ABB REL-300 Instruction Leaflet page 83

I.L. 40-385.1B
memory. The latest trip information will be stored in
the "Last Fault" memory, and its LED flashes twice
per second. If FDAT is set at Z2TR, two events
(Zone 2 pickup or trip) will be stored. If FDAT is set
at Z2/Z3, the two events will be either Zone 2 pickup
or Zone 3 pickup or any type of trip. The same de-
scription applies to a remote communication which
can store up to 16 events.
4.5.4 Test Mode (Self-Check Routine)
The software of the MDAR relay contains several
self-check routines (see Section 1.6). When the
"Test" mode is selected by the "Display Select" push-
button, the failure modes (represented by their cor-
responding bits) are shown in the VALUE field, as
follows:
• Bit 0 External RAM Failure
• Bit 1 EEPROM Warning
• Bit 2 ROM Failure
• Bit 3 EEPROM Failure (NON-Volatile memory)
• Bit 4 Analog Input Circuit Failure
• Bit 5 Microprocessor Failure
Data types are as follows:
• bit
• byte = 8 bits
• word = 16 bits
• longword = 32 bits
All bits are expressed in HEX byte form. For exam-
ple, if the display shows "Test 1B", whose binary rep-
resentation is 00011011, this means that the relay
failed the self-check in the area of External RAM (bit
0), EEPROM (one-out-of-three failure, bit 1), (two-
out-of-three failure, bit 3) and Analog Input Circuit
(bit 4). Normally, the test mode should show "Test
0", meaning that the relay has passed the self-check
routines.
When the selector is in TEST mode, scroll the func-
tion field by the Raise pushbutton. The Value field
display shows RS1 (Carrier Receiver #1), RS2 (Car-
rier Receiver #2), RS1, 2 (Carrier Receiver #1 and
#2), and TK (Carrier Send) for the use of MDAR
functional test. Refer to the Pilot Acceptance Test
(Appendix H, Section 1.1.13) for more detailed infor-
mation. If jumper (JP5) on the microprocessor mod-
ule is IN, the following ten functions will be shown:
• TRIP
• BFI
4-4
• AL1
• AL2
• RI1
• RI2
• RB
All of these contact outputs can be tested by press-
ing the "ENTER" pushbutton. (see Appendix I, Sec-
tion 1.13).
4.6 JUMPER CONTROLS
The following jumpers are set at the factory; the cus-
tomer normally does not need to move the jumpers.
Refer to Table 4-4 for the recommended jumper po-
sitions.
4.6.1 Backplane Module
An external jumper should be wired to terminals 13/
14 of switch FT-14.
When switch FT-14/13 or FT-14/14 is opened, the
BFI and RI output relays are deenergized to prevent
BFI and RI contact closures during system function
test.
4.6.2 Interconnect Module
The factory sets jumpers (JMP1 through JMP6 and
JMP13) for 48 Vdc or 125 Vdc input source.
JMP7 & 9 are used for Stub Bus Protection (SBP). If
SBP is not used, move JMP7 & 9 to 8 & 10 position
for the second set of AL2-2 use.
CAUTION
If the customer intends to use a voltage other
than 48 Vdc or 125 Vdc, see Interconnect Module
Schematic, Appendix B.
4.6.3 Microprocessor Module
The following jumpers are normally set during facto-
ry calibration:
• JMP1, JMP8, JMP9
• JMP2
• JMP3, JMP10, JMP11
JMP12
• JMP4
• GS
• SEND
• STOP
for EEPROM and RAM
circuitries, and are nor-
mally set to position 1-2.
normally set to position 2-
3 for standard application.
Set to position 1-2 for pro-
grammable output contact
selection (future applica-
tion).
Not used
set to "IN" for trip contact
with dropout time delay.
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