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Sony CMOS CXP854P60 Specification page 21

8-bit single-chip microcomputer
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Package Outline
Unit: mm
64PIN QFP (PLASTIC)
23.9
0.4
+ 0.4
20.0 – 0.1
51
52
64
1
1.0
0.4 – 0.1
QFP-64P-L01
SONY CODE
EIAJ CODE
P-QFP64-14x20-1.0
JEDEC CODE
64PIN QFP (PLASTIC)
23.9
0.4
+ 0.4
20.0 – 0.1
51
52
64
1
1.0
0.4 – 0.1
SONY CODE
QFP-64P-L01
EIAJ CODE
P-QFP64-14x20-1.0
JEDEC CODE
LEAD SPECIFICATIONS
ITEM
LEAD MATERIAL
ALLOY 42
LEAD TREATMENT
Sn-Bi 2.5%
LEAD TREATMENT THICKNESS
5-18 m
33
32
20
19
+ 0.35
+ 0.15
2.75 – 0.15
0
˚
to10
M
0.2
PACKAGE STRUCTURE
PACKAGE MATERIAL
EPOXY RESIN
SOLDER PLATING
LEAD TREATMENT
LEAD MATERIAL
42/COPPER ALLOY
1.5g
PACKAGE MASS
33
32
20
19
+ 0.15
+ 0.35
2.75 – 0.15
˚
0
to10
M
0.2
PACKAGE STRUCTURE
PACKAGE MATERIAL
EPOXY RESIN
LEAD TREATMENT
SOLDER PLATING
LEAD MATERIAL
42/COPPER ALLOY
1.5g
PACKAGE MASS
SPEC.
– 21 –
+ 0.1
0.15 – 0.05
0.15
+ 0.2
0.1 – 0.05
˚
+ 0.1
0.15 – 0.05
0.15
+ 0.2
0.1 – 0.05
˚
CXP854P60
Sony Corporation

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