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OVERVIEW
Description
The SED1751 is an 120 output, 3-level low-resistance common (row) driver suitable for high-quality,
high-response-speed MLS (Multi Line Selection) driving.
The SED1751 receives signals from LCD controllers such as the SED1335, and when used is used in
conjunction with the SED1580, can be used to structure a 4-line MLS drive.
The SED1751 uses a slim-chip form that is useful for making LCD panels slimmer. It also supports reduced
logic system voltage operation, making it suitable for a broad range of applications.
The SED1751 has a pad layout supporting easy mounting, and supports bi-directional selection of driver
output order, and has the highest use efficiency for 1/240 and 1/480 duty panels.
Features
• LCD driver outputs ...................................... 120
• Low output ON resistance
• High duty drive supported ........................... 1/480 (Reference value)
• Broad range of LC drive voltages ............... + 14 to + 42 V (V
• Output shift direction pin select is possible
• Can be switched between 100 and 120 outputs
• Non-biased display OFF function
• Logic system power source ......................... 2.7 V to 5.5 V
• LC power source offset bias can be adjusted relative to the V
• Slim chip shape
• D
.............................................................. Au Bump die
0B
• T
............................................................... TCP
0A
Pad Layout
131
132
155
1
Chip size
Pad pitch
Chip thickness
1) Au Bump Specifications (SED1751D
Au vertical bump
Parallel to Scribe × Perpendicular to Scribe ± Tolerance
60 µm × 75 µm ± 4 µm (Pad No. 1 to 35, 60 to 131)
Bump Size A
80 µm × 50 µm ± 4 µm (Pad No. 36 to 59, 132 to 155)
Bump Size B
17 to 28 µm (The details specified in the acceptance specifications.)
Bump height
MLS Driver Chip Set
Technical Manual
Y
X
12.19 mm × 2.38 mm
80 µm (Min.)
525 µm ± 25 µm
) Reference Values Only
OB
EPSON
= 2.7 to 5.5 V)
CC
and GND levels
DDH
SED1751
60
59
36
35
5–1
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