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Appendix B Package Dimensions
64pin TQFP Package
P-TQFP64-1010-0.50-ZK9
Notes for Mounting the Surface Mount Type Package
The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact ROHM's responsible sales person for the product name, package name,
pin number, package code and desired mounting conditions (reflow method, temperature and times).
ML610471/472/473/Q471/Q472/Q473 User's Manual
Package material
Lead frame material
Lead finish
Solder thickness
Package weight (g)
Rev. No./Last Revised
B-1
Appendix B Package Dimensions
(Unit: mm)
Epoxy resin
Cu alloy
Sn
More than 5μm
0.26typ.
1 / Nov. 10,2011
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