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DRN-XM01C2/XM01CK2/XM01H2/
XM01HK2/XM01R2
Note on Printed Wiring Boards
• X : parts extracted from the component side.
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:
Parts on the pattern face side seen from the
(Side B)
pattern face are indicated.
Parts face side:
Parts on the parts face side seen from the
(Side A)
parts face are indicated.
C
Q
These are omitted
B
E
Note on Schematic Diagram
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and
1
/
W or less unless otherwise
4
specified.
•
: internal component
f
• C : panel designation.
.
Note: The components identified by mark 0 or dotted
line with mark 0 are critical for safety.
Replace only with part number specified.
•
: B+ Line.
• Power voltage is dc 6.0V and fed with regulated dc power
supply from cradle.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
: SAT
f
: TER
6-1. Circuit Boards Location
CPU board
IR board
LCD board
26
SECTION 6
DIAGRAMS
USB board
BB board
• Waveforms
1
IC101 es (XTO)
1.3 Vp-p
42 ns
500mV/div
20ns/div
2
IC501 wh (X2)
3.3 Vp-p
163 ns
1V/div
100ns/div
3
IC501 es (XT2)
2 Vp-p
31 µ s
500mV/div
20µs/div
4
IC505 qd (XOUT)
3.8 Vp-p
83 ns
1V/div
40ns/div
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