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ZE60-2.4 RF module User Guide 1vv0300844 Rev.2 – 24/08/2010 This document is related to the following product : Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 2 of 45...
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ZE60-2.4 RF module User Guide 1vv0300844 Rev.2 – 24/08/2010 DISCLAIMER The information contained in this document is the proprietary information of Telit Communications S.p.A. and its affiliates (“TELIT”). The contents are confidential and any disclosure to persons other than the officers, employees, agents or subcontractors of the owner or licensee of this document, without the prior written consent of Telit, is strictly prohibited.
ZE60-2.4 RF module User Guide 1vv0300844 Rev.2 – 24/08/2010 CONTENTS CHAPTER I. INTRODUCTION ........................6 I.1. A ....................................6 IM OF THE OCUMENT I.2. R ....................................7 EFERENCE DOCUMENTS I.3. D ....................................7 OCUMENT CHANGE LOG I.4. G ...
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ZE60-2.4 RF module User Guide 1vv0300844 Rev.2 – 24/08/2010 VI.3. RF ..................................34 LAYOUT CONSIDERATIONS VI.4. A ..........................35 NTENNA CONNECTION ON RINTED IRCUIT OARDS VI.5. ZE60-2.4 : ..................................... 36 INTERFACING CHAPTER VII. ANTENNA CONSIDERATIONS..................39 ...
I.1. Aim of the Document The aim of this document is to present the features and the application of the ZE60-2.4 radio module. After the introduction, the characteristics of the ZE60-2.4 radio module will be described within the following distinct...
ZE60-2.4 RF module User Guide 1vv0300844 Rev.2 – 24/08/2010 I.2. Reference documents [1] IEEE Std. 802.15.4-2006 Wireless MAC and PHY Specifications for Low Rate - WPANs [2] ERC Rec 70-03 ERC Recommendation for SRD, June 2009 [3] EN 300 328-1 V1.7.1 (Europe) ETSI Standards for SRD , October 2006 [4] EN 300 440-1 V1.5.1 (Europe)
ZE60-2.4 RF module User Guide 1vv0300844 Rev.2 – 24/08/2010 I.4. Glossary ARIB Association of Radio Industries and Businesses Bit Error Rate Bits/s Bits per second (1000 bits/s = 1Kbps = 1Kbaud) Character Error Rate CEPT European Conference of Postal and Telecommunications Administrations...
1vv0300844 Rev.2 – 24/08/2010 CHAPTER II. REQUIREMENTS II.1. Regulations requirements The ZE60-2.4 module is a [1],[2],[6],[7] compliant multi channel radio modem in the 2.4GHz band (unlicensed frequency band). Europe Regulation: The “ERC recommendation 70-03” [2] describes the limits band in the 2.4GHz license free band, in terms of bandwidth, maximum power, duty cycle, channel spacing and type of application.
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ZE60-2.4 RF module User Guide 1vv0300844 Rev.2 – 24/08/2010 Restrictions for non specific SR devices Annex 1h 2400-2483.5MHz: Country Restriction Reason/Remark This subsection does not apply for the Norway Implemented geographical area within a radius of 20 km from the centre of Ny-Ålesund...
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ZE60-2.4 RF module User Guide 1vv0300844 Rev.2 – 24/08/2010 USA Regulation: In the United States the FCC is responsible for the regulation of all RF devices. Our module intended for unlicensed operation is regulated by CFR 47, Part 15 [6].
ZE60-2.4 RF module User Guide 1vv0300844 Rev.2 – 24/08/2010 II.2. Functional Requirements The ZE60-2.4 module is a complete solution from serial interface to RF interface. The ZE60-2.4 module has a digital part and a RF part. The digital part has the following functionalities:...
ZE60-2.4 RF module User Guide 1vv0300844 Rev.2 – 24/08/2010 II.4. Temperature Requirements Minimum Typical Maximum Unit Operating Temperature - 40 + 85 °C Relative humidity @ 25°C Storage Temperature - 40 + 85 °C Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved...
ZE60-2.4 RF module User Guide 1vv0300844 Rev.2 – 24/08/2010 CHAPTER III. GENERAL CHARACTERISTICS III.1. Mechanical Characteristics Size : Rectangular 26 x 15 mm Height : 3 mm 1,7 g Weight : PCB thickness: 0.8 mm • Dimensions : 21 x 14 x 2.2mm Cover : •...
ZE60-2.4 RF module User Guide 1vv0300844 Rev.2 – 24/08/2010 III.2. Mechanical dimensions Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 15 of 45...
ZE60-2.4 RF module User Guide 1vv0300844 Rev.2 – 24/08/2010 III.7. Ordering information Two different equipments can be ordered : The SMD version The DIP interface version The versions below are considered standard and should be readily available. For other versions, please contact Telit.
ZE60-2.4 RF module User Guide 1vv0300844 Rev.2 – 24/08/2010 CHAPTER IV. TECHNICAL DESCRIPTION IV.1. Pin-out of the SMD Module Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 21 of 45...
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ZE60-2.4 RF module User Guide 1vv0300844 Rev.2 – 24/08/2010 Pin name Pin type Signal level Function RF Ground connection for External antenna Ext_Antenna External antenna connection RF Ground connection for External antenna Ground Ground Power Digital and Radio part supply pin...
ZE60-2.4 RF module User Guide 1vv0300844 Rev.2 – 24/08/2010 IV.2. Pin-out of the DIP Module 2,54 mm 32,0 mm 67,5 mm Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 23 of 45...
ZE60-2.4 RF module User Guide 1vv0300844 Rev.2 – 24/08/2010 IV.4. Description of the Signals Signals Description External hardware reset of the radio module. Reset Active on low state. Serial link signals, format NRZ/TTL: TXD, RXD TXD is for outgoing data. RXD is for incoming data.
V.1. Delivery ZE60-2.4/SMD modules are delivered in plastic tray packaging, each tray including 50 units. The dimensions of the tray are the following: 329 mm x 176 mm x 5.6 mm. Each unit is placed in a 26.6 mm x 16 mm location. An empty tray weights 45 g and a loaded tray weights around 130 g.
After being submitted to the drying bake, tiny modules must be soldered on host boards within 168 hours. Also, it must be noted that due to some components, ZE60-2.4/SMD modules are ESD sensitive device. Therefore, ESD handling precautions should be carefully observed.
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ZE60-2.4 RF module User Guide 1vv0300844 Rev.2 – 24/08/2010 The recommended soldering pad layout on the host board for the ZE60-2.4/SMD-IA, is shown in the diagram below: All dimensions in mm Neither via-holes nor wires are allowed on the PCB upper layer in area occupied by the module.
V.4. Solder paste composition (RoHS process) ZE60-2.4/SMD module is designed for surface mounting using half-moon solder joints (see diagram below). For proper module assembly, solder paste must be printed on the target surface of the host board. The solder paste should be eutectic and made of 95.5% of SN, 4% of Ag and 0.5% of Cu.
V.6. Soldering profile (RoHS process) It must be noted that ZE60-2.4/SMD module should not be allowed to be hanging upside down during the reflow operation. This means that the module has to be assembled on the side of the printed circuit board that is soldered last.
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ZE60-2.4 RF module User Guide 1vv0300844 Rev.2 – 24/08/2010 The barcode label located on the module shield is able to withstand the reflow temperature. CAUTION It must also be noted that if the host board is submitted to a wave soldering after the reflow operation, a solder mask must be used in order to protect the tiny radio module’s metal shield from being in...
BOARD MOUNTING RECOMMENDATION VI.1. Electrical environment The best performances of the ZE60-2.4 module are obtained in a “clean noise” environment. Some basic recommendations must be followed : Noisy electronic components (serial RS232, DC-DC Converter, Display, Ram, bus,...) must be placed as far as possible from the ZE60-2.4 module.
1vv0300844 Rev.2 – 24/08/2010 VI.2. Power supply decoupling on ZE60-2.4 module The power supply of ZE60-2.4 module must be nearby decoupled. A LC filter must be placed as close as possible to the radio module power supply pin, V Power Supply...
ZE60-2.4 RF module User Guide 1vv0300844 Rev.2 – 24/08/2010 VI.3. RF layout considerations Basic recommendations must be followed to achieve a good RF layout : It is recommended to fill all unused PCB area around the module with ground plane, except in case of integrated antenna (no ground plane must be placed in front of the antenna and on the bottom side).
ZE60-2.4 RF module User Guide 1vv0300844 Rev.2 – 24/08/2010 VI.4. Antenna connection on Printed Circuit Boards Special care must be taken when connecting an antenna or a connector to the module. The RF output impedance is 50 ohms, so the strip between the pad and the antenna or connector must be 50 ohms following the tables below.
ZE60-2.4 RF module User Guide 1vv0300844 Rev.2 – 24/08/2010 VI.5. ZE60-2.4 interfacing : Example of a full RS-232 connection between a PC or an Automat (PLC) and ZE60-2.4/SMD-WA Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 36 of 45...
ZE60-2.4 RF module User Guide 1vv0300844 Rev.2 – 24/08/2010 Example of a minimum PC connection with ZE60-2.4/SMD-IA . Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 37 of 45...
ZE60-2.4 RF module User Guide 1vv0300844 Rev.2 – 24/08/2010 Example for sensor connection with ZE60-2.4/SMD-IA. Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 38 of 45...
ANTENNA CONSIDERATIONS VII.1. Antenna recommendations ZE60-2.4 performances when used in a product are strongly dependent on the antenna type and its location. Particular cautions are required on the following points: Use a good and efficient antenna designed for the 2.4 GHz band.
This is typically accomplished by inserting a matching network into a circuit between the source and the load. This matching network must be established as close as possible to the ZE60 module. Here after an example of matching network between a ZE60-2.4 module and an antenna. J29 RF Track 1...
Fix the antenna on a metallic plane or on a metallic box with the metallic screw provided with the antenna. If the ZE60-2.4 module is integrated in a plastic box, use a metal tape (copper) glued on the plastic side under the antenna.
ZE60-2.4 RF module User Guide 1vv0300844 Rev.2 – 24/08/2010 Half Wave Dipole antenna: The ½ Wave Dipole antenna is around 6 cm long. In a ½ Wave Dipole antenna the metallic plane is replaced by a second ¼ Wave antenna balancing the radiation.
1vv0300844 Rev.2 – 24/08/2010 VII.5. Embeddable antennas In this section you will find antennas designed to be directly attached to ZE60-2.4/SMD-WA module, inside the product casing. These antennas are only used in application where security, cosmetics, size or environmental issues make an external antenna impractical. This type of antenna is used when the integration factor becomes primordial (for mobile and handheld devices) to the range performances.
Clearance zone: See user manual: UM_FR05-S1-N-0-110 It is very important to avoid ground plane around and below the antenna, so ZE60-2.4/SMD-IA must be implemented as described in paragraph VI.3 and schematics VI.5. Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved...
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