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Interconnect device mapping for double dense
server blades
The following table lists the available configurations for double dense
server blades installed in device bay N (1-16).
Connection
Port number
Server A
NIC 1 (ENET:1)
Embedded NIC
NIC 2 (ENET:2)
Server A
Port 1
Mezzanine
Port 2
Server B
NIC 1 (ENET:1)
Embedded NIC
NIC 2 (ENET:2)
Server B
Port 1
Mezzanine
Port 2
Interconnect device mapping for AMC Telco I/O
expansion blades
The following table lists the available configurations for AMC Telco
I/O expansion blades installed in device bay N (1-16).
Connection
Port number
AMC Embedded
Port 1
(1)
Port 2
Port 3
Port 4
AMC Embedded
Port 5
(2)
Port 6
Port 7
Port 8
Mapping the BL680c G7 Blade
•
A side
Connects to
interconnect
bay/port
1/Port N
3/Port N
5/Port N
6/Port N
2/Port N
4/Port N
7/Port N
8/Port N
Connects to
interconnect
bay/port
1/Port N
2/Port N
3/Port N
4/Port N
5/Port N
6/Port N
7/Port N
8/Port N
10
B side
•
To support network connections for specific signals, install an
interconnect module in the bay corresponding to the embedded NIC
or mezzanine signals.
Bay-to-bay crosslinks
Four trace SerDes signals between adjacent bays are provided in
the enclosure midplane to permit bay-to-bay communications.
Interconnect modules can only connect horizontally.
Device bay crosslinks
Device bay crosslinks are wired between adjacent horizontal device
bay pairs.
For half-height blades, these signals connect a four-lane PCIe
module to a partner blade such as a tape blade or a PCI expansion
blade. For full-height blades, these signals are used to connect a
PCIe module to a partner blade in the lower adjacent bay and require
a PCIe pass-thru mezzanine card installed in mezzanine connector
3. The Onboard Administrator with KVM disables the device bay
crosslinks when they cannot be used, such as when two server
blades reside in adjacent device bays.
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