Circuit Boards Location; Note For Printed Wiring Boards And Schematic Diagrams; Printed Wiring Board - Sony HCD-RV777D Service Manual

7-6. CIRCUIT BOARDS LOCATION

SW board
DMB07 board
MOTOR (LD) board
SIRCS board
PANEL board
TRANS board
P-STREAM board
JACK board
HCD-RV777D/RV888D/RV999D
SUB TRANS board
RF board
SENSOR board
VIDEO board
MOTOR (TB) board
DRIVER board
SURROUND AMP board
(HCD-RV888D/RV999D)
MAIN board
FRONT AMP board
LEAD PIN board
(HCD-RV777D)
HP board

7-7. NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS

Note on Printed Wiring Board:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
• : Pattern from the side which enables seeing.
(The other layer's patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from
(Conductor Side) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Component Side) the parts face are indicated.
• Indication of transistor.
C
Q These are omitted.
B E
Q
B C E
These are omitted.
Q
B C E
These are omitted.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to about
350 °C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may also
be added to ordinary solder.
51 51
HCD-RV777D/RV888D/RV999D
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and 1 / W or less unless otherwise
4
specified.
• 2 : nonflammable resistor.
• C : panel designation.
Note: The components identified by mark 0 or dotted line
with mark 0 are critical for safety.
Replace only with part number specified.
• A : B+ Line.
• B : B– Line.
• Voltage and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
no mark : FM
∗
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F : AUDIO
f : TUNER
L : VIDEO (COMPONENT)
r : VIDEO (COMPOSITE)
E
: TAPE PLAY (DECK A)
d
: TAPE PLAY (DECK B)
G
: TAPE REC (DECK B)
J
: DVD (AUDIO)
c : DVD (RF)
I : DVD (DIGITAL)
• Abbreviation
AUS : Australian model
AR : Argentina model
MX : Mexican model