Sony CMOS CXP854P60 Specification page 21

Package Outline Unit: mm
64PIN QFP (PLASTIC)
23.9 0.4
+ 0.4
20.0 – 0.1
51
52
64
1
1.0
0.4 – 0.1
QFP-64P-L01
SONY CODE
EIAJ CODE P-QFP64-14x20-1.0
JEDEC CODE
64PIN QFP (PLASTIC)
23.9 0.4
+ 0.4
20.0 – 0.1
51
52
64
1
1.0
0.4 – 0.1
SONY CODE QFP-64P-L01
EIAJ CODE P-QFP64-14x20-1.0
JEDEC CODE
LEAD SPECIFICATIONS
ITEM
LEAD MATERIAL ALLOY 42
LEAD TREATMENT Sn-Bi 2.5%
LEAD TREATMENT THICKNESS 5-18 m
33
32
20
19
+ 0.35
+ 0.15
2.75 – 0.15
0 ˚ to10
M
0.2
PACKAGE STRUCTURE
PACKAGE MATERIAL EPOXY RESIN
SOLDER PLATING
LEAD TREATMENT
LEAD MATERIAL 42/COPPER ALLOY
1.5g
PACKAGE MASS
33
32
20
19
+ 0.15 + 0.35
2.75 – 0.15
˚
0 to10
M
0.2
PACKAGE STRUCTURE
PACKAGE MATERIAL EPOXY RESIN
LEAD TREATMENT SOLDER PLATING
LEAD MATERIAL 42/COPPER ALLOY
1.5g
PACKAGE MASS
SPEC.
– 21 –
+ 0.1
0.15 – 0.05
0.15
+ 0.2
0.1 – 0.05
˚
+ 0.1
0.15 – 0.05
0.15
+ 0.2
0.1 – 0.05
˚
CXP854P60
Sony Corporation