Telit Wireless Solutions ZE51-2.4 User Manual
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Telit Wireless Solutions ZE51-2.4 User Manual

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ZE51/61-2.4 RF Module User Guide
1VV0300868
Rev.4 – 23/06/2011

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  • Page 1 ZE51/61-2.4 RF Module User Guide 1VV0300868 Rev.4 – 23/06/2011...
  • Page 2 ZE51/61-2.4 RF module User Guide 1VV0300868 Rev.4 – 23/06/2011 This document is related to the following product : Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 2 of 54...
  • Page 3 ZE51/61-2.4 RF Module User Guide 1VV0300868 Rev.4 – 23/06/2011 DISCLAIMER The information contained in this document is the proprietary information of Telit Communications S.p.A. and its affiliates (“TELIT”). The contents are confidential and any disclosure to persons other than the officers, employees, agents or subcontractors of the owner or licensee of this document, without the prior written consent of Telit, is strictly prohibited.

  • Page 4: Table Of Contents

    ZE51/61-2.4 RF module User Guide 1VV0300868 Rev.4 – 23/06/2011 CONTENTS CHAPTER I. INTRODUCTION ........................6  I.1. A   ....................................6 IM OF THE OCUMENT I.2. C   .................................. 6 ONTACT NFORMATION UPPORT I.3. R   ....................................7 EFERENCE DOCUMENTS I.4. D  ...
  • Page 5 ZE51/61-2.4 RF Module User Guide 1VV0300868 Rev.4 – 23/06/2011 VI.2. P   ZE51/61-2.4 ..........................35 OWER SUPPLY DECOUPLING ON MODULE VI.3. RF   ..................................36 LAYOUT CONSIDERATIONS VI.4. A   ..........................37 NTENNA CONNECTION ON RINTED IRCUIT OARDS VI.5. ZE51/61-2.4  ...

  • Page 6: Chapter I. Introduction

    ZE51/61-2.4 RF module User Guide 1VV0300868 Rev.4 – 23/06/2011 CHAPTER I. INTRODUCTION I.1. Aim of the Document The aim of this document is to present the features and the application of the ZE51/61-2.4 radio module. After the introduction, the characteristics of the ZE51/61-2.4 radio module will be described within the following distinct chapters: Requirements General Characteristics...

  • Page 7: Reference Documents

    ZE51/61-2.4 RF Module User Guide 1VV0300868 Rev.4 – 23/06/2011 I.3. Reference documents Wireless MAC and PHY Specifications for Low Rate - WPANs [1] IEEE Std. 802.15.4-2006 ERC Recommendation for SRD, October 2010 [2] ERC Rec 70-03 ETSI Standards for SRD , October 2006 [3] EN 300 328-1 V1.7.1 (Europe) ETSI Standards for SRD , August 2010 [4] EN 300 440-1 V1.6.1 (Europe)

  • Page 8: Glossary

    ZE51/61-2.4 RF module User Guide 1VV0300868 Rev.4 – 23/06/2011 I.5. Glossary Association of Radio Industries and Businesses ARIB Bit Error Rate Bits per second (1000 bits/s = 1Kbps = 1Kbaud) Bits/s European Conference of Postal and Telecommunications Administrations CEPT Code of Federal Regulations Chip or chip sequence refers to a spreading-code used to transform the original Chips data to DSSS...

  • Page 9: Chapter Ii. Requirements

    ZE51/61-2.4 RF Module User Guide 1VV0300868 Rev.4 – 23/06/2011 CHAPTER II. REQUIREMENTS II.1. Regulations requirements compliant multi channel radio modem in the 2.4GHz band (unlicensed The ZE51/61-2.4 module is a [1],[2],[6],[7] frequency band). Europe Regulation: The “ERC recommendation 70-03” [2] describes the limits band in the 2.4GHz license free band, in terms of bandwidth, maximum power, duty cycle, channel spacing and type of application.
  • Page 10 ZE51/61-2.4 RF module User Guide 1VV0300868 Rev.4 – 23/06/2011 Restrictions for non specific SR devices Annex 1h 2400-2483.5MHz: Country Restriction Reason/Remark This subsection does not apply for the Norway Implemented geographical area within a radius of 20 km from the centre of Ny-Ålesund Russian Bluetooth Federation...
  • Page 11 ZE51/61-2.4 RF Module User Guide 1VV0300868 Rev.4 – 23/06/2011 resources accounting systems or security systems. 2.3. Maximum mean e.i.r.p. density is 10 mW/MHz. Maximum 100 mW e.i.r.p. Indoor applications For the complete document please refer to [2] and EU Commission Decision [9], [10].

  • Page 12: Ii.2. Functional Requirements

    The technical support for these tools will be done by the providing company. All necessary drivers for ZE51-2.4 Usb dongle can be found under the following link: http://www.ftdichip.com/Drivers/VCP.htm A complete correspondence table of the connections between the CC2530 and the pin out of the module, as well as the connections to the included STM M24C64 EEPROM can be found in chapter IV.3.

  • Page 13: Ii.4. Temperature Requirements

    ZE51/61-2.4 RF Module User Guide 1VV0300868 Rev.4 – 23/06/2011 II.4. Temperature Requirements Minimum Typical Maximum Unit Operating Temperature - 40 + 85 °C Relative humidity @ 25°C Storage Temperature - 40 + 85 °C Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 13 of 54...

  • Page 14: Chapter Iii. General Characteristics

    ZE51/61-2.4 RF module User Guide 1VV0300868 Rev.4 – 23/06/2011 CHAPTER III. GENERAL CHARACTERISTICS III.1. Mechanical Characteristics Rectangular 26 x 15 mm Size : 3 mm Height : 1,7 g Weight : 0.8 mm PCB thickness:  Dimensions : 21 x 14 x 2.2mm Cover : ...

  • Page 15: Iii.2. Mechanical Dimensions

    ZE51/61-2.4 RF Module User Guide 1VV0300868 Rev.4 – 23/06/2011 III.2. Mechanical dimensions Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 15 of 54...

  • Page 16: Iii.3. Dc Characteristics

    ZE51/61-2.4 RF module User Guide 1VV0300868 Rev.4 – 23/06/2011 III.3. DC Characteristics Measured on ZE51/61-2.4/DIP interface with T = 25°C, Vdd = 3V, 50 ohm impedance if nothing else noted. Max limits apply over the entire operating range, T=-40°C to +85°C, Vdd=2V to 3.6V and all channels. Characteristics ZE51 Min.

  • Page 17: Iii.4. Functional Characteristics

    ZE51/61-2.4 RF Module User Guide 1VV0300868 Rev.4 – 23/06/2011 III.4. Functional characteristics Measured on ZE51/61-2.4/DIP interface with T = 25°C, Vdd = 3V, 50 ohm impedance if nothing else noted. Global 2400 - 2483.5 MHz Frequency band 5 MHz Channel spacing 16 : Channel 11 (2405MHz) ...
  • Page 18 ZE51/61-2.4 RF module User Guide 1VV0300868 Rev.4 – 23/06/2011 (Complies with [3], [4], [6], [7]) Error Vector Magnitude (EVM) * : It’s the responsibility of Telit customers to check that RF output power of the final product is compliant with the local regulation.
  • Page 19 ZE51/61-2.4 RF Module User Guide 1VV0300868 Rev.4 – 23/06/2011 Min. Typ. Max. Reception ZE61 -99 dBm -100dBm Sensitivity for PER=1% 0 dBm Saturation for PER=1% 49 dB Adjacent channel rejection +/- 5 MHz Wanted signal @ -82 dBm, adjacent modulated channel @ +/- 5 MHz, channel spacing for PER = 1 %.

  • Page 20: Iii.5. Digital Characteristics

    ZE51/61-2.4 RF module User Guide 1VV0300868 Rev.4 – 23/06/2011 III.5. Digital Characteristics 8051 core Microcontroller 256KB Flash, 8KB SRAM, Microcontroller Memory 8 KB EEPROM Peripheral memory Managed by application. Serial link*  Full Duplex, from 1200 to 115200 bps  7 or 8 bits, with or without parity, 1 or 2 stop bits ...

  • Page 21: Iii.6. Absolute Maximum Ratings

    ZE51/61-2.4 RF Module User Guide 1VV0300868 Rev.4 – 23/06/2011 III.6. Absolute Maximum Ratings ZE51 -0.3V to +3.9V Voltage applied to V -0.3V to V +0.3V, max 3.9 V Voltage applied to any digital pin 10 dBm Input RF level ZE61 -0.3V to +3.6V Voltage applied to V -0.3V to V...

  • Page 22: Iii.7. Ordering Information

    ZE51/61-2.4 RF module User Guide 1VV0300868 Rev.4 – 23/06/2011 III.7. Ordering information The following equipments can be ordered: The SMD version The DIP interface version The USB dongle The Demo Case The versions below are considered standard and should be readily available. For other versions, please contact Telit.

  • Page 23: Chapter Iv. Technical Description

    ZE51/61-2.4 RF Module User Guide 1VV0300868 Rev.4 – 23/06/2011 CHAPTER IV. TECHNICAL DESCRIPTION IV.1. Pin-out of the SMD Module Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 23 of 54...
  • Page 24 ZE51/61-2.4 RF module User Guide 1VV0300868 Rev.4 – 23/06/2011 Pin name Pin type Signal level Function RF Ground connection for external antenna Ext_Antenna RF I/O connection to external antenna RF Ground connection for external antenna Ground Ground Power Digital and Radio part power supply pin Clear To Send RESET µC reset ( Active low with internal pull-up )

  • Page 25: Iv.2. Dip Module Mechanical Dimensions And Pin-Out

    ZE51/61-2.4 RF Module User Guide 1VV0300868 Rev.4 – 23/06/2011 IV.2. DIP Module mechanical dimensions and pin-out Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 25 of 54...

  • Page 26: Iv.3. Pin-Out Correspondence Table

    ZE51/61-2.4 RF module User Guide 1VV0300868 Rev.4 – 23/06/2011 IV.3. Pin-out correspondence table Pin-Out correspondence between ZE51/61-2.4/DIP, ZE51/61-2.4/SMD and CC2530 SOC. ZE51/61-2.4/DIP ZE51/61-2.4/SMD CC2530 SOC Comments Connector Pin Name Pin Name P0_4 P1_1 P1_0 P0_3 P0_2 AVDD,DVDD PROG P2_0 P1_3 P1_2 Reset Reset_N...

  • Page 27: Iv.4. Description Of The Signals

    ZE51/61-2.4 RF Module User Guide 1VV0300868 Rev.4 – 23/06/2011 IV.4. Description of the Signals Signals Description External hardware reset of the radio module. Reset Active on low state. Serial link signals, format NRZ/TTL: TXD is for outgoing data. RXD is for incoming data. TXD, RXD The ‘1’...

  • Page 28: Chapter V. Process Information

    ZE51/61-2.4 RF module User Guide 1VV0300868 Rev.4 – 23/06/2011 CHAPTER V. PROCESS INFORMATION V.1. Delivery ZE51/61-2.4/SMD modules are delivered in plastic tray packaging, each tray including 50 units. The dimensions of the tray are the following: 329 mm x 176 mm x 5.6 mm. Each unit is placed in a 26.6 mm x 16 mm location. An empty tray weights 45 g and a loaded tray weights around 130 g.

  • Page 29: Storage

    ZE51/61-2.4 RF Module User Guide 1VV0300868 Rev.4 – 23/06/2011 V.2. Storage The optimal storage environment for ZE51/61-2.4/SMD modules should be dust free, dry and the temperature should be included between -40°C and +85°C. In case of a reflow soldering process, tiny radio modules must be submitted to a drying bake at +60°C during 24 hours.
  • Page 30 ZE51/61-2.4 RF module User Guide 1VV0300868 Rev.4 – 23/06/2011 The recommended soldering pad layout on the host board for the ZE51/61-2.4/SMD-IA, is shown in the diagram below: All dimensions in mm Neither via-holes nor wires are allowed on the PCB upper layer in area occupied by the module. Reproduction forbidden without Telit Communications S.p.A.

  • Page 31: Solder Paste Composition (Rohs Process)

    ZE51/61-2.4 RF Module User Guide 1VV0300868 Rev.4 – 23/06/2011 V.4. Solder paste composition (RoHS process) ZE51/61-2.4/SMD module is designed for surface mounting using half-moon solder joints (see diagram below). For proper module assembly, solder paste must be printed on the target surface of the host board. The solder paste should be eutectic and made of 95.5% of SN, 4% of Ag and 0.5% of Cu.

  • Page 32: Soldering Profile (Rohs Process)

    ZE51/61-2.4 RF module User Guide 1VV0300868 Rev.4 – 23/06/2011 V.6. Soldering profile (RoHS process) It must be noted that ZE51/61-2.4/SMD module should not be allowed to be hanging upside down during the reflow operation. This means that the module has to be assembled on the side of the printed circuit board that is soldered last.
  • Page 33 ZE51/61-2.4 RF Module User Guide 1VV0300868 Rev.4 – 23/06/2011 The barcode label located on the module shield is able to withstand the reflow temperature. CAUTION It must also be noted that if the host board is submitted to a wave soldering after the reflow operation, a solder mask must be used in order to protect the tiny radio module’s metal shield from being in contact with the solder wave.

  • Page 34: Chapter Vi. Board Mounting Recommendation

    ZE51/61-2.4 RF module User Guide 1VV0300868 Rev.4 – 23/06/2011 CHAPTER VI. BOARD MOUNTING RECOMMENDATION VI.1. Electrical environment The best performances of the ZE51/61-2.4 module are obtained in a “clean noise” environment. Some basic recommendations must be followed:  Noisy electronic components (serial RS232, DC-DC Converter, Display, Ram, bus ,...) must be placed as far as possible from the ZE51/61-2.4 module.

  • Page 35: Vi.2. Power Supply Decoupling On Ze51/61-2.4 Module

    ZE51/61-2.4 RF Module User Guide 1VV0300868 Rev.4 – 23/06/2011 VI.2. Power supply decoupling on ZE51/61-2.4 module The power supply of ZE51/61-2.4 module must be nearby decoupled. A LC filter must be placed as close as possible to the radio module power supply pin, V Power Supply Symbols Reference...

  • Page 36: Vi.3. Rf Layout Considerations

    ZE51/61-2.4 RF module User Guide 1VV0300868 Rev.4 – 23/06/2011 VI.3. RF layout considerations Basic recommendations must be followed to achieve a good RF layout :  It is recommended to fill all unused PCB area around the module with ground plane, except in case of integrated antenna (no ground plane must be placed in front of the antenna and on the bottom side).

  • Page 37: Vi.4. Antenna Connection On Printed Circuit Boards

    ZE51/61-2.4 RF Module User Guide 1VV0300868 Rev.4 – 23/06/2011 VI.4. Antenna connection on Printed Circuit Boards Special care must be taken when connecting an antenna or a connector to the module. The RF output impedance is 50 ohms, so the strip between the pad and the antenna or connector must be 50 ohms following the tables below.

  • Page 38: Vi.5. Ze51/61-2.4 Interfacing

    ZE51/61-2.4 RF module User Guide 1VV0300868 Rev.4 – 23/06/2011 VI.5. ZE51/61-2.4 interfacing : Example of a full RS-232 connection between a PC or an Automat (PLC) and ZE51/61-2.4/SMD-WA Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 38 of 54...
  • Page 39 ZE51/61-2.4 RF Module User Guide 1VV0300868 Rev.4 – 23/06/2011 Example of a minimum PC connection with ZE51/61-2.4/SMD-IA . Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 39 of 54...
  • Page 40 ZE51/61-2.4 RF module User Guide 1VV0300868 Rev.4 – 23/06/2011 Example for sensor connection with ZE51/61-2.4/SMD-IA. Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 40 of 54...

  • Page 41: Chapter Vii. Antenna Considerations

    ZE51/61-2.4 RF Module User Guide 1VV0300868 Rev.4 – 23/06/2011 CHAPTER VII. ANTENNA CONSIDERATIONS VII.1. Antenna recommendations ZE51/61-2.4 performances when used in a product are strongly dependent on the antenna type and its location. Particular cautions are required on the following points: ...

  • Page 42: Vii.2. Antenna Matching

    Antenna Connection Hereafter an example of matching network used on the DIP interface board : Symbols Reference Package Value Comments Resistor 0603 0 ohm ZE51-2.4/DIP-WA Monolithic Ceramic 0603 1.5 pF ZE61-2.4/DIP-WA capacitor COG Not mounted ZE51-2.4/DIP-WA Not mounted ZE61-2.4/DIP-WA ...

  • Page 43: Vii.3. Antenna Types

    ZE51/61-2.4 RF Module User Guide 1VV0300868 Rev.4 – 23/06/2011 VII.3. Antenna types The following are the antenna examples that may be suitable for ZE51/61-2.4/SMD-WA applications. We distinguish two types of antenna:  External antenna (antenna is mounted outside of the device) ...
  • Page 44 ZE51/61-2.4 RF module User Guide 1VV0300868 Rev.4 – 23/06/2011 Half Wave Dipole antenna: The ½ Wave Dipole antenna is around 6 cm long. In a ½ Wave Dipole antenna the metallic plane is replaced by a second ¼ Wave antenna balancing the radiation. Half wave monopole antenna typically offers a ground-independent design with favorable gain, excellent radiation pattern.

  • Page 45: Vii.5. Embeddable Antennas

    ZE51/61-2.4 RF Module User Guide 1VV0300868 Rev.4 – 23/06/2011 VII.5. Embeddable antennas In this section you will find antennas designed to be directly attached to ZE51/61-2.4/SMD-WA module, inside the product casing. These antennas are only used in application where security, cosmetics, size or environmental issues make an external antenna impractical.
  • Page 46 Radiation Pattern of ZE51-2.4/DIP board It is very important to avoid ground plane around and below the antenna, so ZE51-2.4/SMD-IA must be implemented as described in paragraph VI.3 and schematics VI.5. Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved...
  • Page 47 ZE51/61-2.4 RF Module User Guide 1VV0300868 Rev.4 – 23/06/2011 ZE61-2.4/SMD-IA: Integrated antenna: ZE61-2.4 module is available with an integrated chip antenna, allowing very compact integration for small space application. RADIATION PATTERN   Horizontal plane  ( X , Y ) 20,00 15,00 10,00 5,00 Rotation 0,00 ‐5,00 ‐10,00 Test Test antenna  Vertical Test antenna  Horizontal  ...

  • Page 48: Chapter Viii. Annexes

    ZE51/61-2.4 RF module User Guide 1VV0300868 Rev.4 – 23/06/2011 CHAPTER VIII. ANNEXES VIII.1. Declaration of Conformity Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 48 of 54...
  • Page 49 ZE51/61-2.4 RF Module User Guide 1VV0300868 Rev.4 – 23/06/2011 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 49 of 54...
  • Page 50 ZE51/61-2.4 RF module User Guide 1VV0300868 Rev.4 – 23/06/2011 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 50 of 54...
  • Page 51 ZE51/61-2.4 RF Module User Guide 1VV0300868 Rev.4 – 23/06/2011 Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 51 of 54...

  • Page 52: Viii.2. Conformity Assessment Issues Fcc/Ic

    ZE51/61-2.4 RF module User Guide 1VV0300868 Rev.4 – 23/06/2011 VIII.2. Conformity Assessment Issues FCC/IC Modules ZE51/61 are FCC/IC approved as modules to be installed in other devices. If the final product after integration is intended for portable use, a new application and FCC/IC is required. FCC Notice The FCC notifies users that any changes or modifications made to this device that are not expressly approved by Telit Communications S.P.A.

  • Page 53: Viii.3. Examples Of Propagation Attenuation

    ZE51/61-2.4 RF Module User Guide 1VV0300868 Rev.4 – 23/06/2011 Wireless notice This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.

  • Page 54: Viii.4. Output Power Programming

    ZE51/61-2.4 RF module User Guide 1VV0300868 Rev.4 – 23/06/2011 VIII.4. Output power programming The results are measured on the ZE61-2.4/DIP interface with T = 25°C, Vdd = 3 V, 2440 Mhz, 50 ohm impedance if nothing else noted. TxPower register Power (dBm) Current (dBm) Comments...

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