Telit Wireless Solutions ZE50-2.4 User Manual
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Telit Wireless Solutions ZE50-2.4 User Manual

Telit Wireless Solutions ZE50-2.4 User Manual

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ZE50-2.4 RF Module User Guide
1vv0300837 Rev.2 – 22/03/2010

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Summary of Contents for Telit Wireless Solutions ZE50-2.4

  • Page 1 ZE50-2.4 RF Module User Guide 1vv0300837 Rev.2 – 22/03/2010...
  • Page 2 ZE50-2.4 RF module User Guide 1vv0300837 Rev.2 – 22/03/20 This document is related to the following product : Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 2 of 47...
  • Page 3 ZE50-2.4 RF Module User Guide 1vv0300837 Rev.2 – 22/03/20 DISCLAIMER The information contained in this document is the proprietary information of Telit Communications S.p.A. and its affiliates (“TELIT”). The contents are confidential and any disclosure to persons other than the officers, employees, agents or subcontractors of the owner or licensee of this document, without the prior written consent of Telit, is strictly prohibited.

  • Page 4: Table Of Contents

    ZE50-2.4 RF module User Guide 1vv0300837 Rev.2 – 22/03/20 CONTENTS CHAPTER I. INTRODUCTION ........................6    I.1. A ....................................6 IM OF THE OCUMENT I.2. R   ....................................7 EFERENCE DOCUMENTS I.3. D   ....................................7 OCUMENT CHANGE LOG I.4. G  ...
  • Page 5 ZE50-2.4 RF Module User Guide 1vv0300837 Rev.2 – 22/03/20 VI.3. RF   ..................................35 LAYOUT CONSIDERATIONS VI.4. A     ..........................36 NTENNA CONNECTION ON RINTED IRCUIT OARDS VI.5. ZE50-2.4   : ..................................... 37 INTERFACING CHAPTER VII. ANTENNA CONSIDERATIONS..................40 ...

  • Page 6: Chapter I. Introduction

    I.1. Aim of the Document The aim of this document is to present the features and the application of the ZE50-2.4 radio module. After the introduction, the characteristics of the ZE50-2.4 radio module will be described within the following distinct...

  • Page 7: Reference Documents

    ZE50-2.4 RF Module User Guide 1vv0300837 Rev.2 – 22/03/20 I.2. Reference documents Wireless MAC and PHY Specifications for Low Rate - WPANs [1] IEEE Std. 802.15.4-2006 ERC Recommendation for SRD, June 2009 [2] ERC Rec 70-03 ETSI Standards for SRD , October 2006 [3] EN 300 328-1 V1.7.1 (Europe)

  • Page 8: Glossary

    ZE50-2.4 RF module User Guide 1vv0300837 Rev.2 – 22/03/20 I.4. Glossary Association of Radio Industries and Businesses ARIB Bit Error Rate Bits per second (1000 bits/s = 1Kbps = 1Kbaud) Bits/s Character Error Rate European Conference of Postal and Telecommunications Administrations...

  • Page 9: Chapter Ii. Requirements

    1vv0300837 Rev.2 – 22/03/20 CHAPTER II. REQUIREMENTS II.1. Regulations requirements The ZE50-2.4 module is a [1],[2],[6],[7] compliant multi channel radio modem in the 2.4GHz band (unlicensed frequency band). Europe Regulation: The “ERC recommendation 70-03” [2] describes the limits band in the 2.4GHz license free band, in terms of bandwidth, maximum power, duty cycle, channel spacing and type of application.
  • Page 10 ZE50-2.4 RF module User Guide 1vv0300837 Rev.2 – 22/03/20 Restrictions for non specific SR devices Annex 1h 2400-2483.5MHz: Country Restriction Reason/Remark This subsection does not apply for the Norway Implemented geographical area within a radius of 20 km from the centre of Ny-Ålesund...
  • Page 11 ZE50-2.4 RF Module User Guide 1vv0300837 Rev.2 – 22/03/20 USA Regulation: In the United States the FCC is responsible for the regulation of all RF devices. Our module intended for unlicensed operation is regulated by CFR 47, Part 15 [6].

  • Page 12: Ii.2. Functional Requirements

    ZE50-2.4 RF module User Guide 1vv0300837 Rev.2 – 22/03/20 II.2. Functional Requirements The ZE50-2.4 module is a complete solution from serial interface to RF interface. The ZE50-2.4 module has a digital part and a RF part. The digital part has the following functionalities:...

  • Page 13: Ii.4. Temperature Requirements

    ZE50-2.4 RF Module User Guide 1vv0300837 Rev.2 – 22/03/20 II.4. Temperature Requirements Minimum Typical Maximum Unit Operating Temperature - 40 + 85 °C Relative humidity @ 25°C Storage Temperature - 40 + 85 °C Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved...

  • Page 14: Chapter Iii. General Characteristics

    ZE50-2.4 RF module User Guide 1vv0300837 Rev.2 – 22/03/20 CHAPTER III. GENERAL CHARACTERISTICS III.1. Mechanical Characteristics Rectangular 26 x 15 mm Size : 3 mm Height : 1,7 g Weight : 0.8 mm PCB thickness: • Dimensions : 21 x 14 x 2.2mm Cover : •...

  • Page 15: Iii.2. Mechanical Dimensions

    ZE50-2.4 RF Module User Guide 1vv0300837 Rev.2 – 22/03/20 III.2. Mechanical dimensions Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 15 of 47...

  • Page 16: Iii.3. Dc Characteristics

    ZE50-2.4 RF module User Guide 1vv0300837 Rev.2 – 22/03/20 III.3. DC Characteristics Characteristics Min. Typ. Max. Power Supply +2.4V +3.0V +3.6V Consumption @3.0V : 35mA Transmission : 31mA Reception : 2µA Stand-by (32.768 khz On) : Sleep (wake up on 1µA...

  • Page 17: Iii.4. Functional Characteristics

    ZE50-2.4 RF Module User Guide 1vv0300837 Rev.2 – 22/03/20 III.4. Functional characteristics Global 2400 - 2483.5 MHz Frequency band 5 MHz Channel spacing Channel number Channel 11 (2405MHz) → Channel 26 (2480MHz) DSSS Technology O-QPSK with half sine pulse shaping...
  • Page 18 ZE50-2.4 RF module User Guide 1vv0300837 Rev.2 – 22/03/20 Min. Typ. Max. Reception -92 dBm Sensitivity for CER=1% under 50 Ohms -3 dBm Saturation for CER=1% under 50 Ohms 38 dB Adjacent channel rejection + 5 MHz Wanted signal @ -82 dBm, adjacent modulated channel @ + 5 MHz, channel spacing for CER = 1 %.

  • Page 19: Iii.5. Digital Characteristics

    ZE50-2.4 RF Module User Guide 1vv0300837 Rev.2 – 22/03/20 III.5. Digital Characteristics 8051 core Microcontroller 128KB Flash, 8KB SRAM, Microcontroller Memory 16 Kbit EEPROM Peripheral memory • Full Duplex, from 1200 to 115200 bps Serial link • 7 or 8 bits, with or without parity, 1 or 2 stop bits •...

  • Page 20: Iii.7. Ordering Information

    ZE50-2.4 RF module User Guide 1vv0300837 Rev.2 – 22/03/20 III.7. Ordering information Three different equipments can be ordered : The SMD version The DIP interface version The Demokit The versions below are considered standard and should be readily available. For other versions, please contact Telit.
  • Page 21 ZE50-2.4 RF Module User Guide 1vv0300837 Rev.2 – 22/03/20 USB Dongle M ZE50/USB Demo Case D ZE50/DEMO Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 21 of 47...

  • Page 22: Chapter Iv. Technical Description

    ZE50-2.4 RF module User Guide 1vv0300837 Rev.2 – 22/03/20 CHAPTER IV. TECHNICAL DESCRIPTION IV.1. Pin-out of the SMD Module Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 22 of 47...
  • Page 23 ZE50-2.4 RF Module User Guide 1vv0300837 Rev.2 – 22/03/20 Pin name Pin type Signal level Function RF Ground connection for External antenna Ext_Antenna External antenna connection RF Ground connection for External antenna Ground Ground Power Digital and Radio part supply pin...

  • Page 24: Iv.2. Pin-Out Of The Dip Module

    ZE50-2.4 RF module User Guide 1vv0300837 Rev.2 – 22/03/20 IV.2. Pin-out of the DIP Module 2,54 mm 32,0 mm 67,5 mm Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 24 of 47...

  • Page 25: Iv.3. Correspondence

    ZE50-2.4 RF Module User Guide 1vv0300837 Rev.2 – 22/03/20 IV.3. Correspondence Pin-Out correspondence between ZE50-2.4/DIP, ZE50-2.4/SMD and CC2430 SOC. ZE50-2.4/DIP ZE50-2.4/SMD CC2430 SOC Comments Pin-out Pin-out Pin-out Pin 1 (J1): Not connected Pin 2 (J1): GND Pin 3 (J1): EA3...

  • Page 26: Iv.4. Description Of The Signals

    ZE50-2.4 RF module User Guide 1vv0300837 Rev.2 – 22/03/20 IV.4. Description of the Signals Signals Description External hardware reset of the radio module. Reset Active on low state. Serial link signals, format NRZ/TTL: TXD is for outgoing data. RXD is for incoming data.

  • Page 27: Chapter V. Process Information

    V.1. Delivery ZE50-2.4/SMD modules are delivered in plastic tray packaging, each tray including 50 units. The dimensions of the tray are the following: 329 mm x 176 mm x 5.6 mm. Each unit is placed in a 26.6 mm x 16 mm location. An empty tray weights 45 g and a loaded tray weights around 130 g.

  • Page 28: Storage

    After being submitted to the drying bake, tiny modules must be soldered on host boards within 168 hours. Also, it must be noted that due to some components, ZE50-2.4/SMD modules are ESD sensitive device. Therefore, ESD handling precautions should be carefully observed.
  • Page 29 ZE50-2.4 RF Module User Guide 1vv0300837 Rev.2 – 22/03/20 The recommended soldering pad layout on the host board for the ZE50-2.4/SMD-IA, is shown in the diagram below: All dimensions in mm Neither via-holes nor wires are allowed on the PCB upper layer in area occupied by the module.

  • Page 30: Solder Paste Composition (Rohs Process)

    V.4. Solder paste composition (RoHS process) ZE50-2.4/SMD module is designed for surface mounting using half-moon solder joints (see diagram below). For proper module assembly, solder paste must be printed on the target surface of the host board. The solder paste should be eutectic and made of 95.5% of SN, 4% of Ag and 0.5% of Cu.

  • Page 31: Soldering Profile (Rohs Process)

    V.6. Soldering profile (RoHS process) It must be noted that ZE50-2.4/SMD module should not be allowed to be hanging upside down during the reflow operation. This means that the module has to be assembled on the side of the printed circuit board that is soldered last.
  • Page 32 ZE50-2.4 RF module User Guide 1vv0300837 Rev.2 – 22/03/20 The barcode label located on the module shield is able to withstand the reflow temperature. CAUTION It must also be noted that if the host board is submitted to a wave soldering after the reflow operation, a solder mask must be used in order to protect the tiny radio module’s metal shield from being in...

  • Page 33: Chapter Vi. Board Mounting Recommendation

    BOARD MOUNTING RECOMMENDATION VI.1. Electrical environment The best performance of the ZE50-2.4 module are obtained in a “clean noise” environment. Some basic recommendations must be followed : Noisy electronic components (serial RS232, DC-DC Converter, Display, Ram, bus ,...) must be placed as far as possible from the ZE50-2.4 module.

  • Page 34: Vi.2. Power Supply Decoupling On Ze50-2.4 Module

    1vv0300837 Rev.2 – 22/03/20 VI.2. Power supply decoupling on ZE50-2.4 module The power supply of ZE50-2.4 module must be nearby decoupled. A LC filter must be placed as close as possible to the radio module power supply pin, V Power Supply...

  • Page 35: Vi.3. Rf Layout Considerations

    ZE50-2.4 RF Module User Guide 1vv0300837 Rev.2 – 22/03/20 VI.3. RF layout considerations Basic recommendations must be followed to achieve a good RF layout : It is recommended to fill all unused PCB area around the module with ground plane, except in case of integrated antenna (no ground plane must be placed in front of the antenna and on the bottom side).

  • Page 36: Vi.4. Antenna Connection On Printed Circuit Boards

    ZE50-2.4 RF module User Guide 1vv0300837 Rev.2 – 22/03/20 VI.4. Antenna connection on Printed Circuit Boards Special care must be taken when connecting an antenna or a connector to the module. The RF output impedance is 50 ohms, so the strip between the pad and the antenna or connector must be 50 ohms following the tables below.

  • Page 37: Vi.5. Ze50-2.4 Interfacing

    ZE50-2.4 RF Module User Guide 1vv0300837 Rev.2 – 22/03/20 VI.5. ZE50-2.4 interfacing : Example of a full RS-232 connection between a PC or an Automat (PLC) and ZE50-2.4/SMD-WA Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 37 of 47...

  • Page 38: Reproduction Forbidden Without Telit Communications S.p.a. Written Authorization - All Rights Reserved

    ZE50-2.4 RF module User Guide 1vv0300837 Rev.2 – 22/03/20 Example of a minimum PC connection with ZE50-2.4/SMD-IA . Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 38 of 47...

  • Page 39: Reproduction Forbidden Without Telit Communications S.p.a. Written Authorization - All Rights Reserved

    ZE50-2.4 RF Module User Guide 1vv0300837 Rev.2 – 22/03/20 Example for sensor connection with ZE50-2.4/SMD-IA. Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 39 of 47...

  • Page 40: Chapter Vii. Antenna Considerations

    ANTENNA CONSIDERATIONS VII.1. Antenna recommendations ZE50-2.4 performances when used in a product are strongly dependent on the antenna type and its location. Particular cautions are required on the following points: Use a good and efficient antenna designed for the 2.4 GHz band.

  • Page 41: Vii.2. Antenna Matching

    This is typically accomplished by inserting a matching network into a circuit between the source and the load. This matching network must be established as close as possible to the ZE50 module. Here after an example of matching network between a ZE50-2.4 module and an antenna. J29 RF Track 1...

  • Page 42: Vii.3. Antenna Types

    Fix the antenna on a metallic plane or on a metallic box with the metallic screw provided with the antenna. If the ZE50-2.4 module is integrated in a plastic box, use a metal tape (copper) glued on the plastic side under the antenna.

  • Page 43: Reproduction Forbidden Without Telit Communications S.p.a. Written Authorization - All Rights Reserved

    ZE50-2.4 RF Module User Guide 1vv0300837 Rev.2 – 22/03/20 Half Wave Dipole antenna: The ½ Wave Dipole antenna is around 6 cm long. In a ½ Wave Dipole antenna the metallic plane is replaced by a second ¼ Wave antenna balancing the radiation.

  • Page 44: Vii.5. Embeddable Antennas

    1vv0300837 Rev.2 – 22/03/20 VII.5. Embeddable antennas In this section you will find antennas designed to be directly attached to ZE50-2.4/SMD-WA module, inside the product casing. These antennas are only used in application where security, cosmetics, size or environmental issues make an external antenna impractical. This type of antenna is used when the integration factor becomes primordial (for mobile and handheld devices) to the range performances.

  • Page 45: Reproduction Forbidden Without Telit Communications S.p.a. Written Authorization - All Rights Reserved

    Antenna Characteristics: It is very important to avoid ground plane around and below the antenna, so ZE50-2.4/SMD-IA must be implemented as described in paragraph VI.3 and schematics VI.5. Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved...

  • Page 46: Chapter Viii. Annexes

    ZE50-2.4 RF module User Guide 1vv0300837 Rev.2 – 22/03/20 CHAPTER VIII. ANNEXES VIII.1. Examples of propagation attenuation 433 MHz 868 MHz 2.4 GHz Factor Attenuation Attenuation Attenuation Open office 0 dB 0 dB 0 dB Window < 1 dB 1 – 2 dB...

  • Page 47: Viii.2. Declaration Of Conformity

    ZE50-2.4 RF Module User Guide 1vv0300837 Rev.2 – 22/03/20 VIII.2. Declaration of Conformity Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 47 of 47...

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