ADC RF Signal Management SignalOn Series Specification Sheet page 4

SignalOn
RF Signal Management
Passives: Introduction
The SignalOn ® Series, combined with the
innovative cable management of the chassis,
provides engineers with a variety of products to
simplify the RF signal management challenge.
Passives:
RF Splitter/Combiner Modules
5 MHz to 1 GHz
N - M __ __ __ __ __ __
Module Type
P Plain splitter/
combiner
C Combiner with
pad/monitor
S Splitter with pad/
monitor
X Splitter and
combiner with
pad/monitor (2 x
4:1 module only)
Connector Type
F F
B BNC
*3 x 2:1 and 2 x 4:1 housed in a single module.
**Leave last two digits blank for plain modules.
Selection of default pad option for pand and monitor modules
The make before break attenuation feature requires that a default attenuation padding value be chosen
for the module. The two options are:
M0 – 0 dB loss on the splitter or combiner leg when attenuator pad is removed
The M0 option is used in systems where the attenuator pad values will range from 0 dB to 10 dB.
M6 – 6 dB loss on the splitter or combiner leg when attenuator pad is removed
The M6 option is typically used in systems where the attenuator pad values range from 10 dB to
25 dB. In this situation, the additional 6 dB of loss that is placed in line when the pad is removed
will help to limit overdriving active devices further downstream and will help limit transmitter laser
clipping, and overdriving of RF amplifiers in the distribution plant.
w w w . a d c . c o m
Series
®
Catalog Number
Make-Before-Break
Attenuation**
M0 0 dB default
M6 6 dB default
Configuration
12 2:1
14 4:1
18 8:1
32 3 x 2:1*
24 2 x 4:1*
• + 1 - 9 5 2 - 9 3 8 - 8 0 8 0
Plain Splitter/Combiner
Module
Features
• Industry's highest density with standard F
and BNC connectors
• Industry's best performance and specifications
• Individual performance certificate shipped
with every module
• Patented make-before-break attenuator pad
design for hitless signal balancing
• Chassis supports both passive and active
modules
• Clear chassis door provides protection and
clear view of modules
• Clear attenuator pad covers and patented
pad guides for simplified maintenance
• High quality, precision F or BNC connectors
• Designed to exceed NEBS requirements for
grounding/bonding
• Independent EMI near and far-field testing
• Ten year warranty on all passive modules
• Available in 1 RU, 2 RU, 4 RU and 5 RU chassis
• NEBS Level 3 compliant
• 1 - 8 0 0 - 3 6 6 - 3 8 9 1
Pad and Monitor Module
with Make-Before-Break
Attenuation
4