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Table of Contents
Related Manuals for Infineon Cypress MB2146-223
Summary of Contents for Infineon Cypress MB2146-223
- Page 1 The document following this cover page is marked as “Cypress” document as this is the company that originally developed the product. Please note that Infineon will continue to offer the product to new and existing customers as part of the Infineon product portfolio.
- Page 2 MB2146-223 MC-8FX Family LQFP-64P (0.65 mm pitch) Header Board Operation Guide Doc. # 002-07484 Rev. *A Cypress Semiconductor 198 Champion Court San Jose, CA 95134-1709 Phone (USA): 800.858.1810 Phone (Intnl): +1.408.943.2600 www.cypress.com...
- Page 3 Copyrights © Cypress Semiconductor Corporation, 2009-2016. This document is the property of Cypress Semiconductor Corporation and its subsidiaries, including Spansion LLC (“Cypress”). This document, including any software or firmware included or refer- enced in this document (“Software”), is owned by Cypress under the intellectual property laws and treaties of the United States and other countries worldwide.
- Page 4 Preface Thank you for purchasing the LQFP-64P (0.65 mm pitch) * header board (model number : MB2146-223) for the F MC-8FX family. MB2146-223 is a header board used to connect the MCU board (model number : MB2146-301A-E, MB2146-303A-E) which mounts the F MC-8FX family evaluation MCU to a user system.
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Page 5: Table Of Contents
Contents 1. Product Outline Product Outline ......................5 Product Configuration ....................6 2. Checking the Delivered Product 3. Handling Precautions 4. Notes on Designing Notes on Designing Printed Circuit Board for the User System ........9 MCU Footprint Design Notes..................10 5. Connecting to the User System Connecting.........................11 Disconnection ......................12 6. -
Page 6: Product Outline
Product Outline Product Outline MB2146-223 is a header board (referred to as header board) used to connect the MCU board (model number : MB2146-301A-E, MB2146-303A-E) which mounts an evaluation MCU in the MC-8FX family of Cypress 8-bit microcontrollers to a user system. To build an F MC-8FX evaluation environment, combine the three products as shown in Figure 1-1: the header board, a MCU board, and a BGM adapter (model number : MB2146-09A-E). -
Page 7: Product Configuration
Product Outline Product Configuration Table 1-1 lists the product configuration in the header board, and Table 1-2 lists options. Table 1-1. Product Cofiguration Name Description Remarks MC-8FX Connector/LQFP64pin LQFP-64P (0.65 mm pitch) (0.65 mm pitch) Package conversion header board [Model number : MB2146-223] [Model number : YQPACK064SB] I/F between header board and NQPACK Accessory (connected) -
Page 8: Checking The Delivered Product
Checking the Delivered Product Before using the MB2146-223, confirm that the following components are included in the box: LQFP-64P (0.65 mm pitch) header board * ■ Screws for securing header board (M2 × 10 mm, 0.4 mm pitch) ■ NQPACK064SB * ■... -
Page 9: Handling Precautions
Handling Precautions The header board is precision-manufactured to improve the dimensional accuracy and to ensure a reliable contact. The header board is therefore sensitive to mechanical shocks. To ensure a correct use of the header board in the proper environment, observe the following: Avoid placing a stress on the NQPACK mounted on the user system board when connecting the ■... -
Page 10: Notes On Designing
Notes on Designing Notes on Designing Printed Circuit Board for the User System When the header board is connected to the user system, some part mounted around the NQPACK in the user system may be contacting the header board if the height of the part is tall. To prevent this, design the printed circuit board for the user system so that the components do not exceed the height shown in Figure 4-1. -
Page 11: Mcu Footprint Design Notes
Notes on Designing MCU Footprint Design Notes Figure 4-2 shows the recommended footprint dimensions of the NQPACK mounted on the printed circuit board for the user system. Take the footprint in Figure 4-2 into consideration as well as the footprint of the mass production MCU when designing the printed circuit board for the user system. -
Page 12: Connecting To The User System
Connecting to the User System Connecting Mount the supplied NQPACK on the user system before using the MB2146-223. 1. To connect the header board to the user system, match pin 1 indicated by the index mark (▲) on the NQPACK mounted on the user system with pin 1 indicated by the index mark (an angle cut linearly at one place only in silk screen) on the header board and then insert it (see Figure 5-1) . -
Page 13: Disconnection
Connecting to the User System Figure 5-2. Connecting MCU Board/Header Board to User System MCU board Evaluation MCU board Screws for securing header board Header board Connected at shipment YQPACK ÅNQPACK User system Disconnection 1. Remove the MCU board from the header board. Detach the four corners slowly in sequence, not excessively forcing the junction with the NQPACK. -
Page 14: Mounting Mass Production Mcus
Mounting Mass Production MCUs Mounting To mount a mass production MCU on the user system, use the supplied HQPACK (IC socket cover) (see “Figure 6-1”) . 1. To mount a mass production MCU on the user system, match the index mark (▲) on the NQPACK mounted on the user system with the index mark (●) on the mass production MCU. -
Page 15: Disconnection
Mounting Mass Production MCUs Disconnection To remove the HQPACK, remove all of the four screws and pull out the HQPACK vertically from the NQPACK. When taking out the mass production MCU, absorb the mass production MCU using a vacuum pick-up tool special for removing IC. Do not attempt to remove the mass production MCU forcibly, for example, using a screwdriver to do so can bend the pins of the mass production MCU or break the NQPACK. -
Page 16: Product Specifications
Product Specifications General Specifications Table 7-1 lists the general specifications of the header board. Table 7-1. General Specifications Item Description Operating temperature and storage temperature 5°C to 35°C (operation) , 0°C to 40°C (storage) Operating humidity and storage humidity 20 % to 80 % (operation) , 20 % to 80 % (storage) Approximately 40 mm ×... -
Page 17: Functional Block Diagram
Product Specifications Functional Block Diagram A header board performs socket conversion between the MCU board I/F connector and YQPACK. The header board does not contain any component such as an IC internally. Figure 7-1 shows the block diagram. Figure 7-1. Functional Block Diagram MCU board I/F connector User target system I/F connector (Socket for package) - Page 18 Product Specifications ■ MCU Board I/F Connector (CN1, CN2, and CN3) CN1 and CN2 are MCU board I/F connectors. CN3 is the incorrect insertion prevention socket of a MCU board. The pin assignment of the MCU board I/F connector CN1 is shown in Table 7-3, and the pin assignment of the MCU board I/F connector CN2 is shown in Table 7-4.
- Page 19 Product Specifications Table 7-4. Pin Assignment of the MCU Board I/F Connector CN2 Connector Connector Connector Evaluation Evaluation Evaluation Signal Signal Signal MCU Pin MCU Pin MCU Pin name name name Number Number Number Number Number Number SEL0 SEL3 SEL4 SEL1 P04C AVcc3...
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Page 20: User System I/F Yqpack (U1)
Product Specifications User System I/F YQPACK (U1) The pin assignment of user system I/F YQPACK in the header board is shown in Table 7-5. Table 7-5. Pin Assignment of the User System I/F YQPACK in Header Board Connector Connector Signal name Signal name Pin Number Pin Number... -
Page 21: Revision History
Revision History Document Revision Document Title: MB2146-223 F MC-8FX Family LQFP-64P (0.65 mm pitch) Header Board Operation Guide Document Number: 002-07484 Origin of Revision ECN# Issue Date Description of Change Change 02/20/2009 HUAL Initial release 5285943 05/27/2016 HUAL Migrated Spansion Guide from SS01-26020-2E to Cypress format MB2146-223 F MC-8FX Family LQFP-64P (0.65 mm pitch) Header Board Operation Guide, Doc.