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Sony CMOS CXP854P60 Specification page 20

8-bit single-chip microcomputer
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Package Outline
Unit: mm
64PIN
+ 0.4
57.6 – 0.1
64
1
SONY CODE
SDIP-64P-01
EIAJ CODE
P-SDIP64-17.1x57.6-1.778
JEDEC CODE
64PIN
+ 0.4
57.6 – 0.1
64
1
SONY CODE
SDIP-64P-01
EIAJ CODE
P-SDIP64-17.1x57.6-1.778
JEDEC CODE
LEAD SPECIFICATIONS
ITEM
LEAD MATERIAL
ALLOY 42
LEAD TREATMENT
Sn-Bi 2.5%
LEAD TREATMENT THICKNESS
5-18 m
SDIP (PLASTIC)
33
32
1.778
0.5
0.1
0.9
0.15
PACKAGE STRUCTURE
PACKAGE MATERIAL
EPOXY RESIN
LEAD TREATMENT
SOLDER PLATING
LEAD MATERIAL
42/COPPER ALLOY
PACKAGE MASS
8.6g
SDIP (PLASTIC)
33
32
1.778
0.5
0.1
0.9
0.15
PACKAGE STRUCTURE
PACKAGE MATERIAL
EPOXY RESIN
LEAD TREATMENT
SOLDER PLATING
LEAD MATERIAL
42/COPPER ALLOY
PACKAGE MASS
8.6g
SPEC.
– 20 –
0˚ to 15˚
0˚ to 15˚
CXP854P60

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