A Appendix; Thermocouple Instrumentation; Case Thermocouple Attachment; Figure 16. Diagonals Marked On Processor To Locate Center - AMD Athlon 64 Thermal Design Manual

Hide thumbs Also See for Athlon 64:

Table of Contents

26633 Rev. 3.03 September 2003

Appendix

This section describes thermocouple instrumentation and the procedure for clip load testing.

A.1

Thermocouples measure the three necessary temperatures that are used for a detailed thermal-

performance analysis. The case temperature requires a thermocouple to be attached to the heatsink

lid surface with high thermal conductivity epoxy, such as Omega Engineering's Omegabond 101.

The heatsink base temperature requires drilling a hole in the heatsink base and inserting a

thermocouple inside the hole. The ambient temperature is measured by fixing a thermocouple with

the bead in the fan inlet air stream 25 mm above the surface of the fan.

A.1.1

Instructions for attaching the case-temperature thermocouple are as follows:

1) Draw lines on the diagonals of the package as shown in Figure 16. Check that the

intersection lies on the center of the package by using calipers.

Appendix A

Preliminary Information

AMD Athlon™ 64 and AMD Opteron™ Processors

Appendix

Thermal Design Guide

Table of Contents

This manual is also suitable for:
Athlon 64 fx Opteron