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THIS GUIDE PROVIDES INSTRUCTIONS FOR CUSTOMERS TO DESIGN THEIR APPLICATIONS. PLEASE FOLLOW THE RULES AND PARAMETERS IN THIS GUIDE TO DESIGN AND COMMISSION. NEOWAY WILL NOT TAKE ANY RESPONSIBILITY OF BODILY HURT OR ASSET LOSS CAUSED BY IMPROPER OPERATIONS. THE INFORMATION IN THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE DUE TO PRODUCT VERSION UPDATE OR OTHER REASONS.
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Table 2-2 Pin definition ........................5 Table 3-1 Power status, clock status, and current in different work modes ........8 Table 4-1 G2 ceramic patch antenna ....................10 Table 5-1 G2 extreme operating voltage ..................12 Table 5-2 G2recommended operating voltage ................. 12 Table 5-3 Temperature feature ......................
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Hardware User Guide About This Document Scope This document is applicable to G2 series. It defines the features, indicators, and test standards of the G2 module and provides reference for the hardware design of each interface. Audience This document is intended for system engineers (SEs), development engineers, and test engineers.
Hardware User Guide 1 About G2 G2 is a GNSS module that supports BDS B1, GPS L1, and GLONASS L1. It adopts a unified chipset integrating baseband and RF and embeds LNA and ceremic patch antenna. This architecture facilitates the application design and reduces the cost. It is an optimal navigation solution to demands for high sensitivity, low power consumption, and low cost in different navigation devices 1.1 Overview...
Hardware User Guide 2 Pad Layout and Pin Definition There are 13 pins on G2 and their pads are in LCC package. 2.1 Pad Layout Figure 2-1 shows the pad layout of G2. Figure 2-1 G2 pin definition (top view)
Hardware User Guide 3 Application Interfaces G2 provides power supply interface, UART interface, I2C interface, and 1PPS interface. This chapter describes how to use each interface and the design precautions. 3.1 Power Supply Signal Function Remarks VBAT Main power supply 2.7V~3.6V(Typ:3.3V)
2dBic 4.2 PCB Design GNSS signals are easy to be affected by external factors. To obtain the optimal performance of the G2 module, follow the recommendations below in your application design: Ensure that the ceramic patch antenna is upwards and no conduction material is placed above it.
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Ensure that the module is surrounded by ground and the ground area should not be less than 30mm×30mm. Ensure that the G2 module isat least 10 mm away from other metal components. Otherwise, the antenna performance will be affected.
5 Electrical Feature and Reliability This chapter describes the electrical features and reliability of G2. 5.1 Electrical Features To ensure that G2 functions properly, operate it in recommended operationg conditions. 5.1.1 Extreme Operating Voltage Table 5-1 G2 extreme operating voltage...
If the module works in an environment where the temperature exceeds the thresholds of the operating temperature range, some of its RF performance indicators might be worse but it can still work properly. 5.3 ESD Protection Humidity: 45% Temperature: 25 ° C Table 5-4 G2 ESD feature Testing Point Contact Discharge Air Discharge VBAT ±...
Figure 6-2 G2label 6.3 Packaging G2 modules are packed in sealed bags on delivery to guarantee a long shelf life. Follow the same package of the modules again in case of opened for any reasons. 6.3.1 Tape & Reel Packaging G2 in mass production are shipped in the following package.
Hardware User Guide Reel 6.3.2 Mositure-Sensitive G2 is a level 3 moisture-sensitive electronic elements, in compliance with IPC/JEDEC J-STD-020 standard. If the module is exposed to air for more than 48 hours at conditions not worse than 30° C/60% RH, bake it at a temperature higher than 90 degree for more than 12 hours before SMT.Or, if the indication...
220 ° C for more than 45 seconds and the peak temperature reaches 240 ° C. 7.5 Reflow Profile G2 is compatible with industrial standard reflow profile for lead-free SMT process. The reflow profile is process dependent, so the following recommendation is just a start point guideline: Only one flow is supported.
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Neoway will not provide warranty for heat-responsive element abnormalities caused by improper temperature control. For information about cautions in G2 storage and mounting, refer to Neoway Module Reflow Manufacturing Recommendations. To maintain and manually desolder it, use heat guns with great opening, adjust the temperature to 250 degrees (depending on the type of the solder paste), and heat the module till the solder paste is melt.
other electronic equipment. Please follow the requirements below in application design: Do not disassemble the module without permission from Neoway. Otherwise, we are entitled to refuse to provide further warranty. Please design your application correctly by referring to the HW design guide document and our ...
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