EC21 Mini PCIe
EC21 Module
PCI Express Mini Card Connector
Application Board
NOTES
1.
The module offers the best performance when the internal BB chip stays below 105° C. When the
maximum temperature of the BB chip reaches or exceeds 105° C, the module works normal but
provides reduced performance (such as RF output power, data rate, etc.). When the maximum BB
chip temperature reaches or exceeds 115° C, the module will disconnect from the network, and it will
recover to network connected state after the maximum temperature falls below 115° C. Therefore, the
thermal design should be maximally optimized to make sure the maximum BB chip temperature
always maintains below 105° C. Customers can execute AT+QTEMP command and get the
maximum BB chip temperature from the first returned value.
2.
For more detailed guidelines on thermal design, please refer to document [4].
EC21_Mini_PCIe_Hardware_Design
Thermal Pad
Heatsink
Shielding Cover
Figure 18: Referenced Heatsink Design
LTE Standard Module Series
EC21 Mini PCIe Hardware Design
Thermal Pad
Heatsink
Application Board
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