Unitek MICROPULL IV MP4/115 Operation And Maintenance Manual page 43

Wire bond pull tester
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In that case, the software permits the user to change his earlier decision not to save data to
"PULLS.TXT" by asking, "Save Histogram Data to PULLS.TXT (Y/N)?" A response of <Y> will
cause the data to be saved to "PULLS.TXT." Any data that was stored in "PULLS.TXT" will then be
over-written. A response of "N" will cause the software to query, "Erase Histogram Data from Memory
(Y/N)?" A response of <Y> will start the accumulating of new data; a response of <N> will keep the
current data base.
NOTE: Memory is RAM memory, not PULLS.TXT file memory.
3 Assuming the Destruct Test Mode is selected, the "Accept Failure Location Code" field contains a "Y,"
and the appropriate Operator, Part and Lot No. information is entered in the Change Header Information
Screen, the following will be printed at the top of the first page of the report:
WIRE BOND FAILURE LOCATION CODES per MIL-STD-883B
1 - Wire Break at neckdown point.
2 - Wire Break at any other point.
3 - Failure in bond interface at die.
4 - Failure in bond interface at substrate or post.
5 - Lifted metallization from die.
6 - Lifted metallization from substrate or post.
7 - Fracture of die.
8 - Fracture of substrate.
No. Bonds / Device:
BOND # PULL(gf)
4 During Destruct Testing the function keys, which are displayed in reverse video at the bottom of the
screen, have the meanings shown below:
NOTE: The function keys are inoperative whenever the computer is waiting for the operator to enter a new
serial number. Therefore, if it is necessary to use a function key as part of serial number entry, press
<Enter> prior to pressing the necessary function key.
990-180
DESTRUCTIVE PULL TEST
Date:
12-06-1987 14:25
Operator:
M..P. PHFOUR
Part No:
A1234567890
Lot No:
4-234-789
Beam Size:
100 gf
16
Serial No:
1015
LOCATION - ERROR
®
MICROPULL
IV WIRE BOND PULL TESTER
CHAPTER 3: OPERATING INSTRUCTIONS
3-15

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