Unitek MICROPULL IV MP4/115 Operation And Maintenance Manual page 49

16
Serial Number:
No. of Tests:
No. of Good Tests:
No. of Bad Tests:
Pull Test Limit:
No. Bonds / Device:
BOND #
NOT TESTED
Explanation of Non-Destruct Test Report. The printout for Serial No. 1 shows the result when the
"Print All Data" field contains an "N". Had there been a failure during the testing of this device, the data
for that test would have been printed in a format as shown for Serial No. 2, Test #5. Serial No.2
illustrates the format when the "Print All Data" field contains a "Y." "NO TEST/OPERATOR" can be
generated by the operator by pressing <F7> on the computer. This data is printed, but it is not used in
either the Non-Destruct or Destruct Test results.
WIRE BOND FAILURE LOCATION CODES per MIL-STD-883B
1 - Wire Break at neckdown point.
2 - Wire Break at any other point.
3 - Failure in bond interface at die.
4 - Failure in bond interface at substrate or post.
5 - Lifted metallization from die.
6 - Lifted metallization from substrate or post.
7 - Fracture of die.
8 - Fracture of substrate.
No. Bonds / Device:
BOND #PULL (gf) LOCATION – ERROR
990-180
2.6 gf
Beam Size: 100 gf
2.5 - 2.7 gf
Serial No:
PULL (gf) ERROR
DESTRUCTIVE PULL TEST
Date:
Operator:
Part No:
Lot No:
Beam Size:
Serial No:
®
MICROPULL IV WIRE BOND PULL TESTER
CHAPTER 3: OPERATING INSTRUCTIONS
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12-06-1987 14:25
M.P. PHFOUR
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100 gf
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1015
3-21