Sagem myZ-5 Technical Documentation Manual page 79

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myZ-5
(OHFWURQLF ERDUG H[FKDQJH SURFHVV
Mobile phone with deffect on
Remove the defect
electronic board
Proc 1.08
Replace the electronic
swap board in the hanset
(Check the reference
Follow the SMT swap
instructions
Standard tests
Tests OK
wavetek tests
Tests OK
Back to customer
Contents
(TXLSSHG HOHFWURQLF ERDUG H[FKDQJH
PCB
25M)
NO
Check the assembly
YES
NO
YES
YES
Shipment of defective
boards to SAGEM
REF MTB DTS 9- Indice B - December 09 2005
NO
Assembly
OK
YES
Proc Sheet 1 20
3/3
Detection of N3 defect : See
the Technical documentation
-Check oxidation under
the metal dome .
- Audio parameters
written on the new
swap board
- Display test : Hot Line Menu
- Keypad test
- Vibrating device test
- See Technical
documentation (test sheet 05)
- Follow return instructions
page 5-31
Page 5-20
Procedure
Proc 0 01
Proc 1 01
Proc 1 02
Proc 1 04
Proc 1 08
Proc 1 13
Proc 1 14
Proc 1 18
Proc 1 20
Proc 1 26
Proc 1 27
Proc 1 29
Proc 1 30
Proc 1 31
Proc 1 32
Proc 2 01
Proc 2 02
Proc 2 04
Proc 3 01
Proc 3 02
Proc 4 01
Symptom
Symp 01
Symp 02
Symp 03
Symp 04
Symp 05
Symp 06
Symp 07
Symp 08
Symp 09
Symp 10
Test
Test 01
Test 02
Test 03
Test 04
Test 05
Test 06
Test 07

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