1. Manuals
  2. Brands
  3. LAPIS Semiconductor Manuals
  4. Microcontrollers
  5. ML7345
  6. Hardware design manual

LAPIS Semiconductor ML7345 Series Hardware Design Manual

Hide thumbs Also See for ML7345 Series:
Table of Contents

Advertisement

Quick Links

Download this manual
Dear customer
st
LAPIS Semiconductor Co., Ltd. ("LAPIS Semiconductor"), on the 1
day of October,
2020, implemented the incorporation-type company split (shinsetsu-bunkatsu) in which
LAPIS established a new company, LAPIS Technology Co., Ltd. ("LAPIS
Technology") and LAPIS Technology succeeded LAPIS Semiconductor's LSI business.
Therefore, all references to "LAPIS Semiconductor Co., Ltd.", "LAPIS Semiconductor"
and/or "LAPIS" in this document shall be replaced with "LAPIS Technology Co., Ltd."
Furthermore, there are no changes to the documents relating to our products other than
the company name, the company trademark, logo, etc.
Thank you for your understanding.
LAPIS Technology Co., Ltd.
October 1, 2020

Advertisement

Table of Contents
loading
Need help?

Need help?

Do you have a question about the ML7345 Series and is the answer not in the manual?

Questions and answers

Related Manuals for LAPIS Semiconductor ML7345 Series

Summary of Contents for LAPIS Semiconductor ML7345 Series

  • Page 1 LAPIS established a new company, LAPIS Technology Co., Ltd. (“LAPIS Technology”) and LAPIS Technology succeeded LAPIS Semiconductor’s LSI business. Therefore, all references to "LAPIS Semiconductor Co., Ltd.", "LAPIS Semiconductor" and/or "LAPIS" in this document shall be replaced with "LAPIS Technology Co., Ltd."...
  • Page 2 FEXL7345DG-02 ML7345 Family LSIs Hardware Design Manual Issue Date: Sep,5 , 2019...
  • Page 3 US Export Administration Regulations and the Foreign Exchange and Foreign Trade Act. 13) This document, in part or in whole, may not be reprinted or reproduced without prior consent of LAPIS Semiconductor. Copyright 2018 LAPIS Semiconductor Co., Ltd.
  • Page 4 ML7345 Family LSIs Hardware Design Manual Introduction This hardware design manual contains hardware information that should be referenced when designing ML7345 family devices (Hereafter ML7345). And also contains the measurement conditions and example of measurement results of RF characteristics. Target product： ML7345 ML7345C ML7345D...

  • Page 5: Notation

    ML7345 Family LSIs Hardware Design Manual Notation Classification Notation Description  Numeric value 0xnn Represents a hexadecimal number. 0bnnnn Represents a binary number.  Address 0xnnnn_nnnn Represents a hexadecimal number. (indicates 0xnnnnnnnn)  Unit word, W 1 word = 32 bits byte, B 1 byte = 8 bits Mega, M...

  • Page 6: Table Of Contents

    ML7345 Family LSIs Hardware Design Manual Table of Contents INTRODUCTION .............................II NOTATION ..............................III TABLE OF CONTENTS ..........................IV PLACING DECOUPLING CAPACITORS ....................1 CLOCK INPUT ............................3 2.1......................3 RYSTAL SCILLATOR CIRCUIT 2.1.1. Circuit component values for crystal oscillator circuit ..............3 2.1.2.
  • Page 7 ML7345 Family LSIs Hardware Design Manual...

  • Page 8: Placing Decoupling Capacitors

    ML7345 Family LSIs Hardware Design Manual 1. Placing decoupling capacitors Place decoupling capacitors between each power pins and GND as shown in Figure 1.1. PA_OUT(#20) L3*[1] REG_PA(#21) 1000pF 1μF VDD_PA(#22) PA regulator 0.1µF VDDIO(#9) 0.1µF VDD_REG(#1) 1.5V regulator 0.1µF REG_CORE(#4) Logic circuit 1μF REG_OUT(#3)
  • Page 9 ML7345 Family LSIs Hardware Design Manual Notes the following when placing decoupling capacitors: 1. The VDD and GND traces should be wider than other signal line traces to reduce the resister element. 2. Decoupling capacitor should be placed as close to an LSI pin as possible. 3.

  • Page 10: Clock Input

    1.8 to 3.6 -10～+70℃ EPSON FA-128 100Ω 0Ω YOKETAN S2016A 110Ω 2.7pF 2.7pF 1.8 to 3.6 -10～+70℃ [Note] These component values appropriate for use on the LAPIS Semiconductor’s RF board. It is not guaranteed to obtain same result on your specific board.

  • Page 11: Notes On The Crystal Oscillator Circuit Configuration

    ML7345 Family LSIs Hardware Design Manual 2.1.2. Notes on the crystal oscillator circuit configuration Note the following when designing the crystal oscillator circuit. The capacitors value of C4 and C5 depends on the crystal oscillator specification. C1 and C2 should be placed as close as possible to the XIN (#5) and the XOUT (#6) pins to suppress parasitic LCR and stabilize the oscillator.

  • Page 12: Tcxo Circuit (Ml7345/Ml7345D)

    ML7345 Family LSIs Hardware Design Manual 2.2. TCXO circuit (ML7345/ML7345D) Please use a TCXO that satisfy the following specification.  Output load: 10kΩ//10pF  Output level: 0.8Vpp to 1.5Vpp  Frequency accuracy: below ±10ppm The ML7345 has integrated bias circuit and the DC bias is applied to the TCXO (#6) pin. A 0.1uF capacitor should be placed on the TCXO line as following.

  • Page 13: Pll Loop Filter

    ML7345 Family LSIs Hardware Design Manual 3. PLL loop filter Figure 3.1 shows a configuration example of the PLL loop filter circuit . C3 and R3 values depend on the data rate to satisfy phase noise feature. The recommend values are listed in Table 3.1. It is recommended to select the components with flat temperature characteristics and temperature coefficient is managed.

  • Page 14: Vco

    ML7345 Family LSIs Hardware Design Manual 4. VCO Figure 4.1 shows a configuration example of the VCO tank circuit. VCO oscillator frequency calculated as follows:   2 The L in the above equation will be the sum of the inductor L1, the line inductance of the PCB and the internal inductance of the ML7345.

  • Page 15: Adjusting Component Values For Vco Tank

    33nH N.M. no divide 868MHz 868MHz 4.7nH 3.9pF ML7345D no divide 920MHz 920MHz 4.3nH 3.3pF [Note] These component values appropriate for use on the LAPIS Semiconductor’s RF board. It is not guaranteed to obtain same result on your specific board.

  • Page 16: Note On The Vco Tank Circuit

    ML7345 Family LSIs Hardware Design Manual 4.2. Note on the VCO tank circuit Note the following when designing the VCO tank cercuit. In order to stable VCO oscillation, the VCO tank components (L1 and C1) should be placed as close to the IND1 (#28) and IND2 (#30) pins as possible, recommends within 2 mm.

  • Page 17: Rf Matching Component Values

    19.7 - j62.5 4.6 - j91.2 13.7- j72.5 [Note] These component values appropriate for use on the LAPIS Semiconductor’s RF board. It is not guaranteed to obtain same result on your specific board. 5.1. ANTENNA Tx and Rx direct tie matching circuit Figure 5.1.1 shows the Antenna maching circuit configuraltions.

  • Page 18: Notes On Selecting External Parts (Recommendations)

    ML7345 Family LSIs Hardware Design Manual 6. Notes on selecting external parts (recommendations) 6.1. Anntenna It is recommended to use an antenna with the specifications shown in Table 6.1. Select an antenna with the best directive characteristics for your specific operating, environmental and installation condition.

  • Page 19: Application Circuit(Ml7345/Ml7345C)

    ML7345 Family LSIs Hardware Deaign Manual 8. Application circuit(ML7345) 8.1. 426～433MHz(ML7345/ML7345C) Power Supply 3.3V 10uF 0.1uF 0.1uF 1000pF 1000pF 0.1uF 0.1uF 1000pF 0.1uF Thick line is Zo=50 ohm. VDD_RF VB_EXT VDD_VCO REG_OUT VDD_CP VBG REG_CORE VDD_REG 100pF (25) (31) (32) (27) LNA_P(24) VDDIO(9)

  • Page 20: 868Mh Z (Ml7345/Ml7345C)

    ML7345 Family LSIs Hardware Deaign Manual 8.2. 868MHz(ML7345) Power Supply 3.3V 10uF 0.1uF 0.1uF 1000pF 1000pF 0.1uF 0.1uF 1000pF 0.1uF Thick line is Zo=50 ohm. VDD_RF VB_EXT VDD_VCO REG_OUT VDD_CP VBG REG_CORE VDD_REG 100pF (25) (31) (32) (27) LNA_P(24) VDDIO(9) VDD_PA(22) 0.9pF 11nH...

  • Page 21: 922Mh Z (Ml7345/Ml7345C)

    ML7345 Family LSIs Hardware Deaign Manual 8.3. 922MHz(ML7345) Power Supply 3.3V 10uF 0.1uF 0.1uF 1000pF 1000pF 0.1uF 0.1uF 1000pF 0.1uF Thick line is Zo=50 ohm. VDD_RF VB_EXT VDD_VCO REG_OUT VDD_CP VBG REG_CORE VDD_REG 100pF (25) (31) (32) (27) LNA_P(24) VDDIO(9) VDD_PA(22) 0.9pF 10nH...

  • Page 22: 470～510Mhz(Ml7345C)

    ML7345 Family LSIs Hardware Deaign Manual Power Supply 8.4. 470～510MHz(ML7345C) 3.3V 10uF 0.1uF 0.1uF 1000pF 1000pF 0.1uF 1000pF 0.1uF 0.1uF Thick line is Zo=50 ohm. VDD_RF VB_EXT VDD_VCO REG_OUT VDD_CP VBG REG_CORE VDD_REG 100pF (25) (31) (32) (27) LNA_P(24) VDDIO(9) VDD_PA(22) 1.8pF 27nH...

  • Page 23: Bill Of Materials(Ml7345/Ml7345C)

    ML7345 Family LSIs Hardware Deaign Manual 9. Bill of Materials(ML7345/ML7345C) 9.1 426～433MHz/868MHz/922MHz band (ML7345) 470MHz～490MHz band (ML7345C) The following table shows the bill of materials for 10/20mW transmission circuit for ML7345 at 426～433MHz band 470～510MHz for 100mW transmission circuit for ML7345C at band Common components Value...
  • Page 24 *2: Please refer the Table 4.1.1 in the section 4.1. *3: Please refer the Table 2.1.1 in the section 2.1 *4: Please refer the section 5.1. [Note] These component values are the reference value. LAPIS Semiconductor does not guarantee RF performance..

  • Page 25: Application Circuit(Ml7345D)

    ML7345 Family LSIs Hardware Deaign Manual Power Supply 10. Application circuit(ML7345D) 3.3V 10.1. 426～433MHz (ML7345D) 0.1uF 0.1uF 10uF 0.1uF 1000pF 0.1uF 1000pF 1000pF Thick line is Zo=50 ohm. 0.1uF VDD_RF VB_EXT VDD_VCO REG_OUT VDD_CP VBG REG_CORE VDD_REG 0Ω (25) (31) (32) (27) LNA_P(24)

  • Page 26: 868Mhz(Ml7345D)

    ML7345 Family LSIs Hardware Deaign Manual 10.2. 868MHz(ML7345D) Power Supply 3.3V 10uF 0.1uF 0.1uF 1000pF 1000pF 0.1uF 0.1uF 1000pF Thick line is Zo=50 ohm. 0.1uF VDD_RF VB_EXT VDD_VCO REG_OUT VDD_CP VBG REG_CORE VDD_REG 0Ω (25) (31) (32) (27) LNA_P(24) VDDIO(9) VDD_PA(22) 8.2nH REG_PA(21)

  • Page 27: 922Mhz(Ml7345D)

    ML7345 Family LSIs Hardware Deaign Manual 10.3. 922MHz(ML7345D) Power Supply 3.3V 10uF 0.1uF 0.1uF 1000pF 1000pF 0.1uF 0.1uF 1000pF 0.1uF Thick line is Zo=50 ohm. VDD_RF VB_EXT VDD_VCO REG_OUT VDD_CP VBG REG_CORE VDD_REG 0Ω (25) (31) (32) (27) LNA_P(24) VDDIO(9) VDD_PA(22) 7.5nH REG_PA(21)

  • Page 28: Bill Of Materials(Ml7345D)

    ML7345 Family LSIs Hardware Deaign Manual 11. Bill of Materials(ML7345D) 11.1 426～433MHz/868MHz/922MHz band (ML7345D) The following table shows the bill of materials for 10/20mW transmission circuit for ML7345D at 426～ 433MHz/868MHz/922 band. Common components Value Component Vender Remarks 433MHz 868MHz 922MHz 4.7nH 4.7nH...
  • Page 29 *2: Please refer the Table 4.1.1 in the section 4.1. *3: Please refer the Table 2.1.1 in the section 2.1 *4: Please refer the section 5.1. [Note] These component values are the reference value. LAPIS Semiconductor does not guarantee RF performance..

  • Page 30: Revision History

    ML7345 Family LSIs Hardware Deaign Manual Revision history Page Document No. Release Date Content Before After revision revision – – FEXL7345DG-01 2018.5.8 revision 2.2.TCXO circuit (ML7345/ML7345D) 4.1.Adjusting component values for VCO tank FEXL7345DG-02 2019.9.5 5. RF matching component values table5.1 error correction.

Table of Contents