Model Mpit Insertion Tool; Software; Hook Specifications - Unitek MICROPULL IV MP4/115 Operation And Maintenance Manual

Wire bond pull tester
Table of Contents

Advertisement

NOTE: Many specifications require that the hook diameter be approximately 2.5 times that
of the wire being tested.
Model
Weight
(g)
BH3
0.1
BH5
0.1
BH8
0.1
BH12
0.1
BH20
0.1
BH30
0.1
BH3R
0.1
BH5R
0.1
BH8R
0.1
* See figure 1-5

Model MPIT Insertion Tool

This tool is used to insert and remove hooks from the beams. One tool is included with each MP4.

Software

The data logging software for the MP4 can be used to interpret and format data which is provided via
the MP4's RS-232 Printer Interface. This software is designed for both Destruct and Non-destruct
testing, The processing time is less than one second per test in either mode
The Non-destruct software counts the number of tests. And at user's option, either prints the data for all
bonds or only for those bonds that fail and/or are not subjected to the proper pull. An option is provided
which allows the user to enter a six-digit location code to identify the location of any bond which fails.
The Destruct software records the data from all tests together with the appropriate, but optional, one
digit MIL-STD-883B Bond Failures Location Code entered by the user. At the completion of each set
of tests, the program calculates and prints the Average Pull Strength, the Standard Deviation, of the data
and the Normal Distribution Limit for the individual device. At the user's option a histogram of any
device, or group of devices, can be printed.
The program includes an input screen to collect information that can be used as a heading for the
reports. A user option allow the test data to be copied to a disk file in the Lotus ".PRN" format which
can be imported into Lotus Development Corporation's Lotus 1-2-3
the user can elect to omit printing the data, provided that an election is made to copy the data to a disk
file.
990-180
Table 1-4. Hook Specifications
Diameter
Maximum
(in.)
Pull (g-f)
0.003
0.005
0.008
125
0.012
300
0.020
850
0.030
2000
0.003
0.005
0.008
125
®
MICROPULL
IV WIRE BOND PULL TESTER
CHAPTER 1: SYSTEM DESCRIPTION
Dimension A*
(in.)
20
0.007
50
0.011
0.015
0.025
0.040
0.050
20
0.007
50
0.011
0.015
Dimension B*
(in.)
2
2
2
¾
¾
¾
2
2
2
®
Release 2. In the Destruct Mode,
Used On
B10, B100
B10, B100
B10, B100
B1000
B1000
B1000
B100R
B100R
B100R
1-7

Hide quick links:

Advertisement

Table of Contents
loading

Table of Contents