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I.L. 40-385.1B
4.11 ACCEPTANCE TESTING
The customer should perform the MDAR Accep-
tance Tests (see Appendix I) on receipt of shipment.
4.12 NORMAL PRECAUTIONS
Troubleshooting is not recommended due to the so-
phistication of the Microprocessor unit.
CAUTION
With the exception of checking to insure proper
mating of connectors, or setting jumpers, the fol-
lowing procedures are normally not recommend-
ed. (If there is a problem with the MDAR, it
should be returned to the factory. See PREF-
ACE.)
4.13 DISASSEMBLY PROCEDURES
a. Remove the inner chassis from the outer chassis,
by unscrewing the center lockscrew (on the front
panel), and unsnapping the two covers from the
(optional) FT-14 switches, if the FT-14 switches
are a part of the MDAR system.
NOTE: The inner-chassis (sub-assembly)
slides in and out of the outer chassis
from the front. Mating connectors in-
side the case eliminate the need to
4-6
disconnect external wiring when the
inner chassis is removed.
b. Remove the (optional) FT-14 switches, mounted
by two screws on the side walls.
c. Remove the front panel (with the Display module)
from the inner chassis, by unscrewing four screws
behind the front panel.
d. Remove the Microprocessor module, by loosen-
ing six mounting screws, and unplugging the
module from the Interconnect module.
e. Remove the Option (module), if the option mod-
ule is part of the MDAR system, by unscrewing 2
mounting screws from the center support bar, and
unplugging the Option module from the Intercon-
nect module.
f. Remove the Power Supply and Filter modules, by
first removing the Microprocessor module and the
support cross bar.
g. Remove the Backplate, by unscrewing the
mounting hardware from the rear of the
Backplate.
h. Gain access to the Backplane and Transformer
modules, by removing the Backplate.
(5/92)
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