw tightening torque: 1.2 ±0.1 N m
cord clamp
card spacer
Push this in the direction of the
arrow to unlock and remove the
P.C.board assembly
Single-touch spacer
screws M3×20
card spacer
Screw (M4×10)
Used to secure the lead wire
Screw tightening torque: 1.2 ±0.1 N m
155
IPDU P.C.board
(43H69024)
Single-touch spacer
Screw (M3×20)
Used to secure the IPM, IGBT and rectifiers
Screw tightening torque: 0.55 ±0.1 N m
Evenly apply the silicon heat sink compound to the heat-sink
surfaces of the IPM, IGBT and rectifier devices.
Caution: It must be ensured that no dust, etc. adheres to the
heat-sink surfaces of the IPM, IGBT and rectifier devices.
Standard for heat silicone heat sink compound:
Manufacturer: Shin-Etsu Chemical Co., Ltd.
Type: G746 or G747
Heatsink
Single-touch spacer