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Item Description
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Description #1 Torx screwdriver
Description #2 Torx screwdriver
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Using TT8 screwdriver to remove 4 screws on the chassis.
2. Remove the upper cover.
3. Using PH1 screwdriver, remove 2 screws from PCBA.
4. Remove PCBA.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
MF877-00
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at
Notes
Tool Size (if
applicable)
MF877-01
Quantity
of items
included
in product
0
TT8
PH1
Page 2
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